초록 ▼

A method is provided for attaching a membrane to a substrate by heat-bonding the membrane to the substrate. The substrate includes a top surface, a bottom surface and a receptacle therethrough. The membrane can be a porous support structure combined with a polymeric gel. The method includes the step

A method is provided for attaching a membrane to a substrate by heat-bonding the membrane to the substrate. The substrate includes a top surface, a bottom surface and a receptacle therethrough. The membrane can be a porous support structure combined with a polymeric gel. The method includes the steps of inserting a mandrel into the receptacle, placing the membrane on the substrate across the receptacle, heating the membrane and substrate, and allowing the substrate to cool to provide heat-bonded interlock between the substrate and the membrane.

대표청구항 ▼

What is claimed is: 1. A method for attaching a membrane to a substrate comprising the steps of: (a) providing a substrate having spaced apart top surface and bottom surface, and a receptacle therethrough; (b) inserting a mandrel into said receptacle without said mandrel excessively deforming the s

What is claimed is: 1. A method for attaching a membrane to a substrate comprising the steps of: (a) providing a substrate having spaced apart top surface and bottom surface, and a receptacle therethrough; (b) inserting a mandrel into said receptacle without said mandrel excessively deforming the shape of said receptacle; (c) placing a membrane comprising a polymeric composition combined with a support structure across said top surface of said substrate over said receptacle, wherein said support structure is a woven mesh-like construction having a network structure with voids or open areas therebetween for capturing said polymeric composition; (d) heating said membrane and said substrate, said heating being applied to a side of said membrane opposite said substrate; and (e) allowing said substrate to cool to provide a heat-bonded interlock between said substrate and said membrane, wherein said heating is applied conductively through a conductive medium placed on said membrane, and wherein said step of heating includes: contacting said medium with a heat-source for a length of time required to melt said substrate into a molten state forming a molten substrate, said molten substrate flowing into said support structure of said membrane and displacing a portion of said polymeric composition from said support structure, wherein, with cooling of said molten substrate located in said support structure, mechanical interactions being defined between said cooled molten substrate and said support structure. 2. The method of claim 1, wherein said heat-source contacts said medium for a time interval of less than about 6 seconds at a pressure range of about 10 psi to about 45 psi. 3. The method of claim 1, wherein said heat-source is a die. 4. The method of claim 1, further comprising the steps of cutting and removing excess membrane not heat-bonded and interlocked to said substrate. 5. The method of claim 1, wherein said heating is at a temperature of about 350�� F. to about 410�� F. 6. The method of claim 1, wherein said support structure is a polymeric material. 7. The method of claim 6, wherein said support structure is polyester. 8. The method of claim 1, wherein said polymeric composition is selected from a group consisting of polyacrylamide, chemically modified acrylamides, starch, dextrons, cellulose-based polymers, and combinations thereof. 9. The method of claim 1, wherein the step of providing said membrane comprises polymerizing said polymeric composition to said support structure. 10. The method of claim 1, wherein said substrate is selected from the group consisting of polyester, polyethylene, polypropylene, and combinations thereof. 11. The method of claim 1, wherein said substrate is a multiwell plate. 12. A method for attaching a membrane to a substrate comprising the steps of: (a) providing a polypropylene multiwell plate having a top surface, bottom surface, and a plurality of apertures therethrough; (b) inserting a mandrel into each of said apertures without said mandrels excessively deforming the shapes of said apertures; (c) placing a gel media across said top surface of said plate, wherein said gel media comprises a polyacrylamide gel attached to a polyester structure, wherein said polyester structure is a woven mesh-like construction having a network structure with voids or open areas therebetween for capturing said gel media; (d) heating said media and said plate, said heating being applied to a side of said media opposite said plate; and (e) allowing said plate to cool forming a heat-bonded interlock between said gel media and said plate, wherein at least one aperture is substantially covered at one end by said gel media, wherein said heating is applied conductively through a conductive medium placed on said gel membrane, and wherein said step of heating includes: contacting said conductive medium with a heated die for a length of time required to melt said multiwell plate forming a molten substrate, said molten substrate flowing into said polyester structure and displacing said gel from said polyester structure, wherein, with cooling of said molten substrate located in said polyester structure, mechanical interactions being defined between said cooled molten substrate and said polyester structure. 13. The method of claim 12, further comprising the steps of cutting and removing excess gel media. 14. The method of claim 12, wherein said step of contacting said heated die with said conductive medium is for about 6 seconds or less. 15. The method of claim 12, wherein said step of contacting said heated die with said conductive medium at pressures from about 10.0 psi to about 45.0 psi. 16. The method of claim 12, wherein said die is heated to a temperature of between about 390 F. to about 400 F. 17. The method of claim 1, wherein said conductive medium is a foil. 18. The method of claim 12, wherein said conductive medium is a foil.