IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0374931
(2006-03-13)
|
등록번호 |
US-7342471
(2008-03-11)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
Brinks Hofer Gilson & Lione
|
인용정보 |
피인용 횟수 :
12 인용 특허 :
34 |
초록
▼
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embod
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.
대표청구항
▼
What is claimed is: 1. An apparatus for suppressing the propagation of electromagnetic waves comprising: a first conducting plane; and a second conducting plane, thereby forming a parallel plate waveguide; a first plurality of conducting pads disposed in a substantially periodic array in the region
What is claimed is: 1. An apparatus for suppressing the propagation of electromagnetic waves comprising: a first conducting plane; and a second conducting plane, thereby forming a parallel plate waveguide; a first plurality of conducting pads disposed in a substantially periodic array in the region between the first and second conducting planes; a second plurality of conducting pads disposed in substantially periodic array in the region between the first and second conducting planes; a plurality of conducting vias that couple the first conducting plane to each pad of the first plurality of conducting pads and that couple the second conducting plane to each pad of the second plurality of conducting pads; wherein pairs of conducting pads, selected respectively from the first and second plurality of conducting pads, are facing each other so as to affect their mutual capacitive coupling, thereby forming electromagnetic resonators; and wherein preselected reactances of the resonators effect a desired electromagnetic stop band within the waveguide. 2. The apparatus of claim 1, wherein a quantity, periodicity, inductance, and capacitance of the resonators effects a preselected electromagnetic stop band within the waveguide. 3. The apparatus of claim 1, wherein a first plurality of the resonators is disposed in an array with a first periodicity, and a second plurality of the resonators is disposed in an array with a second periodicity. 4. The apparatus of claim 1, wherein preselected reactances of the resonators form, over desired frequency ranges, electromagnetic shunt circuits between the first and second conducting planes. 5. The apparatus of claim 1, wherein the first and second conducting planes are metallic layers incorporated within a multilayered panel circuit. 6. The apparatus of claim 4, wherein the panel circuit is a printed circuit board and the vias comprise plated holes. 7. The apparatus of claim 4, wherein the panel circuit is an integrated semiconductor chip. 8. The apparatus of claim 4, wherein the panel circuit is a multi-chip module. 9. The apparatus of claim 4, wherein the metallic layers comprise a power distribution network. 10. A method for suppressing the propagation of electromagnetic waves in a parallel plate waveguide comprising the steps of: disposing in a substantially periodic array between adjacent first and second conducting planes of a parallel plate waveguide, first and second pluralities of conducting pads; connecting by means of a plurality of conducting vias each pad of the first plurality of pads to the first conducting plane and each pad of the second plurality of pads to the second conducting plane; proximally disposing pairs of pads from respective first and second facing each other so as to affect their mutual capacitive coupling, thereby forming electromagnetic resonators; and selecting reactances of the resonators so as to effect a desired electromagnetic stop band within the waveguide. 11. The method of claim 10, wherein a quantity, periodicity, inductance, and capacitance of the resonators are selected to effect a desired electromagnetic stop band within the waveguide. 12. The method of claim 10, wherein a first plurality of the resonators is disposed in an array with a first periodicity, and a second plurality of the resonators is disposed in an array with a second periodicity. 13. The method of claim 10, wherein preselected reactances of the resonators form, over desired frequency ranges, electromagnetic shunt circuits between the first and second conducting planes. 14. The method of claim 10, wherein the first and second conducting planes are metallic layers incorporated within a multilayered panel circuit. 15. The method of claim 14, wherein the panel circuit is a printed circuit board and the vias comprise plated holes. 16. The method of claim 14, wherein the panel circuit is an integrated semiconductor chip. 17. The method of claim 14, wherein the panel circuit is a multi-chip module. 18. The method of claim 14, wherein the metallic layers comprise a power distribution network.
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