초록 ▼

The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electrole

The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.

대표청구항 ▼

What is claimed is: 1. A method comprising: irradiating a catalyst precursor composition with UV irradiation, wherein the catalyst precursor composition comprises: (a) a reactive oligomer which has acrylate or methacrylate as a functional group, and a molecular weight ranging from 500 to 5000; (b)

What is claimed is: 1. A method comprising: irradiating a catalyst precursor composition with UV irradiation, wherein the catalyst precursor composition comprises: (a) a reactive oligomer which has acrylate or methacrylate as a functional group, and a molecular weight ranging from 500 to 5000; (b) a reactive monomer which has acrylate or methacrylate as a functional group, and a molecular weight ranging from 100 to 600; (c) α-hydroxyketone as a photoinitiator; (d) a catalyst precursor for electroless plating which is an organic compound or an inorganic compound including a group VIII B metal or a group I B metal; and (e) a solvent selected from the group consisting of chloroform, acetonitrile, methylethylketone, ethylacetate, and mixtures thereof; and reducing the metal of the catalyst precursor organic compound or inorganic compound to form a catalyst for electroless plating. 2. The method of claim 1, wherein the (a) reactive oligomer is one selected from the group consisting of urethane acrylate, urethane diacrylate, urethane triacrylate, urethane methacrylate, epoxy acrylate, epoxy diacrylate, polyester acrylate, acrylic acrylate, and mixtures thereof. 3. The method of claim 1, wherein the (b) reactive monomer is one selected from the group consisting of isobomyl acrylate, octyl acrylate, decyl acrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, ethoxylated neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, 2-phenoxyethyl acrylate, propoxylated glyceryl triacrylate, ethoxylated trimethyloipropane triacrylate, pentaerytbritol triacrylate, and mixtures thereof. 4. The method of claim 1, wherein the (d) catalyst precursor for electroless plating is a salt of an organic compound including a carbonyl group or an olefin group, and Pd2+. 5. The method of claim 4, wherein the salt of the organic compound is one selected from the group consisting of palladium acetate, palladium trifluoroacetate, palladium oxalate, palladium acetylacetonate, and mixtures thereof.