[특허]Modular computer system mechanical interconnection

Sun Microsystems, Inc.

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특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Modular computer system mechanical interconnection

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-001/00 H05K-001/18 H05K-007/02 H05K-007/06 H05K-007/08
미국특허분류(USC)	361/748; 361/790; 361/803
출원번호	US-0910472 (2004-08-03)
등록번호	US-7352589 (2008-04-01)
발명자 / 주소	Clidaras,Jimmy Kitlas,Kenneth
출원인 / 주소	Sun Microsystems, Inc.
대리인 / 주소	Meyertons Hood Kivlin Kowert & Goetzel, P.C.
인용정보	피인용 횟수 : 2 인용 특허 : 38

초록

A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.

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What is claimed is: 1. A modular computer system, comprising: a primary chassis; a motherboard disposed in the primary chassis and having an electrical connector; a secondary chassis fastened to the primary chassis; an external device disposed in the secondary chassis and having an electrical connector; and a bridgeboard having a first electrical connector interconnected with the motherboard electrical connector and a second electrical connector interconnected with the external device electrical connector; wherein the bridgeboard comprises a bridge chip configured to transfer communications between the motherboard and the external device. 2. The modular computer system, according to claim 1, wherein the motherboard is located in a predetermined position in the primary chassis. 3. The modular computer system, according to claim 1, wherein a location of the bridgeboard with respect to the primary chassis and the secondary chassis is determined by a location of the motherboard in the primary chassis. 4. The modular computer system, according to claim 1, wherein a location of the external device in the secondary chassis is determined by a location of the bridgeboard. 5. The modular computer system, according to claim 1, wherein the bridgeboard further comprises a locating pin and the external device further comprises a locating block having a recess therein operable to receive the locating pin. 6. The modular computer system, according to claim 1, wherein the motherboard further comprises a main portion and a flexible circuit interconnecting the main portion and the motherboard electrical connector, the modular computer system further comprising: a guide pin affached to the primary chassis; and a guide block having a recess theretbrough and attached to the motherboard electrical connector, wherein the recess is operable to receive the guide pin so that the guide block is capable of sliding along the guide pin. 7. The modular computer system, according to claim 1, wherein the external device further comprises a main portion and a flexible circuit interconnecting the main portion and the external device electrical connector, the modular computer system further comprising: a guide pin attached to the primary chassis; and a guide block having a recess therethrough and attached to the motherboard electrical connector, wherein the recess is operable to receive the guide pin so that the guide block is capable of sliding along the guide pin. 8. The modular computer system, according to claim 1, wherein the bridgeboard further comprises a main portion, a connector board, and a flexible circuit, wherein the main portion and the connector board are interconnected via the flexible circuit and the first connector is electrically connected to the connector board, the modular computer system further comprising: a guide pin attached to the secondary chassis; and a guide block having a recess therethrough and attached to the connector board, wherein the recess is operable to receive the guide pin so that the guide block is capable of sliding along the guide pin. 9. The modular computer system, according to claim 1, wherein the bridge chip is configured to transmit communications to the motherboard at a different rate than the communications were received from the external device. 10. The modular computer system, according to claim 1, wherein the bridge chip is configured to transmit communications to the external device at a different rate than the communications were received from the motherboard. 11. The modular computer system, according to claim 1, wherein the bridge chip is configured to transmit communications to the external device in a different protocol than a protocol of the communications received from the motherboard. 12. The modular computer system, according to claim 1, wherein the primary chassis substantially encloses the motherboard and wherein the secondary chassis substantially encloses the external device. 13. The modular computer system, according to claim 1, wherein the bridgeboard is substantially planar and wherein the bridgeboard is coupled to the motherboard and the external device through edge connectors; and wherein a planar face of the motherboard and a planar face of the external device are substantially perpendicular to the bridgeboard when the motherboard and external device are coupled to the bridgeboard through the edge connectors. 14. The modular computer system, according to claim 1, wherein the bridge chip interconnects a high speed bus on the motherboard and a high speed bus on the external device. 15. A modular computer system, comprising: a primary chassis; a motherboard disposed in the primary chassis and having an electrical connector; a secondary chassis fastened to the primary chassis; an external device disposed in the secondary chassis and having an electrical connector; and a bridgeboard having a first electrical connector interconnected with the motherboard electrical connector and a second electrical connector interconnected with the external device electrical connector; wherein the bridgeboard comprises a bridge chip configured to transfer communications between the motherboard and the external device; wherein the bridgeboard further comprises a main portion, a connector board, and a flexible circuit, wherein the main portion and the connector board are interconnected via the flexible circuit and the second connector is electrically connected to the connector board, the modular computer system further comprising: a guide pin attached to the secondary chassis; and a guide block having a recess therethrough and attached to the connector board, wherein the recess is operable to receive the guide pin so that the guide block is capable of sliding along the guide pin. 16. The modular computer system, according to claim 15, wherein the bridgeboard further comprises a backplate for inhibiting emissions of electromagnetic waves from the computer system. 17. The modular computer system, according to claim 16, further comprising a stop block disposed between the connector board and the backplate and attached to the backplate to support the connector board, wherein the connector board is capable of sliding along a surface of the stop block. 18. A modular computer system, comprising: a primary chassis; a motherboard disposed in the primary chassis and having an electrical connector; a secondary chassis fastened to the primary chassis; an external device disposed in the secondary chassis and having an electrical connector; and a bridgeboard having a first electrical connector interconnected with the motherboard electrical connector and a second electrical connector interconnected with the external device electrical connector; wherein the bridgeboard comprises a bridge chip configured to transfer communications between the motherboard and the external device; wherein the bridge chip is configured to transmit communications to the motherboard in a different protocol than a protocol of the communications received from the external device.

이 특허에 인용된 특허 (38)

이 특허를 인용한 특허 피인용횟수: 2

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특허 상세정보

Modular computer system mechanical interconnection

초록

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이 특허에 인용된 특허 (38)

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특허 상세정보

Modular computer system mechanical interconnection

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이 특허에 인용된 특허 (38)

이 특허를 인용한 특허 피인용횟수: 2

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IPC 상세정보(version : 201201)

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