초록 ▼

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.

대표청구항 ▼

What is claimed is: 1. A modular processing system for mounting in a multi-tiered support, comprising: a chassis configured for mounting in the multi-tiered support; a plurality of components within the chassis; and a cooling system including a reconfigurable plenum and a blower, the blower being c

What is claimed is: 1. A modular processing system for mounting in a multi-tiered support, comprising: a chassis configured for mounting in the multi-tiered support; a plurality of components within the chassis; and a cooling system including a reconfigurable plenum and a blower, the blower being configured to pressurize the plenum; wherein the plenum defines a plurality of orifices in the chassis, each orifice of the plurality of orifices being configured to direct pressurized air from the plenum to flow toward a respective component of the plurality of components; and wherein the plenum comprises: a tube defining a first orifice of the plurality of orifices, the tube being cantilevered and bendable enough to be adjustable such that the first orifice can be reconfigured to direct pressurized air toward components at different locations within the chassis. 2. The modular processing system of claim 1, and further comprising: a controller configured to actively control the heat dissipation from the plurality of components provided by the cooling system during operation of the cooling system so as to control the relative flow rate of at least one component relative to the other components. 3. The modular processing system of claim 2, wherein the controller is configured to control the operation of the cooling system based on the cooling needs of the components toward which the orifices direct air. 4. The modular processing system of claim 2, wherein the controller is configured to control the air pressure within the plenum. 5. The modular processing system of claim 2, wherein the controller is configured to control the power level at which the blower operates. 6. The modular processing system of claim 2, and further comprising a second blower, wherein the controller is configured to selectively control the power levels at which the blowers operate. 7. The modular processing system of claim 2, wherein: the plenum includes an adjustable valve configured to controllably limit airflow from a first orifice of the plurality of orifices; and the controller is configured to control the valve. 8. The modular processing system of claim 7, wherein the adjustable valve can be closed to substantially prevent airflow from the first orifice. 9. The modular processing system of claim 2, wherein: the plenum includes a system of adjustable valves configured to separately and adjustably control the airflow from a first orifice and a second orifice of the plurality of orifices; and the controller is configured to control the system of adjustable valves. 10. The modular processing system of claim 9, wherein the controller is further configured to control air pressure within the plenum. 11. A modular processing system for mounting in a multi tiered support, comprising: a chassis configured for mounting in the multi tiered support; a plurality of components within the chassis; and a reconfigurable means for directing air to flow from a pressurized plenum toward one component of the plurality of components; wherein the reconfigurable means for directing is configured with a passageway of an adjustable configuration that allows an open end of the passageway to be positionally changed to adjustably direct air toward different locations within the chassis. 12. A modular processing system for mounting in a multi tiered support, comprising: a chassis configured for mounting in the multi tiered support; a plurality of electronic assemblies on a front side of the chassis; a blower not on the front side of the chassis; and an intake manifold having a front panel at the front side of the chassis; wherein the intake manifold forms a chamber, the intake manifold front panel defines intake air vents in fluid communication with the chamber, and the intake manifold defines a blower port in fluid communication with the chamber such that the intake manifold is configured to place the exterior of the chassis in fluid communication with the blower; and wherein the intake manifold front panel extends across one or more of the plurality of electronic assemblies. 13. The modular processing system of claim 12, wherein the intake manifold front panel extends across the chassis front side. 14. The modular processing system of claim 12, and further comprising a second blower, wherein the intake manifold further defines a second blower port in fluid communication with the chamber such that the intake manifold is configured to place the exterior of the chassis in fluid communication with the second blower. 15. The modular processing system of claim 12, and further comprising a distribution plenum configured to receive air from the blower and to distribute the received air to components within the chassis. 16. The modular processing system of claim 12, wherein the chassis is a 1U chassis.