초록 ▼

A compound connector that comprises two types of I/O connectors, one of which I/O connectors may be a smart connector for use with an external electronic system. The compound connector has a first storage space for receiving a first type of I/O electronic package which includes contacts positioned o

A compound connector that comprises two types of I/O connectors, one of which I/O connectors may be a smart connector for use with an external electronic system. The compound connector has a first storage space for receiving a first type of I/O electronic package which includes contacts positioned on its edge. The compound connector has a second storage space for receiving a second type of I/O electronic package which includes contacts positioned on one of its major surfaces.

대표청구항 ▼

What is claimed: 1. A compound connector device, comprising: a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof; a second storage space coextensive with the first storage space along a major portion thereof, the second sto

What is claimed: 1. A compound connector device, comprising: a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof; a second storage space coextensive with the first storage space along a major portion thereof, the second storage space being configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package, the second type of I/O electronic package having two major surfaces and contacts located on one of the two major surfaces; and a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon and defining an opening, at least one of the contact terminals comprising a first end mounted directly on the printed circuit board and a second end cantilevered on the printed circuit board, the second end being adapted to extend through the opening and engage the contacts located on one of the two major surfaces of the second type of I/O electronic package. 2. The compound connector device as set forth in claim 1, wherein: said first type of I/O electronic package is a PCMCIA card; and said second type of I/O electronic package is a smart card. 3. The compound connector device as set forth in claim 1, wherein said first type of I/O electronic package is a memory card. 4. The compound connector device as set forth in claim 1, wherein data signals associated with a memory card inserted into said first storage space can be transmitted by the compound connector device only if a smart card is inserted into said second storage space. 5. The compound connector device as set forth in claim 1, wherein the contact terminals are mounted directly on the printed circuit board and are supported solely by the printed circuit board. 6. A compound connector device, comprising: a first storage space that is configured to receive a first type of I/O electronic package; a second storage space adjacent the first storage space, the second connector being configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package; a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon and defining an opening, at least one of the contact terminals comprising a first end mounted directly on the printed circuit board and a second end cantilevered on the printed circuit board, the second end being adapted to extend through the opening and engage; and a sensor located proximate to the second storage space for facilitating proper alignment of the second type of I/O electronic package with the plurality of contact terminals. 7. The compound connector device as set forth in claim 6, wherein the first ends of the contact terminals are fixed to a first surface of the printed circuit board that faces away from the second storage space. 8. The compound connector device as set forth in claim 6, wherein the opening is a cutout formed in the printed circuit board. 9. The compound connector device as set forth in claim 6, wherein the contact terminals are mounted directly on the printed circuit board and are supported solely by the printed circuit board. 10. A compound connector device, comprising: a first storage space that is configured to receive a first type of I/O electronic package that has contacts on an edge thereof; a second storage space configured to receive a second type of I/O electronic package that is different from the first type of I/O electronic package, the second type of I/O electronic package having two major surfaces and contacts located on one of the two major surfaces; and a printed circuit board overlaying the second storage space, the printed circuit board including a plurality of contact terminals thereon for engaging the contacts located on one of the two major surfaces of the second type of I/O electronic package, the contact terminals being mounted on a surface of the printed circuit board that faces away from the second storage space. 11. The compound connector device as set forth in claim 10, wherein the contact terminals extend through an opening in the printed circuit board. 12. The compound connector device as set forth in claim 10, wherein a first end of each of the contact terminals is mounted on the surface of the printed circuit board that faces away from the second storage space, and a second end of each of the contact terminals is freestanding. 13. The compound connector device as set forth in claim 10, wherein each of the contact terminals is electrically connected to an associated signal trace that extends along the surface of the printed circuit board that faces away from the second storage space. 14. The compound connector device as set forth in claim 10, wherein the contact terminals are mounted directly on the surface of the printed circuit board that faces away from the second storage space and are supported solely by the printed circuit board.