초록 ▼

A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the G

A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

대표청구항 ▼

What is claimed is: 1. A heat dissipating device adapted for dissipating heat generated by an add-on card, comprising: a base located on the add-on card and contacting with a chipset attached on the add-on card, for dissipating heat generated by the chipset, the base defining a slot therein, the sl

What is claimed is: 1. A heat dissipating device adapted for dissipating heat generated by an add-on card, comprising: a base located on the add-on card and contacting with a chipset attached on the add-on card, for dissipating heat generated by the chipset, the base defining a slot therein, the slot being above and adjacent to the chipset; a cover attached on the base and having a top wall spaced from the base; a plurality of fins thermally connecting the cover and the base; and a fan positioned on a surface of the base for driving an airflow; the slot is located on the surface of the base between the fins and the fan; a heat pipe is mounted on the surface of the base, and thermally connects with the base and the fins, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows other electronic components near the chipset. 2. The heat dissipating device as described in claim 1, wherein the heat pipe is U-shaped and flattened. 3. The heat dissipating device as described in claim 2, wherein the heat pipe comprises an evaporating portion and a condensing portion parallel to the evaporating portion, wherein the evaporating portion of the heat pipe is located closer to the slot than the condensing portion. 4. The heat dissipating device as described in claim 3, wherein the slot is located between the evaporating portion of the heat pipe and the fan. 5. The heat dissipating device as described in claim 1, wherein the cover comprises a top wall and a sidewall extending downwardly from an edge of the top portion, an intake is defined in the top wall and is in substantial alignment with the fan. 6. The heat dissipating device as described in claim 5, wherein a plurality of tabs is formed on the sidewall of the cover, and a plurality of screws extends through the add-on card and the base and threadedly engages with the tabs of the cover for fastening the heat dissipating device to the add-on card. 7. A heat dissipating device for an add-on card comprising: a base for being mounted to the add-on card and thermally connecting with a heat source of the add-on card, the base defining a slot above the heat source; a heat sink mounted on the base; a fan mounted on the base for driving an airflow through the heat sink and the slot, wherein the slot is located on a surface of the base between the fins and the fan; a cover mounted on the base and thermally connecting with the heat sink; and a heat pipe mounted on the surface of the base thermally connecting with the base and the heat sink. 8. The heat dissipating device as described in claim 7, wherein base defines an opening being in substantial alignment with the fan. 9. The heat dissipating device as described in claim 7, wherein the heat pipe comprises an evaporating portion and a condensing portion, the evaporating portion of the heat pipe is located closer to the fan than the condensing portion. 10. The heat dissipating device as described in claim 9, wherein the slot is located between the evaporating portion and the fan, for permitting passage of a portion of the airflow to blow over other electronic components near the heat source of the add-on card. 11. The heat dissipating device as described in claim 10, wherein the slot is elongated. 12. The heat dissipating device as described in claim 7, wherein the heat pipe is U-shaped and flattened. 13. The heat dissipating device as described in claim 7, wherein the heat pipe is sandwiched between the base and a bottom portion of the heat sink. 14. The heat dissipating device as described in claim 7, wherein the cover comprises a top wall and a sidewall extending downwardly from an edge of the top portion, an intake is defined in the top wall and is in substantial alignment with the fan. 15. The heat dissipating device as described in claim 14, wherein a plurality of tabs is formed on the sidewall of the cover, and a plurality of screws extends through the add-on card and the base and threadedly engages with the tabs of the cover for fastening the heat dissipating device to the add-on card. 16. A computer add-on card assembly comprising: an add-on card having a heat-generating electronic component mounted thereon; a heat dissipating device mounted on the add-on card, comprising: a base in thermal connection with the heat-generating electronic component a surface of the, base defining a void therethrough; a heat pipe mounted on the surface of the base and thermally connecting with the base; a fin assembly mounted on the base and the heat pipe and thermally connecting with the base and the heat pipe; and a fan rotatably mounted on the base; wherein the void is located between the heat pipe and the fan and an airflow generated by the fan has a portion flowing to the fin assembly and another portion flowing to the add-on card through the void. 17. The add-on card assembly as described in claim 16, wherein the void is located adjacent to a top of the heat-generating electronic component. 18. The add-on card assembly as described in claim 17, wherein the void is an elongated slot.