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A stage for processing a substrate, especially useful for vacuum applications, has a recess just large enough to hold a substantially flat substrate and a chuck or holder but not much more. The perimeter of the recessed side has an air bearing surface separated from the recess by differentially pump

A stage for processing a substrate, especially useful for vacuum applications, has a recess just large enough to hold a substantially flat substrate and a chuck or holder but not much more. The perimeter of the recessed side has an air bearing surface separated from the recess by differentially pumped groves and seal lands. The air bearing lands are urged against a reference plate guide surface and the seal lands being substantially coplanar create a resistance to flow between the groves and recess, on the other side of the base reference plate mounts the radiation source. The VCS may operate in a vacuum environment itself, or in another preferred embodiment, it provides the possibility for multiple stages moving between process or inspection steps within the same tool or process sequence.

대표청구항 ▼

I claim: 1. An apparatus for forming a vacuum chamber in which an object is placed, the apparatus comprising: a first reference member having a first reference surface defined thereon; one or more main stages that move on the first reference surface, each of the one or more main stages having a rec

I claim: 1. An apparatus for forming a vacuum chamber in which an object is placed, the apparatus comprising: a first reference member having a first reference surface defined thereon; one or more main stages that move on the first reference surface, each of the one or more main stages having a recessed pocket formed therein; and a combination fluid and vacuum bearing on each main stage that permits motion of the main stage over the reference surface and surrounds the recessed pocket in a manner that provides for a vacuum in the recessed pocket, thus forming the vacuum chamber. 2. An apparatus as in claim 1, further comprising an outer wall, and wherein the combination fluid and vacuum bearing has vacuum grooves that are progressively larger towards the recessed pocket that are connected to ports though the stage to an outer wall and used for differential pumping to obtain high vacuum in the recessed pocket. 3. An apparatus as in claim 1, wherein the combination fluid and vacuum bearing uses a gas as the fluid. 4. An apparatus as in claim 1, wherein the first reference member has vacuum channels formed therein, the vacuum channels having openings in the first reference surface, and wherein pumping of the vacuum in the recessed pocket is done through the openings of the vacuum channels in the first reference surface. 5. An apparatus as in claim 1, further comprising a second reference member having a second reference surface defined thereon so as to be parallel to the first reference surface and on the opposite side of one or more of the main stages, and wherein said one or more of the main stages are also supported by the second reference surface. 6. An apparatus as in claim 5, further comprising a sealed wall for enclosing the volume between the first reference surface and the second reference surface, and wherein the volume is partially pumped out or filled with clean dry air or filled with a non-reactive gas to control at least one of ambient pressure and contamination. 7. An apparatus as in claim 1, further comprising a Z positioner for moving the object in a direction normal to the first reference surface or to adjust the top surface of the object to be parallel to the first reference surface. 8. An apparatus as in claim 1, where a slot is provided in one side of one or more of the main stages to permit loading and unloading of the object. 9. An apparatus as in claim 1, further comprising an X-Y positioner for moving one or more of the main stages in X and Y axes parallel to the first reference surface, or in rotation about an axis normal to the first reference surface, or in any combination of these axes. 10. An apparatus as in claim 1, further comprising reaction masses for reduction of induced vibration. 11. An apparatus as in claim 1, further comprising a radiation source, and wherein the first reference surface supports the radiation source and includes an opening or window that transmits the radiation through the reference surface. 12. An apparatus as in claim 11, where the radiation source is an electron beam column, ion beam column, ion source, optical beam, laser beam, x-ray beam, deep ultraviolet beam, extreme ultraviolet beam, ultraviolet beam, or a combination thereof. 13. An apparatus as in claim 11, wherein the first reference surface is tiltable relative to a direction of radiation from the radiation source to change the angle between the radiation source and the object. 14. An apparatus as in claim 1, further comprising an added service stage that supports cables and hoses. 15. An apparatus as in claim 1, wherein the recessed pocket is filled with water or other high index fluid, and the combination fluid bearing operates using water or other high index fluid and vacuum. 16. An apparatus as in claim 15, wherein the water is at a pressure below atmospheric pressure. 17. An apparatus as in claim 15, wherein the combination fluid bearing operates using water or other high index fluid and gas and vacuum. 18. An apparatus as in claim 1, wherein the combination fluid and vacuum bearing has one or more porous surfaces. 19. An apparatus as in claim 18, wherein the one or more porous surfaces comprise graphite carbon, ceramic or silicon carbide. 20. An apparatus as in claim 1, wherein the combination fluid and vacuum bearing employs bearing compensation. 21. An apparatus as in claim 20, wherein the combination fluid and vacuum bearing employs orifice, step, shelf, or capillary compensation in the bearing. 22. A method of processing and observing or inspecting an object, the method comprising: (a) providing an apparatus for forming a vacuum chamber in which the object is placed, the apparatus comprising: a first reference member having a first reference surface defined thereon; one or more main stages that move on the first reference surface, each of the one or more main stages having a recessed pocket formed therein; and a combination fluid and vacuum bearing on each main stage that permits motion of the main stage over the reference surface and surrounds the recessed pocket in a manner that provides for a vacuum in the recessed pocket, thus forming the vacuum chamber; (b) placing the object in the vacuum chamber; and (c) processing and observing or inspecting the object in the vacuum chamber. 23. A method as in claim 22, wherein step (c) is performed with a radiation source. 24. A method as in claim 23, wherein the first reference surface is tilted relative to a direction of radiation from the radiation source to change the angle between the radiation source and the object. 25. A method as in claim 23, wherein the radiation source is an electron beam, or an ion beam, or an optical beam, a laser beam, x-ray beam, deep ultraviolet beam, extreme ultraviolet beam, ultraviolet beam, or a combination thereof. 26. A method as in claim 22, wherein step (a) comprises using a gas as the fluid in the combination fluid and vacuum bearing. 27. A method as in claim 22, wherein step (a) comprises using water or other high index fluid as the fluid in the combination fluid and vacuum or low pressure water bearing. 28. A method as in claim 27, wherein the recessed pocket is filled with the water or other high index fluid. 29. A method as in claim 22, where the combination fluid and vacuum bearing has vacuum grooves that are progressively larger towards the recessed pocket and use differential pumping to obtain high vacuum in the recessed pocket. 30. A method as in claim 22, wherein the object is a silicon wafer or mask. 31. A method as in claim 30, further comprising moving the object in a direction normal to the first reference surface. 32. A method as in claim 31, wherein the object is moved to adjust for a depth of field. 33. A method as in claim 31, wherein the object is moved to adjust for an error in thickness of the object. 34. A method as in claim 31, wherein the object is moved as part of replacing the object. 35. A method as in claim 22, further comprising moving the object in a direction normal to the first reference surface.