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Camera module fabrication method including the step of removing a lens mount and window from the mold 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01J-005/02
출원번호 US-0706726 (2007-02-14)
등록번호 US-7332712 (2008-02-19)
발명자 / 주소
  • Webster,Steven
출원인 / 주소
  • Amkor Technology, Inc.
대리인 / 주소
    Gunnison, McKay & Hodgson, L.L.P.
인용정보 피인용 횟수 : 9  인용 특허 : 95

초록

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed thr

대표청구항

I claim: 1. A method of fabricating a camera module comprising: placing a window in a cavity of a first mold half; moving a second mold half into a closed position on the first mold half, wherein the second mold half comprises an extension comprising a base, the base of the second mold half pressin

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이 특허를 인용한 특허 (9)

  1. Das, Rajesh, Camera and method for assembling with fixed final alignment.
  2. Glenn, Thomas P.; Webster, Steven, Camera module with window mechanical attachment.
  3. Xue, Xiaojie; Sengupta, Dipak, Cavity package with composite substrate.
  4. Lu, Chien-Hsin; Wu, Zheng-Yu, Image detecting module and lens module.
  5. Sumi, Shinobu; Ohashi, Takafumi; Mizutani, Yasushi; Sasaki, Kazuhiro, Image inputting apparatus.
  6. Haskett, Bradley Morgan; O'Connor, John Patrick; Miller, Mark Myron; Crowley, Sean Timothy; Miks, Jeffrey Alan; Popovich, Mark Phillip, Micro-optical device packaging system.
  7. Webster, Steven, Molded image sensor package and method.
  8. Webster, Steven, Molded semiconductor package.
  9. Webster, Steven, Molded semiconductor package with snap lid.
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