초록 ▼

An improved air flow management has an air control device for blocking air from low impedance airflow pathways without high thermal components and directing the air flow initially at specific components with high thermal loading. Other components are cooled by the air as it passes from the high ther

An improved air flow management has an air control device for blocking air from low impedance airflow pathways without high thermal components and directing the air flow initially at specific components with high thermal loading. Other components are cooled by the air as it passes from the high thermal loading component to exit from the unit. The air control device directs the air flow by locating and sizing apertures in the air control device based on the location and thermal load of the components on the printed circuit board. Accordingly, the unit can require less air flow through the unit and smaller or no heat sinks than conventional methods.

대표청구항 ▼

What is claimed is: 1. A unit comprising: a printed circuit board having at least one component having a thermal load; and an air control device generally parallel to the printed circuit board, the air control device disposed between an intake opening and an exhaust opening to direct air from low i

What is claimed is: 1. A unit comprising: a printed circuit board having at least one component having a thermal load; and an air control device generally parallel to the printed circuit board, the air control device disposed between an intake opening and an exhaust opening to direct air from low impedance airflow pathways and having at least one air passage aperture positioned relative to the at least one component having the thermal load for directing a flow of air from the intake opening disposed in proximity to a first side of the air control device to the exhaust opening disposed in proximity to a second side of the air control device, the second side of the air control device opposing the first side of the air control device and the air flowing in proximity to the at least one component having the thermal load thus cooling the at least one component with the thermal load, the at least one air passage aperture spaced and sized based on the location of the at least one component having a thermal load located on the printed circuit board; wherein: the air control device comprises a component engaging portion extending from the air control device and into a local circuit board space defined by the air control device and the printed circuit board, the component engaging portion disposed in proximity to the at least one air passage aperture and in thermal communication with the at least one component having the thermal load; and the air control device is formed of high thermal conductivity material configured to (i) receive heat from the at least one component having the thermal load, via the component engaging portion and (ii) dissipate the received heat. 2. A unit of claim 1 further comprising: a blower associated with the air control device for pulling air through the at least one air passage aperture in the air control device to provide air flow by the at least one component having a thermal load. 3. A unit of claim 2 wherein the at least one air passage aperture in the air control device is at least three air passage apertures overlying the printed circuit board, each of the at least three air passage apertures spaced and sized based on the location of the at least one component having the thermal load located on the printed circuit board. 4. A unit of claim 2 wherein the air control device is spaced above the printed circuit board less than 3 times the average height of the at least one component on the printed circuit board. 5. A unit of claim 2 wherein the air control device is generally planar and has at least one depression in the device such that the at least one air passage aperture in the air control device is spaced from a planar surface of the air control device and closer in proximity to the printed circuit board and the at least one component with the thermal load than the remainder of the air control device. 6. A unit of claim 2 wherein the air control device has a second air passage aperture in proximity to the edge of the air control device for passing air across portions of the printed circuit board spaced from the at least one component with the thermal load and the at least one air passage aperture. 7. A unit comprising: a printed circuit board having at least one component having a thermal load; an air control device generally parallel to the printed circuit board, the air control device disposed between an intake opening and an exhaust opening to direct air from low impedance airflow pathways and having at least three air passage apertures overlying the printed circuit board and positioned relative to the at least one component having the thermal load for directing a flow of air from the intake opening disposed in proximity to a first side of the air control device to the exhaust opening disposed in proximity to second side of the air control device, the second side of the air control device opposing the first side of the air control device and the air flowing in proximity to the at least one component having the thermal load thus cooling the at least one component with the thermal load, wherein the air control device is formed of high thermal conductivity material to dissipate heat, each of the at least three air passage apertures spaced and sized based on the location of the at least one component having the thermal load located on the printed circuit board; and a blower associated with the air control device for pulling air through the at least three air passage apertures in the air control device to provide air flow by the at least one component having a thermal load; wherein: the air control device comprises a component engaging portion extending from the air control device and into a local circuit board space defined by the air control device and the printed circuit board, the component engaging portion disposed in proximity to the at least one air passage aperture and in thermal communication with the at least one component having the thermal load; and the air control device is formed of having thermal conductivity material configured to (i) receive heat from the at least one component having the thermal load, via the component engaging portion and (ii) dissipate the received heat. 8. A unit of claim 7 wherein the air control device contacts the at least one component with the thermal load to draw heat from the at least one component. 9. An electronic unit comprising: a chassis, the chassis having at least one intake opening for allowing air into the chassis and at least one exhaust opening for allowing air out of the chassis; a blower associated with the exhaust opening for pulling air out of the chassis; a printed circuit board assembly having a printed circuit board and a plurality of components mounted on the printed circuit board, at least one of the components having a high thermal load, the printed circuit board assembly mounted in the chassis, the printed circuit board defining a board plane; and an air control device mounted in the chassis disposed between the intake opening and the exhaust opening and generally parallel to and spaced from the printed circuit board assembly, the air control device positioned such that the at least one intake opening is disposed in proximity to a first side of the air control device and the at least one exhaust opening disposed in proximity to a second side of the air control device the second side of the air control device opposing the first side of the air control device and, the air control device directing air from low impedance airflow pathways, the air control device having at least one air passage aperture for passage of air from the first side of the air control device to the second side of the air control device, the at least one air passage aperture positioned to direct the flow of air on the at least one of the components with the high thermal load, the at least one air passage aperture spaced and sized based on the location of the at least one of the components having the high thermal load located on the printed circuit board; wherein: the air control device comprises a component engaging portion extending from the air control device and into a local circuit board space defined by the air control device and the printed circuit board, the component engaging portion disposed in proximity to the at least one air passage aperture and in thermal communication with the at least one component having the thermal load; and the air control device is formed of high thermal conductivity material configured to (i) receive heat from the at least one component having the thermal load, via the component engaging portion and (ii) dissipate the received heat. 10. An electronic unit of claim 9 further comprising: an electromagnetic interference (EMI) cage for limiting unwanted radiation into and out of the electronic unit. 11. An electronic unit of claim 10 wherein the air control device is located within the EMI cage for directing air to the at least one of the components with the high thermal load without EMI consideration. 12. An electronic unit of claim 9 wherein the at least one air passage aperture in the air control device is at least three air passage apertures, each of the at least three air passage apertures spaced and sized based on the location of the at least one of the components having the high thermal load located on the printed circuit board. 13. An electronic unit of claim 9 wherein the air control device is spaced sufficiently close to the printed circuit board to effectively eliminate low impedance airflow pathways and sufficiently spaced from the printed circuit board to allow sufficient air flow to cool the plurality of components. 14. An electronic unit of claim 13 wherein the area within the chassis is less than 450 cubic inches. 15. An electronic unit of claim 9 wherein the air control device is generally planar and has at least one depression in the device such that the opening in the air control device is spaced from a planar surface of the air control device and closer in proximity to the printed circuit board and the at least one of the components with the thermal load than the remainder of the air control device. 16. An electronic unit of claim 9 wherein the air control device is formed of high thermal conductivity material to dissipate heat. 17. An electronic unit of claim 16 wherein the air control device contacts the at least one of the components having the high thermal load to draw heat from the at least one of the components. 18. An electronic unit of claim 9 wherein the air control device has a second air passage aperture in proximity to the edge of the air control device for passing air across portions of the printed circuit board spaced from the at least one of the components having the high thermal load and the at least one air passage aperture. 19. An electronic unit of claim 9 wherein the at least one air passage aperture is centered over the at least one of the components with the high thermal load. 20. An electronic unit of claim 9 wherein the air control device is configured to inhibit leakage of air over the printed circuit board without the plurality of components. 21. An electronic unit of claim 9 further comprising: an electromagnetic interference (EMI) cage for limiting unwanted radiation into and out of the electronic unit, wherein the air control device is located within the EMI cage for directing air to the at least one of the components with the high thermal load without EMI consideration; wherein the air control device is formed of high thermal conductivity material to dissipate heat; the at least one air passage aperture in the air control device is at least three air passage apertures overlying the printed circuit board, each of the at least three air passage apertures spaced and sized based on the location of the at least one of the components having the thermal load located on the printed circuit board; and the air control device is generally planar and has at least one depression in the air control device such that at least one of the air passage aperture in the air control device is spaced from a planar surface of the air control device and is closer in proximity to the printed circuit board and the at least one of the components with the thermal load than the remainder of the air control device. 22. An electronic unit of claim 21 wherein the air control device is spaced sufficiently close to the printed circuit board to effectively eliminate low impedance airflow pathways and sufficiently spaced from the printed circuit board to allow sufficient air flow to cool the at least one of the components with the high thermal load and the air control device contacts the at least one of the components with the high thermal load to draw heat from the at least one of the components with the high thermal load.