초록 ▼

Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-s

Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

대표청구항 ▼

We claim: 1. A flexible heat sink article comprising; a base comprising a polymer; and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension; wherein the polymer of the base comprises thermally conductive particles and opti

We claim: 1. A flexible heat sink article comprising; a base comprising a polymer; and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension; wherein the polymer of the base comprises thermally conductive particles and optionally wherein the polymer of the base of the heat sink has a flexural modulus below about 7 GPa, wherein the polymer of the protrusions comprises non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions, and wherein the heat sink flexibility allows bending to a radius of less than about 30 cm at room temperature without significantly adversely affecting the heat sink function. 2. The article of claim 1 wherein the protrusions and the base are comprised of substantially polymer compositions, which compositions optionally comprise one or more adhesive(s). 3. The article of claim 1 wherein the protrusions and the base are comprised of dissimilar polymer compositions, which compositions optionally comprise one or more adhesive(s) and which compositions optionally are curable. 4. The article of claim 1 wherein the particles in the protrusions and the particles in the base substantially similar particles, optionally wherein the protrusions and the base include particles of the same composition. 5. The article of claim 1 wherein the non-spherical particles are elongated, optionally having an aspect ratio greater than about 1.25 to 1. 6. The article of claim 1 wherein the thermally conductive particles are selected from carbon black, carbon fibers, coated carbon fibers, diamond, ceramic fiber mesh, ceramics, boron nitride, aluminum oxide, silicon carbide, aluminum nitride, aluminum trihydrate, magnesium hydroxide, metals, metal foils, and combinations thereof. 7. The article of claim 1 wherein the particles are selected to reduce interference at electromagnetic frequencies, radio frequencies, or a combination thereof, the particles optionally selected from iron oxides arid nickel coated particles. 8. The article of claim 1 further comprising a metallic layer, a scrim, or a combination thereof, selected to reduce at least one of EMI, RFI, and thermal conductivity, said scrim optionally selected from nickel or nickel-coated scrims, carbon scrims, nickel-coated carbon scrims, and, combinations thereof. 9. The article of claim 1 wherein one or more surfaces of the polymer of the base or the polymer of the protrusions or both comprise a metallic layer, a resin coating, or a combination thereof. 10. The article of claim 1 further comprising an adhesion promoter applied to the base of the heat sink article. 11. The article of claim 1 wherein the protrusions are capable of being deflected by at least about 50% of the thickness of the protrusions without breaking. 12. The article of claim 1 adapted to conform to a circuit board having at least one of chips at multiple heights or devices of varying surface flatness. 13. The article of claim 1 further comprising features on the base shaped to mechanically attach the heat sink article to a heat-generating device or a structure comprising such device, wherein the base optionally is adapted to contact a shaped surface. 14. The article of claim 1 further comprising a thermal interface material contiguous with the base, which thermal interface material optionally is curable. 15. The article of claim 14 wherein the thermal interface materials include two or more of a pressure sensitive adhesive, hot melt adhesive, low surface energy adhesive, epoxy, thermal bond film, phase change material, grease, and eutectic alloy phase change material. 16. The article of claim 14 wherein the thermal interface material comprises an electrically conductive adhesive, optionally wherein the adhesive is EMI/RFI shielding, and optionally wherein the combination of base thickness and adhesive thickness is selected to provide a test substrate surface wet-out of at least about 40%. 17. The article of claim 14 wherein the thermal interface material comprises an electrically conductive adhesive which further comprises thermally conductive particles having at least one dimension of at least about one μm and no greater than about 250 μm added in an amount effective to increase thermal conductivity between a substrate and the heat sink article as compared to the adhesive without thermally conductive particles, optionally wherein the particles are contained within the adhesive and impinge the base and optionally impinge the surface of the adhesive opposite the base. 18. The article of claim 1 wherein the polymeric protrusions have a shape selected to provide one or more feature(s) selected from directional airflow, increased surface area, and a tapered shape. 19. The article of claim 1 wherein the heat sink article is thermoplastically reformable. 20. The article of claim 1 wherein at least one of the base and the protrusions comprise a blend of two or more polymers, which polymers optionally comprise one or more adhesive(s). 21. The article of claim 1 further comprising one or more additive(s), filler(s), or a combination thereof in at least one of the base and protrusion polymer composition(s). 22. The article of claim 1 wherein the base includes a corrugated layer, which may be provided as a surface. 23. The article of claim 1 wherein the base comprises features adapted to increase the flexibility thereof, optional wherein the flexibility features are selected from indentations, slits, channels, cut-outs, notches, holes, or any combination of thereof. 24. The article of claim 1 wherein the heat sink article has a UL-94 flammability rating of V1 or V0. 25. The article of claim 1 provided in a roll form. 26. The article of claim 1 wherein a ratio of base thickness to protrusion height is selected from at least 1:2, at least 1:3, at least 1:6, and at least 1:8. 27. The flexible heat sink article of claim 1 further comprising: a metallic layer contiguous with the second surface of the base; and optionally a thermal interface material contiguous with the metallic layer. 28. The article of claim 27 wherein the thermal interface material is provided in intermittent regions of two or more materials. 29. The article of claim 28 wherein the thermal interface materials include two or more of a pressure sensitive adhesive, hot melt adhesive, low surface energy adhesive, epoxy, thermal bond film, phase change material, grease, and eutectic alloy phase change material. 30. The article of claim 27 wherein the thermal interface material comprises caliper variations, optionally wherein the caliper variations are selected to improve one or more properties selected from heat flow, adhesion, surface wet-out, contact area, and flexibility. 31. The article of claim 27 wherein the thermal interface material comprises an electrically conductive adhesive, which adhesive optionally is EMI/RFI shielding. 32. The article of claim 31 wherein the combination of base thickness and adhesive thickness is selected to provide a test substrate surface wet-out of at least about 40%. 33. The article of claim 31 wherein the adhesive further comprises thermally conductive particles sufficient size increase thermally conductivity as compared to the adhesive without thermally conductive particles between a substrate and the heat sink article, optionally wherein the particles are contained within the adhesive and impinge the base and optionally impinge the surface of the adhesive opposite the base. 34. The article of claim 31 wherein the adhesive further comprises thermally conductive particles having a major dimension of at least about 1 μm.