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In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In va

In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In various embodiments, a vapor compression system may include an evaporator, a compressor, a condenser, and an expansion valve. In some embodiments a separate heat pipe may be placed between the computer component and the evaporator. In various embodiments, a thermo conductive plate may be used to thermally couple the heat pipe to various components including the computer component, evaporator, condenser, and/or heat sink. In some embodiments, a thermo electric module (TEM) may be coupled to various parts of the system.

대표청구항 ▼

What is claimed is: 1. An apparatus for cooling a computer component, comprising: a vapor compression system (VCS), comprising: an evaporator coupled to the computer component; a condenser coupled to the evaporator; a compressor coupled to the evaporator and the condenser; and a thermoelectric modu

What is claimed is: 1. An apparatus for cooling a computer component, comprising: a vapor compression system (VCS), comprising: an evaporator coupled to the computer component; a condenser coupled to the evaporator; a compressor coupled to the evaporator and the condenser; and a thermoelectric module (TEM) comprising a warm side and a cool side; wherein the cool side of the TEM is connected to the condenser; and wherein the cool side of the TEM is operable to absorb heat from the condenser. 2. The apparatus of claim 1, further comprising a heat sink, wherein the warm side of the TEM is connected to the heat sink. 3. The apparatus of claim 1, wherein the TEM is a first TEM, and wherein the apparatus further comprises a second TEM coupled to the computer component and to the evaporator, wherein the cool side of the second TEM is connected to the computer component and the warm side of the second TEM is connected to the evaporator. 4. The apparatus of claim 3, wherein second TEM is embedded in a case securing the computer component. 5. The apparatus of claim 3, wherein the condenser is located along an edge of a computer enclosure and wherein the computer component is not located along the edge of the computer enclosure. 6. The apparatus of claim 3, wherein heat from the computer component is operable to flow from the computer component to the second TEM, then from the second TEM to the evaporator, then from the evaporator to the condenser through a moveable medium, then from the condenser to the first TEM, and then from the first TEM to a heat sink. 7. The apparatus of claim 1, wherein the computer component is an integrated circuit. 8. The apparatus of claim 1, wherein the cool side of the TEM is directly connected to the condenser. 9. An apparatus, comprising: a computer component; a vapor compression system (VCS), comprising: an evaporator coupled to the computer component; a condenser coupled to the evaporator; a compressor coupled to the evaporator and the condenser; a heat sink; a first thermoelectric module (TEM) comprising a warm side and a cool side, wherein the cool side of the first TEM is connected to the condenser and the warm side of the first TEM is connected to the heat sink, and wherein the cool side of the first TEM is operable to absorb heat from the condenser; and a second thermoelectric module (TEM) comprising a warm side and a cool side, wherein the cool side of the second TEM is coupled to the computer component and the warm side of the second TEM is connected to the evaporator. 10. The apparatus of claim 9, wherein second TEM is embedded in a case securing the computer component. 11. The apparatus of claim 9, wherein the condenser is located along an edge of a computer enclosure and wherein the computer component is not located along the edge of the computer enclosure. 12. The apparatus of claim 9, wherein heat from the computer component is operable to flow from the computer component to the second TEM, then from the second TEM to the evaporator, then from the evaporator to the condenser through a moveable medium, then from the condenser to the first TEM, and then from the first TEM to the heat sink. 13. The apparatus of claim 9, wherein the computer component is an integrated circuit. 14. The apparatus of claim 9, wherein the cool side of the first TEM is directly connected to the condenser. 15. The apparatus of claim 9, wherein the warm side of the first TEM is directly connected to the heat sink. 16. A method, comprising: absorbing heat from a computer component into a moveable medium through an evaporator coupled to the computer component; moving the moveable medium to a heat dispersal unit; cooling the moveable medium in a condenser of the heat dispersal unit; and absorbing the heat from the condenser to a thermoelectric module (TEM) connected to the condenser; and wherein the TEM is a first TEM and absorbing heat from the computer component comprises absorbing heat from the computer component to a second TEM coupled to the computer component, wherein the moveable medium absorbs the heat from the second TEM through the evaporator. 17. The method of claim 16, further comprising absorbing heat from the first TEM to a heat sink connected to the first TEM. 18. The method of claim 16, wherein the heat dispersal unit is located along an edge of a computer enclosure and wherein the computer component is not located along the edge of the computer enclosure. 19. The apparatus of claim 16, wherein the computer component is an integrated circuit.