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A thin film transistor with multiple gates is fabricated using a super grain silicon (SGS) crystallization process. The thin film transistor a semiconductor layer formed in a zigzag shape on an insulating substrate, and a gate electrode intersecting with the semiconductor layer. The semiconductor l

A thin film transistor with multiple gates is fabricated using a super grain silicon (SGS) crystallization process. The thin film transistor a semiconductor layer formed in a zigzag shape on an insulating substrate, and a gate electrode intersecting with the semiconductor layer. The semiconductor layer has a high-angle grain boundary in a portion of the semiconductor layer that does not cross the gate electrode.

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What is claimed is: 1. A thin film transistor comprising: a semiconductor layer formed in a zigzag shape on an insulating substrate; and a gate electrode intersecting with the semiconductor layer; wherein the semiconductor layer has a high-angle grain boundary in a portion of the semiconductor laye

What is claimed is: 1. A thin film transistor comprising: a semiconductor layer formed in a zigzag shape on an insulating substrate; and a gate electrode intersecting with the semiconductor layer; wherein the semiconductor layer has a high-angle grain boundary in a portion of the semiconductor layer that does not cross the gate electrode. 2. The thin film transistor of claim 1, wherein the semiconductor layer comprises: two or more body parts intersecting with the gate electrode; and one or more connection parts each connecting together two neighboring ones of the body parts; wherein portions of the body parts intersecting with the gate electrode act as channel regions; and wherein portions of the gate electrode overlapping the channel regions act as multiple gates. 3. The thin film transistor of claim 2, wherein the high-angle grain boundary is in one of the one or more connection parts. 4. The thin film transistor of claim 1, wherein the gate electrode comprises one or more slots intersecting with the semiconductor layer. 5. The thin film transistor of claim 4, wherein the high-angle grain boundary is in a portion of the semiconductor layer overlapped by one of the one or more slots of the gate electrode. 6. The thin film transistor of claim 1, wherein the semiconductor layer is formed in a shape on the insulating substrate. 7. The thin film transistor of claim 1, wherein the semiconductor layer is formed in a shape on the insulating substrate. 8. A thin film transistor comprising: a multi-semiconductor layer formed on an insulating substrate; and a gate electrode intersecting with the multi-semiconductor layer; wherein a high-angle grain boundary does not exist in the multi-semiconductor layer. 9. The thin film transistor of claim 8, wherein the multi-semiconductor layer comprises two or more semiconductor layers intersecting with the gate electrode; wherein the thin film transistor further comprises one or more links each connecting together two neighboring ones of the semiconductor layers; wherein portions of the semiconductor layers intersecting with the gate electrode act as channel regions; and wherein portions of the gate electrode overlapping the channel regions act as multiple gates. 10. The thin film transistor of claim of claim 8, wherein the gate electrode comprises one or more slots intersecting with the multi-semiconductor layer. 11. The thin film transistor of claim 9, wherein the one or more links are in one layer of the thin film transistor, and the semiconductor layers are in another, different layer of the thin film transistor. 12. A thin film transistor comprising: a multi-semiconductor layer formed on an insulating substrate; and a gate electrode intersecting with the multi-semiconductor layer; wherein portions of the multi-semiconductor layer intersecting with the gate electrode act as channel regions; and wherein a high-angle grain boundary does not exist in the channel regions. 13. The thin film transistor of claim 12, wherein the multi-semiconductor layer comprises two or more semiconductor layers intersecting with the gate electrode; wherein the thin film transistor further comprises one or more links each connecting together two neighboring ones of the semiconductor layers; wherein portions of the semiconductor layers intersecting with the gate electrode act as the channel regions; and wherein portions of the gate electrode overlapping the channel regions act as multiple gates. 14. The thin film transistor of claim 13, further comprising source/drain electrodes contacting portions of the multi-semiconductor layer outside the channel regions. 15. The thin film transistor of claim of claim 12, wherein the gate electrode comprises one or more slots intersecting with the multi-semiconductor layer. 16. The thin film transistor of claim 13, wherein the one or more links are in one layer of the thin film transistor, and the semiconductor layers are in another, different layer of the thin film transistor. 17. The thin film transistor of claim 16, wherein the one or more links are made of a same material as the gate electrode. 18. The thin film transistor of claim 16, wherein a high-angle grain boundary does not exist in the multi-semiconductor layer. 19. A thin film transistor comprising: a semiconductor layer formed in a rectangular shape having one side open on an insulating substrate, or formed in a zigzag shape on the insulating substrate; and a gate electrode comprising at least one slot crossing the semiconductor layer; wherein the semiconductor layer has a high-angle grain boundary in a portion of the semiconductor layer overlapped by one of the at least one slot of the gate electrode; wherein the semiconductor layer comprises: two or more body parts intersecting with the gate electrode; and one or more connection parts each connecting together two neighboring ones of the body parts; wherein portions of the body parts intersecting with the gate electrode act as channel regions; and wherein portions of the gate electrode overlapping the channel regions act as multiple gates. 20. The thin film transistor of claim 1, wherein the semiconductor layer does not have a high-angle grain boundary in any portion of the semiconductor layer that crosses the gate electrode. 21. The thin film transistor of claim 8, wherein the multi-semiconductor layer comprises two or more semiconductor layers separated from one another on the insulating substrate. 22. The thin film transistor of claim 12, wherein the multi-semiconductor layer comprises two or more semiconductor layers separated from one another on the insulating substrate. 23. The thin film transistor of claim 12, wherein a high-angle grain boundary does not exist in the multi-semiconductor layer. 24. The thin film transistor of claim 14, wherein the one or more links is made of a same material as the source/drain electrodes.