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Overmolded lens over LED die 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0069418 (2005-02-28)
등록번호 US-7344902 (2008-03-18)
발명자 / 주소
  • Basin,Grigoriy
  • West,Robert Scott
  • Martin,Paul S.
  • Harbers,Gerard
  • Smits,Willem H.
  • Hendriks,Robert F. M.
  • Konijn,Frans H.
출원인 / 주소
  • Philips Lumileds Lighting Company, LLC
대리인 / 주소
    Patent Law Group LLP
인용정보 피인용 횟수 : 123  인용 특허 : 1

초록

One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are fil

대표청구항

What is claimed is: 1. A method for forming lenses over a plurality of light emitting diode (LED) dies comprising: providing a plurality of LED dies attached to a single substantially flat top surface of a support structure, the LED dies forming a two-dimensional pattern on the support structure; m

이 특허에 인용된 특허 (1)

  1. Peh, Thomas Kheng Guan; Lye, Chien Chai, Molding apparatus for molding light emitting diode lamps.

이 특허를 인용한 특허 (123)

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