초록 ▼

The present invention provides a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability. The surface-treating agent for metal contains a tetrazole derivative represented by the following formula and/or a salt thereof, wherein R1 and R2 each independent

The present invention provides a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability. The surface-treating agent for metal contains a tetrazole derivative represented by the following formula and/or a salt thereof, wherein R1 and R2 each independently represent a hydrogen atom, a halogen atom, or an alkyl group or an aryl group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group added thereto, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and R3 represents a bond or an alkylene group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a mercapto group, an azo group (--N═N--), a sulfide group (--S--), or a disulfide group (--S--S--) added thereto, or represents an azo group, a sulfide group, or disulfide group, and may contain a metal or metal compound.

대표청구항 ▼

The invention claimed is: 1. A surface-treating solution for a metal substrate, comprising a tetrazole derivative represented by formula 1 and/or a salt thereof in a concentration of between 0.05 g/l and 100 g/l wherein R1 and R2 each independently represent a hydrogen atom, a halogen atom, or a

The invention claimed is: 1. A surface-treating solution for a metal substrate, comprising a tetrazole derivative represented by formula 1 and/or a salt thereof in a concentration of between 0.05 g/l and 100 g/l wherein R1 and R2 each independently represent a hydrogen atom, a halogen atom, or an alkyl group, alkenyl group, alkinyl group, aryl group, aralkyl group or benzyl group, which each have a carbon number of not more than 10, and a group having added thereto a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and R3 represents a bond or an alkylene group, alkenylene group, alkinylene group, arylene group or aralkylene group, which each have a carbon number of not more than 10, and a group having added thereto a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a mercapto group, an azo group, a sulfide group, or a disulfide group, or represents an azo group (--N═N--), a sulfide group (--S--), or a disulfide group (--S--S--), and a solvent. 2. A surface-treating solution for a metal substrate according to claim 1, further containing a metal or a metal compound. 3. A surface-treating solution for a metal substrate according to claim 1, wherein R1 and R2 are hydrogen atoms; and R3 represents a bond, an azo group, a sulfide group, or a disulfide group. 4. A surface-treating solution for a metal substrate according to claim 1, wherein R1 or R2 is not a hydrogen atom. 5. A surface-treating solution for a metal substrate according to claim 1, wherein said tetrazole derivative is selected from the group consisting of 5,5'-bi-1H-tetrazole, 5,5'-bi-1-methyltetrazole, 5,5'-bi-1-phenyltetrazole, 5,5'-bi-1-mercaptotetrazole, 5,5'-bi-1-chlorotetrazole, 5,5'-ethylenebis-1-methyltetrazole, 5,5'-ethylenebis-1-phenyltetrazole, 5,5'-ethylenebis-1-mercaptotetrazole, 5,5'-ethylenebis-1-chlorotetrazole, 5,5'-azobis-1H-tetrazole, 5,5'-azobis-1-methyltetrazole, 5,5'-azobis-1-phenyltetrazole, 5,5'-azobis-1-mercaptotetrazole, 5,5'-azobis-1-chlorotetrazole, 5,5'-disulfidebis-1H-tetrazole, 5,5'-disulfidebis-1-methyltetrazole, 5,5'-disulfidebis-1-phenyltetrazole, 5,5'-disulfidebis-1-mercaptotetrazole, and 5,5'-disulfidebis-1-chlorotetrazole. 6. A surface-treating solution for a metal substrate according to claim 3, further containing a metal or a metal compound. 7. A surface-treating solution for a metal substrate according to claim 4, further containing a metal or a metal compound. 8. A surface-treating solution for a metal substrate according to claim 5, further containing a metal or a metal compound. 9. A surface-treating solution for a metal substrate according to claim 1, wherein the solvent is water. 10. A surface-treating solution for a metal substrate according to claim 2, wherein the metal and metal compounds are selected from the group consisting of zinc, manganese, chromium, tin, iron, nickel, cobalt, copper, gold, silver, platinum, palladium, rhodium, ruthenium, and compounds thereof. 11. A method of treating the surface of a metal substrate comprising the step of contacting the metal substrate's surface with the surface-treating solution of claim 1.