초록 ▼

A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Appar

A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Apparatus, in accordance with the invention, for precise working of material, particularly organic tissue comprising a pulsed laser, wherein the laser has a pulse length between 50 fs and 1 ps and with a pulse frequency of from 50 kHz to 1 MHz is also described.

대표청구항 ▼

The invention claimed is: 1. A method for precise working of material, particularly organic tissue, comprising the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on th

The invention claimed is: 1. A method for precise working of material, particularly organic tissue, comprising the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked, wherein the laser pulses are focused on or in the material and the focal points are guided in three dimensions, and the focus points are guided in such a way that a flat or three-dimensional cohesive cut surface is generated in the material wherein a second cut surface is generated in the material and, together with a first cut surface, surrounds an essentially lens-shaped portion of material. 2. The method for precise working of material according to claim 1, wherein the energy of the individual pulses is between 100 nJ and 5 μJ. 3. The method for precise working of material according to claim 1, wherein additional cut surfaces are generated in the severed portion of material. 4. The method for precise working of material according to claim 1, wherein the portion of material is extracted from the material through the at least one cut. 5. The method for precise working of material according to claim 4, wherein the material portion is divided into small fragments and the extraction of these fragments is carried out by a suction/rinsing device. 6. The method for precise working of material according to claim 1, wherein the time interval between the laser pulses is varied depending upon the location of the focus point. 7. The method for precise working of material according to claim 1, wherein the speed at which the focus points are guided is varied depending upon the location of the focus points.