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Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/02
  • G01R-031/302
  • G01R-031/28
  • G01R-031/308
출원번호 US-0216645 (2005-08-31)
등록번호 US-7348786 (2008-03-25)
발명자 / 주소
  • Thacker,Hiren D.
  • Ogunsola,Oluwafemi O.
  • Meindl,James D.
출원인 / 주소
  • Georgia Tech Research Corporation
대리인 / 주소
    Thomas, Kayden, Horstemeyer & Risley, LLP
인용정보 피인용 횟수 : 16  인용 특허 : 63

초록

Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative

대표청구항

The invention claimed is: 1. A probe module, comprising: a redistribution substrate; and a probe substrate interfaced with the redistribution substrate, wherein the probe substrate includes at least a first probe element to test an electrical signal and at least a second probe element to test an op

이 특허에 인용된 특허 (63)

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  48. Mayer Klaus-Michael (Gerlingen DEX), Optical polymer element for coupling photoelements onto integrated-optical circuits.
  49. Kennon Jerry M. (Wake NC) Via Ronald B. (Wake NC), Optical probe test port.
  50. Bloom Cary, Optical switching assembly for testing fiber optic device.
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  55. Watts Michael P. C. (Portola Valley CA) Hendler Lawrence (Cupertino CA), Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane.
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이 특허를 인용한 특허 (16)

  1. Smith, Stephen William, Apparatus for high density low cost automatic test applications.
  2. Spinner, Robert; Levi, Eli; Engel, Richard, Common chassis for instrumentation.
  3. Barwicz, Tymon; Boyer, Nicolas; Brouilette, Guy; Fortier, Paul F.; Harel, Stephane; Thivierge, Roch, Component assembly apparatus.
  4. Hara, Hideo; Masuda, Shin, Device interface apparatus, test apparatus, and test method.
  5. Engel, Richard; Spinner, Robert; Levi, Eli, Instrumentation chassis within a module.
  6. Juenemann, Ralf; Bayer, Alexander; Freissl, Michael; Evers, Christian, Measuring coupler using strip conductor technology.
  7. Zelder, Thomas; Geck, Bernd, Measuring system for determining scatter parameters.
  8. Bieck, Florian, Method and apparatus for testing a semiconductor wafer.
  9. Ridder, Trent; ver Steeg, Ben; Mills, Mike, Method of making optical probes for non-invasive analyte measurements.
  10. Engel, Richard; Levi, Eli; Spinner, Robert; Leddy, Thomas, Multi-standard instrumentation chassis.
  11. Engel, Richard; Levi, Eli; Spinner, Robert; Leddy, Thomas, Multi-standard instrumentation chassis.
  12. Kim, Sang-Hoon; Yoo, Je-Gwang; Kim, Joon-Sung; Cho, Han Seo, Printed circuit board and manufacturing method thereof.
  13. Kim, Sang-Hoon; Yoo, Je-Gwang; Kim, Joon-Sung; Cho, Han Seo, Printed circuit board and manufacturing method thereof.
  14. Kim,Sang Hoon; Yoo,Je Gwang; Kim,Joon Sung; Cho,Han Seo, Printed circuit board and manufacturing method thereof.
  15. Bolt, Bryan Conrad; Frankel, Joseph George, Probes with fiducial marks, probe systems including the same, and associated methods.
  16. Masuda, Shin, Test apparatus having optical interface and test method.
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