IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0902005
(2004-07-30)
|
등록번호 |
US-7365938
(2008-04-29)
|
우선권정보 |
KR-10-2003-0058002(2003-08-21) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Samsung Electronics Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
11 |
초록
▼
A disk drive having a base member, including: a printed circuit board installed on a rear surface of the base member, on which at least one chip is mounted; a first insulation panel arranged between the base member and the printed circuit board; at least one heat conductive plate arranged between th
A disk drive having a base member, including: a printed circuit board installed on a rear surface of the base member, on which at least one chip is mounted; a first insulation panel arranged between the base member and the printed circuit board; at least one heat conductive plate arranged between the first insulation panel and the printed circuit board to absorb and transfer heat generated by the at least one chip; and a heat dissipative plate connected to the heat conductive plate and exposed to an outside of the disk drive to dissipate the heat transferred through the heat conductive plate.
대표청구항
▼
What is claimed is: 1. A disk drive having a base member, comprising: a printed circuit board installed on a rear surface of the base member, on which at least one chip is mounted; a first insulation panel arranged between the base member and the printed circuit board; at least one heat conductive
What is claimed is: 1. A disk drive having a base member, comprising: a printed circuit board installed on a rear surface of the base member, on which at least one chip is mounted; a first insulation panel arranged between the base member and the printed circuit board; at least one heat conductive plate arranged between the first insulation panel and the printed circuit board to absorb and transfer heat generated by the at least one chip; and a heat dissipative plate connected to the heat conductive plate and exposed to an outside of the disk drive to dissipate the heat transferred through the heat conductive plate; wherein the heat dissipative plate extends vertically from an edge portion of the at least one heat conductive plate over an edge of the printed circuit board, preventing contact with the circuit board. 2. The disk drive as claimed in claim 1, wherein the at least one chip is more than one, and wherein a heat conductive plate connected to a heat dissipative plate is provided for each of the chips. 3. The disk drive as claimed in claim 1, wherein the at least one heat conductive plate substantially covers an upper surface of the printed circuit board opposite the rear surface. 4. The disk drive as claimed in claim 3, further comprising a second insulation panel arranged between each of the heat conductive plates and the printed circuit board. 5. The disk drive as claimed in claim 4, wherein at least one insertion hole, in which the chip is inserted, is formed in the second insulation panel and each heat conductive plate contacts the at least one chip through the at least one insertion hole. 6. The disk drive as claimed in claim 4, wherein the first insulation panel and the second insulation panel are attached to sides of each heat conductive plate. 7. The disk drive as claimed in claim 1, wherein the heat dissipative plate is exposed from a side surface of the disk drive. 8. The disk drive as claimed in claim 1, wherein the at least one heat conductive plate and the dissipative plate is made of a metal having a high thermal conductivity coefficient. 9. The disk drive as claimed in claim 1, wherein the first portion contacts a surface of the at least one chip. 10. A disk drive having a base member, comprising: a printed circuit board installed on a rear surface of the base member, on which at least one chip is mounted; a first insulation panel arranged between the base member and the printed circuit board; at least one heat conductive plate arranged between the first insulation panel and the printed circuit board to absorb and transfer heat generated by the at least one chip; and a heat dissipative plate connected to the heat conductive plate and exposed to an outside of the disk drive to dissipate the heat transferred through the heat conductive plate, wherein the heat dissipative plate is arranged on a rear surface of the printed circuit board and the at least one heat conductive plate and the heat dissipative plate are connected by a connection member, and wherein a connection hole is formed in the printed circuit board and the connection member is disposed in the connection hole. 11. The disk drive as claimed in claim 10, wherein the connection hole is formed in the printed circuit board, and the connection hole and the heat dissipative plate are located at an empty space of the circuit board. 12. A disk drive having a base member, comprising: a printed circuit board having at least one chip; a first insulation panel arranged between the base member and the printed circuit board; and a heat sink which absorbs and dissipates heat generated by the at least one chip, the heat sink including a first portion disposed between the printed circuit board and the insulation panel to absorb heat and a second portion connected to the first portion and exposed to an outside of the disk drive to dissipate the absorbed heat, wherein the second portion extends vertically from an edge portion of the first portion over an edge of the printed circuit board, preventing contact with the circuit board. 13. The disk drive as claimed in claim 12, wherein the first portion contacts a surface of the at least one chip. 14. A disk drive having a base member, comprising: a printed circuit board having at least one chip; a first insulation panel arranged between the base member and the printed circuit board; and a heat sink which absorbs and dissipates heat generated by the at least one chip, the heat sink including a first portion disposed between the printed circuit board and the insulation panel to absorb heat and a second portion connected to the first portion and exposed to an outside of the disk drive to dissipate the absorbed heat, wherein the at least one chip is on a first side of the printed circuit board, the second portion is on a second side of the printed circuit board, and the heat sink includes a connecting portion which connects the first and second portions and extends through the printed circuit board. 15. A disk drive having a base member, comprising: a printed circuit board having at least one chip; a first insulation panel disposed between the base member and the printed circuit board; a second insulation panel disposed between the first insulation panel and the printed circuit board, the second insulation panel having at least one insertion hole, one for each chip, to accommodate the at least one chip; and a heat sink disposed between the insulation panels and which absorbs and dissipates heat generated by the at least one chip, the heat sink including a first portion to absorb heat and a second portion connected to the first portion to dissipate the absorbed heat, the second portion vertically extending from side edges of the first portion over an edge of the printed circuit board, so as to be exposed from the side surface of the disk drive to directly contact outside air. 16. The disk drive as claimed in claim 15, wherein the first portion extends over substantially all of a surface of the printed circuit board. 17. The disk drive as claimed in claim 15, wherein the second portion is exposed to an outside of the disk drive. 18. The disk drive as claimed in claim 15, wherein the first portion contacts a surface of the at least one chip.
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