$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Electroplating composite substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-003/60
  • C25D-003/32
  • C25D-003/30
출원번호 US-0913936 (2004-08-06)
등록번호 US-7357853 (2008-04-15)
발명자 / 주소
  • Toben,Michael P.
  • Brown,Neil D.
  • Chirafisi,Angelo
출원인 / 주소
  • Rohm and Haas Electronic Materials LLC
대리인 / 주소
    Piskorski,John J.
인용정보 피인용 횟수 : 0  인용 특허 : 36

초록

An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

대표청구항

What is claimed is: 1. A composition consisting essentially of one or more sources of tin, the source of tin consists of stannous organic sulfonate, stannous sulfate, stannous gluconate, stannous citrate, stannous lactate, stannous halide or mixtures thereof; at least one surfactant which is an alc

이 특허에 인용된 특허 (36)

  1. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  2. Nobel Fred I. (Sands Point NY) Schram David N. (Freeport NY), Bath and process for plating tin-lead alloys.
  3. Nobel Fred I. (Sands Point NY) Schram David N. (Freeport NY), Bath and process for plating tin/lead alloys on composite substrates.
  4. Popescu Francine (32 ; rue E. Dolet 94100 Saint Maur FRX), Bright tin electroplating bath.
  5. Hideki Yokoyama JP; Takaya Ishigaki JP; Akira Sasaki JP; Shintarou Kon JP; Tetuji Maruno JP, Ceramic electronic component having electronic component containing cuprous oxide.
  6. Ivey Douglas Gordon,CAX ; Sun Wenzhen,CAX, Codepositing of gold-tin alloys.
  7. Pease Jacqueline K. (Jacksonville FL) Dreisbach David D. (Jacksonville FL), Concentrated high flash point surfactant compositions.
  8. McCormack, Mark Thomas; Jiang, Hunt Hang; Beilin, Solomon I.; Chan, Albert Wong; Takahashi, Yasuhito, Conductive composition.
  9. Nakaso Akishi (Oyama JPX) Oginuma Kaoru (Mito JPX) Shimazaki Takeshi (Hitachi JPX) Takahashi Akio (Shimodate JPX), Electroless plating process.
  10. Toben Michael P. ; Marcktell Daniel C. ; Brown Neil D. ; Doyle Colleen A., Electrolyte and tin-silver electroplating process.
  11. Masaaki Ishiyama JP, Functional Sn-Bi alloy plating using a substitute material for Pb.
  12. Wen Sheree Hsiao-Ru ; Wood Carl Stephen, Interface regions between metal and ceramic in a metal/ceramic substrate.
  13. Gillman, Hyman D.; Fernandes, Brenda; Wikiel, Kazimierz, Metal alloy sulfate electroplating baths.
  14. De Luca Michael A. (Holbrook NY) McCormack John F. (Roslyn Heights NY), Metallization of ceramics.
  15. DeLuca Michael A. (Holbrook NY) McCormack John F. (Roslyn Heights NY), Metallization of ceramics.
  16. Motoki, Akihiro; Higuchi, Shoichi; Takano, Yoshihiko; Hamada, Kunihiko, Method for plating electrodes of ceramic chip electronic components.
  17. Opaskar Vince (Cleveland Hts. OH) Canaris Valerie (Parma OH) Willis William J. (North Royalton OH), Plating bath and method for electroplating tin and/or lead.
  18. Vincent C. Opaskar ; Lee Desmond Capper GB, Plating bath and method for electroplating tin-zinc alloys.
  19. Kuo Yeong-Jen (Kingsport TN) Bellas Michael (Kingsport TN), Preparation of quinones.
  20. Schmidt Karl-Jrgen (Solingen DEX) Knaak Eberhard (Langenfeld DEX), Process and electrolyte for depositing lead and lead-containing layers.
  21. Nobel Fred I. (Sands Point NY) Ostrow Barnet D. (Roslyn NY) Schram David N. (Freeport NY), Process and electrolyte for electroplating tin, lead or tin-lead alloys.
  22. DeLuca Michael A. (Holbrook NY) McCormack John F. (Roslyn Heights NY) Oleske Peter J. (Rocky Point NY), Process for avoiding blister formation in electroless metallization of ceramic substrates.
  23. Nobel Fred I. (Sands Point NY) Ostrow Barnet (Roslyn NY) Schram David N. (Freeport NY), Process for electroplating tin, lead and tin-lead alloys and baths therefor.
  24. Junichi Saitoh JP; Tatsuo Kunishi JP; Yukio Hamaji JP, Sn-Bi alloy plating bath and method of plating using the same.
  25. Sakurai Hitoshi,JPX ; Saito Ayumi,JPX ; Date Mayumi,JPX ; Mita Osamu,JPX, Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film.
  26. Sajja Vijay M. (Fremont CA) Mathew Ranjan (San Jose CA) Belane Jagdish (Cupertino CA), Solder plating process and semiconductor product.
  27. DeLuca Michael A. (Holbrook NY) McCormack John F. (Roslyn Heights NY), Surface preparation of ceramic substrates for metallization.
  28. Moon Sungsoo,KRX ITX 617-020, Tin alloy plating compositions.
  29. Brown Neil D. ; Federman George A. ; Chirafisi Angelo B. ; Lai Gregory, Tin electrolyte.
  30. O'Driscoll Cavan Hugh,GBX, Tin plating electrolyte compositions.
  31. O'Driscoll Cavan Hugh,GBX, Tin plating electrolyte compositions.
  32. Shimauchi Hidenori (Takatsuki JPX) Suzuki Keijiro (Tokyo JPX), Tin whisker-free tin or tin alloy plated article and coating technique thereof.
  33. Yanada, Isamu; Tsujimoto, Masanobu; Okada, Tetsurou; Oka, Teruya; Tsubokura, Hideyuki, Tin-copper alloy electroplating bath.
  34. Tsunoda Kyoko,JPX ; Tamura Takaaki,JPX, Tin-indium alloy electroplating solution.
  35. Yanada Isamu,JPX ; Tsujimoto Masanobu,JPX, Tin-silver alloy electroplating bath and tin-silver alloy electroplating process.
  36. Sakurai Hitoshi (Matsudo JPX) Ohnuma Tadahiro (Funabashi JPX), Tin-zinc alloy electroplating bath and method for electroplating using the same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로