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The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet po

The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.

대표청구항 ▼

The invention claimed is: 1. A cooling device for an electronic apparatus, the cooling device comprising: a cooling element to be connected to an electronic component for receiving a heat load generated by the electronic component, an inlet opening, an outlet opening and a fan for bringing air to f

The invention claimed is: 1. A cooling device for an electronic apparatus, the cooling device comprising: a cooling element to be connected to an electronic component for receiving a heat load generated by the electronic component, an inlet opening, an outlet opening and a fan for bringing air to flow from the inlet opening via the cooling element to the outlet opening for cooling the cooling element with the air flow, and at least one return channel, through which some of the air flowing from the cooling element towards the outlet opening is conducted to an electronic space to cool the electronic space, and wherein a forepart of the return channel is arranged in a place, where the air flowing from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. 2. A cooling device as claimed in claim 1, wherein the return channel continues from the electronic space to the inlet opening in order to conduct the air conducted to the electronic space to the inlet opening. 3. A cooling device as claimed in claim 1, wherein a control element is arranged in connection with the forepart of the return channel, the control element directing some of the air flowing from the cooling element to the outlet port to the return channel. 4. A cooling device as claimed in claim 3, wherein the control element is arranged to delimit an area from a flow area of the cooling element, the area being located as far as possible from an electronic component or the electronic components connected to the cooling element. 5. A cooling device as claimed in claim 1, wherein the fan is arranged in the flow direction before the cooling element to blow air to the cooling element and to suck air from the inlet port. 6. A cooling device as claimed in claim 1, wherein the cooling element comprises plate-like cooling fins arranged in parallel and at a distance from one another and air flowing therebetween. 7. A method for cooling an electronic apparatus, the method comprising producing an air flow from an inlet port via a cooling element connected to an electronic component to an outlet port, separating air from the flow of air flowing from the cooling element to the outlet port that is colder than the air flowing from the cooling element on average, wherein the air is separated with a control element that is arranged in the flow of air flowing from the cooling element to the outlet port to delimit an area from a flow area of the cooling element, the area being located as far as possible from the electronic component or electronic components connected to the cooling element, and conducting the separated air to an electronic space of the electronic apparatus to cool the electronic space. 8. A method as claimed in claim 7, wherein the separated air is conducted through the electronic space to the inlet port.