Methods and systems for optical and non-optical measurements of a substrate
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01B-011/00
출원번호
US-0063228
(2005-02-22)
등록번호
US-7355709
(2008-04-08)
발명자
/ 주소
Bevis,Christopher F.
Dickerson,Gary
출원인 / 주소
KLA Tencor Technologies Corp.
대리인 / 주소
Baker & McKenzie LLP
인용정보
피인용 횟수 :
1인용 특허 :
37
초록▼
Methods and systems for measurements of a substrate are provided. One system includes a non-optical subsystem configured to perform first measurements on a substrate. The system also includes an optical subsystem coupled to the non-optical subsystem. The optical subsystem is configured to perform s
Methods and systems for measurements of a substrate are provided. One system includes a non-optical subsystem configured to perform first measurements on a substrate. The system also includes an optical subsystem coupled to the non-optical subsystem. The optical subsystem is configured to perform second measurements on the substrate. In addition, the system includes a processor coupled to the subsystems. The processor is configured to calibrate one of the subsystems using the measurements performed by the other subsystem. One method includes performing first measurements on a substrate using a non-optical subsystem and performing second measurements on the substrate using an optical subsystem that is coupled to the non-optical subsystem. The method also includes calibrating one of the subsystems using the measurements performed by the other subsystem.
대표청구항▼
What is claimed is: 1. A system configured for measurement of a substrate, comprising: a non-optical subsystem configured to perform first measurements on the substrate; an optical subsystem coupled to the non-optical subsystem, wherein the optical subsystem is configured to perform second measurem
What is claimed is: 1. A system configured for measurement of a substrate, comprising: a non-optical subsystem configured to perform first measurements on the substrate; an optical subsystem coupled to the non-optical subsystem, wherein the optical subsystem is configured to perform second measurements on the substrate; and a processor coupled to the non-optical subsystem and the optical subsystem, wherein the processor is configured to calibrate one of the subsystems using the measurements performed by the other subsystem, and wherein the processor is further configured to use one of the measurements to determine if the other measurements will be performed. 2. The system of claim 1, wherein the optical subsystem is further configured as a scatterometer, a reflectometer, an ellipsometer, a polarized reflectometer, an interferometer, a spectroscopic reflectometer, a spectroscopic ellipsometer, a spectroscopic scatterometer, or some combination thereof. 3. The system of claim 1, wherein the non-optical subsystem is further configured as a scanning electron microscope. 4. The system of claim 1, wherein the processor is further configured to calibrate a different measurement system using the first measurements, the second measurements, or a combination thereof. 5. The system of claim 1, wherein the processor is further configured to monitor one or more parameters of the non-optical subsystem using the first and second measurements. 6. The system of claim 1, wherein the processor is further configured to monitor one or more parameters of the optical subsystem using the first and second measurements. 7. The system of claim 1, wherein the processor is further configured to alter one or more parameters of the non-optical subsystem using the first and second measurements. 8. The system of claim 1, wherein the processor is further configured to alter one or more parameters of the optical subsystem using the first and second measurements. 9. The system of claim 1, wherein the first and second measurements are performed on a feature of the substrate that is optimized for the first and second measurements. 10. The system of claim 9, wherein the feature comprises a target having repeating structures. 11. The system of claim 1, wherein the first measurements are performed on a first feature of the substrate that is optimized for the first measurements, and wherein the second measurements are performed on a second feature of the substrate that is optimized for the second measurements. 12. The system of claim 11, wherein the second feature comprises a target having grating structures. 13. The system of claim 1, wherein the processor is further configured to determine which of the subsystems is optimal for measuring a characteristic of a feature on the substrate and to route the substrate to the subsystem determined to be optimal. 14. The system of claim 1, wherein the processor is further configured to use one of the measurements to determine a site on the substrate at which the other measurements are to be performed. 15. The system of claim 1, wherein the optical subsystem is further coupled to a substrate handler of the non-optical subsystem. 16. The system of claim 1, wherein the optical subsystem is further coupled to a vacuum chamber of the non-optical subsystem. 17. The system of claim 1, wherein the optical subsystem is further coupled to the non-optical subsystem by a transmission medium. 18. A method for measuring a substrate, comprising: performing first measurements on the substrate using a non-optical subsystem; performing second measurements on the substrate using an optical subsystem, wherein the optical subsystem is coupled to the non-optical subsystem; calibrating one of the subsystems using the measurements performed by the other subsystem; and using one of the measurements to determine if the other measurements will be performed. 19. A computer-implemented method for calibrating a system, comprising: calibrating a first subsystem of the system using measurements performed on a substrate by a second subsystem of the system, wherein one of the subsystems comprises a non-optical subsystem, and wherein the other subsystem comprises an optical subsystem; and using measurements of one of the subsystems to determine if measurements of the other subsystem will be performed.
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