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Substrate gripper for a substrate handling robot 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B25J-015/00
출원번호 US-0315873 (2005-12-22)
등록번호 US-7374391 (2008-05-20)
발명자 / 주소
  • Rice,Michael
  • Hudgens,Jeffrey
  • Carlson,Charles
  • Weaver,William Tyler
  • Lowrance,Robert
  • Englhardt,Eric
  • Hruzek,Dean C.
  • Silvetti,Mario David
  • Kuchar,Michael
  • Katwyk,Kirk Van
  • Hoskins,Van
  • Shah,Vinay
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Sheridan, LLP
인용정보 피인용 횟수 : 6  인용 특허 : 66

초록

A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint.

대표청구항

The invention claimed is: 1. An apparatus for transferring a substrate, comprising: a base having a supporting surface; a reaction member positioned on the base; an actuator coupled to the base; a contact member that is coupled to the actuator, wherein the actuator is adapted to urge the contact me

이 특허에 인용된 특허 (66)

  1. Thomas Donald Jeffrey ; Aalund Martin Peter ; Roy Robert ; Risi Michael, Apparatus and method for high-speed transfer and centering of wafer substrates.
  2. Boris Govzman ; Konstantin Volodarsky ; Leon Volfovski, Apparatus and methods for handling a substrate.
  3. Matsumura Yoshio,JPX, Apparatus for and method of processing substrate.
  4. Harris,Randy; Woodruff,Daniel J., Apparatus for manually and automatically processing microelectronic workpieces.
  5. Wood ; III David B. (West Chester OH), Article gripping apparatus.
  6. Genov ; deceased Genco ; Botev Roumen G. ; Todorov Alexander D., Automated opening and closing of ultra clean storage containers.
  7. Bacchi Paul ; Filipski Paul S., Continuously rotatable multiple link robot arm mechanism.
  8. Wyka Gary ; Carrera Jaime ; Hoskins Van, Detection system for substrate clamp.
  9. Wyka Gary ; Carrera Jaime ; Hoskins Van, Detection system for substrate clamp.
  10. Nguyen Hoang ; Harper Bruce M., Disc-handling apparatus.
  11. Toriumi, Yuichi, Display driver circuit and display panel including the same.
  12. Babbs, Daniel A.; Kim, Jae Hong; Coady, Matt W.; Fosnight, William J., Edge grip aligner with buffering capabilities.
  13. Walters Scott Alan ; Wasserman Matthew Israel, Granular laundry detergent compositions which are substantially free of phosphate and aluminosilicate builders.
  14. Hosoda Yuji (Chiyoda JPX) Honma Kazuo (Ami JPX) Fujie Masakatsu (Ushiku JPX), Grip device for sheet-like objects.
  15. Miyamoto,Toshio, Hand device for working robot.
  16. Olson Donald M. (Scottsdale AZ), High temperature and acid resistant wafer pick up device.
  17. Bacchi Paul ; Filipski Paul S., High torque, low hysteresis, multiple link robot arm mechanism.
  18. Holbrooks Orville Ray, Intelligent wafer handling system and method.
  19. Sundar Satish, Mechanical gripper for wafer handling robots.
  20. Sundar, Satish, Mechanical gripper for wafer handling robots.
  21. Kroeker Tony ; Hudgens Jeffrey C., Mechanically clamping robot wrist.
  22. Kroeker Tony ; Hudgens Jeffrey C., Mechanically clamping robot wrist.
  23. Verhovsky Yuli, Mechanism for transporting semiconductor-process masks.
  24. Malin Cosmas (Mauren LIX) Sawatzki Harry (Vaduz LIX), Method and apparatus for holding and conveying platelike substrates.
  25. Holtam,Tristan Richard; Cooke,Richard; Edwards,Peter; Paffett,Geoffrey D.; Marmie,Lionel, Method and apparatus for implanting semiconductor wafer substrates.
  26. Everett Louis J. (College Station TX) Hsu Tsing-Wong (El Paso TX), Method and apparatus for locating physical objects.
  27. Reimer, Peter; Patel, Jayesh, Method and apparatus for transferring a semiconductor substrate.
  28. Ben Jan I. (Lawrenceville NJ), Method and apparatus for transporting semiconductor wafers.
  29. Hung, Kwun-Goo; Lee, Tung-Li; Chung, Ko-Chin; Lu, Fan-Lin, Method of calibrating a wafer edge gripping end effector.
  30. Paul Bacchi ; Paul S. Filipski, Method of using a specimen sensing end effector to align a robot arm with a specimen stored on or in a container.
  31. Bacchi, Paul; Filipski, Paul S., Method of using a specimen sensing end effector to determine angular orientation of a specimen.
  32. Paul Bacchi ; Paul S. Filipski, Method of using a specimen sensing end effector to determine the thickness of a specimen.
  33. Fairbairn Kevin ; Sinha Ashok, Multideck wafer processing system.
  34. Donde Arik ; Laor Herzel, Piezoelectric wafer gripping system for robot blades.
  35. Langowski Faustyn C. (Georgetown TX), Pipe gripping head.
  36. Sundar Satish ; Matthews Ned G., Pneumatically actuated flexure gripper for wafer handling robots.
  37. Sundar, Satish; Matthews, Ned G., Pneumatically actuated flexure gripper for wafer handling robots.
  38. Coomer, Stephen D.; Kopacz, Stanislaw; Reynolds, Glyn; Lombardi, Michael James; Visconti, Todd Michael, Reduced edge contact wafer handling system and method of retrofitting and using same.
  39. Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Kumamoto JPX) Hirakawa Osamu (Kumamoto JPX) Anai Noriyuki (Kumamoto JPX) Tateyama Masanori (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto JPX), Resist process apparatus.
  40. Bacchi Paul ; Filipski Paul S., Robot arm with specimen edge gripping end effector.
  41. Bacchi Paul ; Filipski Paul S., Robot arm with specimen sensing and edge gripping end effector.
  42. Tamai Tadamoto (Fujisawa JPX) Yamamoto Toshitaka (Hoya JPX), Robotic arm supporting an object by interactive mechanism.
  43. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  44. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  45. Ko Yong-in,KRX ; Park Jae-sang,KRX ; Kim Kyung-soo,KRX ; Park Jae-bum,KRX, Semiconductor manufacturing device including sensor for sensing mis-loading of a wafer.
  46. Hiroki Tsutomu,JPX, Semiconductor processing apparatus.
  47. Brown, Brian J; Husain, Anwar; Redeker, Fred C, Semiconductor substrate cleaning system.
  48. Bacchi Paul ; Filipski Paul S., Single and dual end effector, multiple link robot arm systems having triaxial drive motors.
  49. Carducci Jim, Single drive, dual plane robot.
  50. Suda Atsuhiko,JPX ; Toyoda Kazuyuki,JPX ; Makiguchi Issei,JPX ; Ozawa Makoto,JPX, Substrate processing apparatus.
  51. Ueda Issei,JPX, Substrate processing apparatus.
  52. Ueda Issei,JPX ; Yamaguchi Tadayuki,JPX, Substrate transfer apparatus and substrate processing apparatus.
  53. Saino, Kousaku; Kobiki, Takahiro, Substrate transfer system.
  54. Klein,Martin P.; Keigler,Arthur; Felsenthal,David, Ultra-thin wafer handling system.
  55. Bacchi Paul ; Filipski Paul S., Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism.
  56. Cox, Damon Keith; Menon, Venugopal, Wafer clamping mechanism.
  57. Byers William (Milford CT) Kochersperger Peter (Greenwich CT), Wafer flip apparatus.
  58. Van Doren Matthew J. (Pleasanton CA) Sauer Don (San Jose CA) Slocum Alexander H. (Concord NH) Rocki David Pap (Pleasanton CA) Tam Johann (Mountain View CA) Gerszewski Larry (Sunnyvale CA), Wafer gripper.
  59. Balg Christian,CHX ; Strasser Bernhard,CHX ; Blattner Jakob,CHX, Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container.
  60. Kouno Gisuke (Ooita JPX) Ashikari Takuji (Ooita JPX), Wafer holding apparatus.
  61. Hobson Phillip M. (Los Altos CA) Dick Paul H. (San Jose CA), Wafer processing chuck using slanted clamping pins.
  62. Foulke Richard F. (Carlisle MA) Lord Steven M. (Malden MA), Wafer transfer apparatus.
  63. Fossey Michael E. ; Johnson Kirk Rodney ; Poduje Noel Stephen, Wafer transfer robot.
  64. Somekh Sasson (Los Altos Hills CA) Fairbairn Kevin (Saratoga CA) Kolstoe Gary M. (Fremont CA) White Gregory W. (San Carlos CA) Faraco ; Jr. W. George (Saratoga CA), Wafer tray and ceramic blade for semiconductor processing apparatus.
  65. Trapani Silvio P. (1907 Cordilleras Rd. Redwood City CA 94062), Wafer-handling tool.
  66. McNurlin, Randy; Maggio, Mark; Smigel, Michael; Wilkey, Ann; Farmer, James L.; Robertson, Shawn, Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector.

이 특허를 인용한 특허 (6)

  1. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  2. Sanemasa, Hiroki; Yamamoto, Hideo; Torii, Naoomi; Ogawa, Takahiro; Katsuoka, Seiji; Nakao, Hidetaka; Makino, Natsuki, Hand having rocking mechanism and substrate delivering device having the same.
  3. Nichols, Michael J.; Guarracina, Louis J., Self-sterilizing automated incubator.
  4. Velazquez, Edwin; Hoey, Gee; Atkinson, Jim K., Substrate gripper apparatus and methods.
  5. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  6. Huang, Luping, System and method for non-contact wafer chucking.
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