Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01R-031/02
G01R-031/302
G01R-031/28
G01R-031/308
출원번호
US-0216645
(2005-08-31)
등록번호
US-7348786
(2008-03-25)
발명자
/ 주소
Thacker,Hiren D.
Ogunsola,Oluwafemi O.
Meindl,James D.
출원인 / 주소
Georgia Tech Research Corporation
대리인 / 주소
Thomas, Kayden, Horstemeyer & Risley, LLP
인용정보
피인용 횟수 :
16인용 특허 :
63
초록▼
Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative
Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative to test at least one signal of at least one optoelectronic device under test. The probe substrate is operative to interface with electrical and optical components.
대표청구항▼
The invention claimed is: 1. A probe module, comprising: a redistribution substrate; and a probe substrate interfaced with the redistribution substrate, wherein the probe substrate includes at least a first probe element to test an electrical signal and at least a second probe element to test an op
The invention claimed is: 1. A probe module, comprising: a redistribution substrate; and a probe substrate interfaced with the redistribution substrate, wherein the probe substrate includes at least a first probe element to test an electrical signal and at least a second probe element to test an optical signal of an optoelectronic device under test, wherein the probe elements are configured with cantilever arms, wherein the probe substrate is operative to test at least one signal of at least one optoelectronic device under test. 2. The probe module of claim 1, wherein the probe substrate includes a distribution network including at least one structure for distributing at least one signal, wherein the signal is selected from: an electrical signal, an optical signal, and combinations thereof. 3. The probe module of claim 1, wherein the cantilever arms are angled. 4. The probe module of claim 1, wherein the cantilever arms are made of a non-conductive material. 5. The probe module of claim 1, wherein the cantilever arms are conductive. 6. A probe module, comprising: a redistribution substrate; and a probe substrate interfaced with the redistribution substrate, wherein the probe substrate is operative to test at least one signal of at least one optoelectronic device under test, wherein the probe substrate is operative to interface with electrical and optical components, wherein the probe substrate includes at least one probe element and a distribution network including at least one structure for distributing the optical signal, and wherein the probe elements are configured with polymer pillars. 7. The probe module of claim 6, wherein the signal is selected from: an electrical signal, an optical signal, and combinations thereof. 8. The probe module of claim 6, wherein the probe substrate is a replaceable component. 9. The probe module of claim 6, wherein the probe substrate is operative to test the signals of at least two optoelectronic devices under test. 10. The probe module of claim 6, wherein the probe element is configured with cantilever arms. 11. The probe module of claim 10, wherein the cantilever arms are angled. 12. The probe module of claim 10, wherein the cantilever arms are made of a non-conductive material. 13. The probe module of claim 10, wherein the cantilever arms are conductive. 14. The probe module of claim 6, wherein the structure for distribution of an optical signal includes a waveguide. 15. The probe module of claim 6, wherein the structure for distribution of the optical signal is located on the same side of the probe substrate as the probe elements. 16. The probe module of claim 6, wherein the probe substrate is configured to allow optical signals to pass through the substrate. 17. The probe module of claim 16, wherein the probe substrate is configured with at least one through-hole to allow optical signals to pass through the substrate. 18. The probe module of claim 17, wherein the through-hole has a metal lining on the walls of the through-hole. 19. The probe module of claim 17, wherein the through-hole is filled with an optically transparent material. 20. The probe module of claim 16, wherein the structure for distribution of the optical signal is located on the side of the probe substrate opposite the probe elements. 21. The probe module of claim 6, wherein the redistribution substrate includes a distribution network including at least one structure for distributing the optical signal. 22. The probe module of claim 21, wherein the structure for distribution of the optical signal includes a waveguide. 23. The probe module of claim 6, wherein the signal is distributed between the probe substrate and a test equipment interface. 24. The probe module of claim 23, wherein the signal is an optical signal, wherein the optical signal is guided between the probe substrate and the redistribution substrate by at least one polymer pillar. 25. The probe module of claim 23, wherein the signal is an optical signal, wherein the optical signal is guided between the probe substrate and the test equipment interface by an optical fiber. 26. The probe module of claim 23, wherein the signal is an optical signal, wherein the optical signal is guided between the redistribution substrate and the test equipment interface by an optical fiber.
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