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Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-007/00
출원번호 US-0871334 (2007-10-12)
등록번호 US-7385817 (2008-06-10)
발명자 / 주소
  • Campbell,Levi A.
  • Chu,Richard C.
  • Ellsworth,Michael J.
  • Iyengar,Madhusudan K.
  • Schmidt,Roger R.
  • Simons,Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Neff, Esq.,Lily
인용정보 피인용 횟수 : 14  인용 특허 : 27

초록

Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween;

대표청구항

What is claimed is: 1. A method of fabricating a cooling apparatus for facilitating cooling of an electronics assembly comprising a substrate supporting multiple heat generating electronics components to be cooled, the method comprising: providing multiple discrete cold plates with a plurality of c

이 특허에 인용된 특허 (27)

  1. Mathias Joseph S. (Riverton NJ) Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  2. Young Steven P. (LaGrangeville NY) Acocella John (Hopewell Junction NY) Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Song Seaho (Highland NY), Apparatus for indirect impingement cooling of integrated circuit chips.
  3. Johnson,Scott T.; Winslow,David T., Cold plate assembly.
  4. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins.
  5. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  6. Nakano, Masao; Ashitani, Hiromasa; Fukushima, Masafumi, Cooling device for semiconductor elements.
  7. Umezawa Kazuhiko (Tokyo JPX), Cooling structure for integrated circuits.
  8. Takahiro Daikoku JP; Junri Ichikawa JP; Atsuo Nishihara JP; Kenichi Kasai JP, Device and method for cooling multi-chip modules.
  9. Daikoku, Takahiro; Kasai, Kenichi; Netsu, Toshitada; Koyano, Koichi; Uda, Takayuki, Device for sealing and cooling multi-chip modules.
  10. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX), Electronic apparatus cooling system.
  11. Arakawa Masaaki (Osaka JPX) Sakashita Teiji (Osaka JPX) Sibata Kazumasa (Osaka JPX) Hori Katsumi (Osaka JPX) Takahashi Makoto (Osaka JPX) Tanaka Naomitu (Osaka JPX), Fixing tape.
  12. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
  13. Teneketges,Nicholas J.; Kwok,Tarzen, Heat exchange apparatus with parallel flow.
  14. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
  15. Messina Gaetano P. (Hopewell Junction NY), Integral cooling system for electric components.
  16. Tanzer Herbert J. (Topanga CA) Goodarzi Gholam A. (Torrance CA) Olaveson Richard J. (Inglewood CA), Integral extended surface cooling of power modules.
  17. Kawamura Keizo,JPX ; Ashiwake Noriyuki,JPX ; Daikoku Takahiro,JPX ; Idei Akio,JPX ; Kasai Kenichi,JPX ; Kimura Hideyuki,JPX ; Nishihara Atsuo,JPX ; Hatada Toshio,JPX ; Sasaki Shigeyuki,JPX, Low thermal resistant, fluid-cooled semiconductor module.
  18. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  19. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  20. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  21. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  22. Bendelli, Giampaolo; Di Mascio, Enrico; Puleo, Mario; Scofet, Marco, Package for opto-electrical components.
  23. Cox, William E.; Schmidt, Roger R., Stackable liquid cooling pump.
  24. Akamatsu Shinya (Tokyo JPX) Mine Shinji (Tokyo JPX) Seguchi Hideki (Tokyo JPX), Structure for cooling an integrated circuit.
  25. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
  26. Bezama Raschid J. ; Sherif Raed A., Variable thermal exchanger and method thereof.
  27. Novotny, Shlomo; Rousmaniere, Arthur S.; Vogel, Marlin, Water-cooled system and method for cooling electronic components.

이 특허를 인용한 특허 (14)

  1. Dede, Ercan Mehmet; Liu, Yan, Cold plate assemblies and power electronics modules.
  2. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  3. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  4. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.
  5. Koontz, Christopher R.; Chu, Charles; Flores, Gilbert A., Flexible electronic package integrated heat exchanger with cold plate and risers.
  6. Song, David W.; Chang, Je-Yong, Heat dissipation lid having direct liquid contact conduits.
  7. Song, David W.; Chang, Je-Young, Heat dissipation lid having direct liquid contact conduits.
  8. Dede, Ercan Mehmet; Liu, Yan, Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same.
  9. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.
  10. Dede, Ercan Mehmet, Jet impingement heat exchanger apparatuses and power electronics modules.
  11. Chen, Richard T.; Tan, Will J., Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems.
  12. Dede, Ercan Mehmet, Power electronics card assemblies, power electronics modules, and power electronics devices.
  13. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  14. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.
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