초록 ▼

A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside

A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.

대표청구항 ▼

We claim: 1. A computing device, comprising: a heat generating component; a microscale synthetic jet to cool the heat generating component, the microscale synthetic jet further comprising: an electrode on the heat generating component; an actuator material over the electrode; a chamber material ove

We claim: 1. A computing device, comprising: a heat generating component; a microscale synthetic jet to cool the heat generating component, the microscale synthetic jet further comprising: an electrode on the heat generating component; an actuator material over the electrode; a chamber material over the actuator material; an orifice and a chamber in the chamber material to form a microscale synthetic jet operable to expel air heated by the heat generating component away from the heat generating component; and a battery to power the computing device. 2. The computing device of claim 1, wherein the microscale synthetic jet comprises an array of microscale synthetic jets. 3. A method of fabricating a cooling device, comprising: forming an electrode on a heat generating component of a mobile device; depositing an actuator material over the electrode; depositing a chamber material over the actuator material; forming a hard mask material over the chamber material and patterning the hard mask material to form orifices of microscale synthetic jets; etching the chamber material, using the hard mask as a pattern, to form chambers of microscale synthetic jets operable to expel heated air away from the cooling device. 4. The method of claim 3, wherein etching the chamber material comprises anisotropically etching silicon. 5. The method of claim 3, wherein depositing an actuator material comprises depositing a piezoelectric material.