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Method and apparatus for cooling with a phase change material and heat pipes

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-020/00
  • F28D-015/02
출원번호 US-0428004 (2006-06-30)
등록번호 US-7416017 (2008-08-26)
발명자 / 주소
  • Haws,James L.
  • Short, Jr.,Byron Elliott
출원인 / 주소
  • Raytheon Company
대리인 / 주소
    Baker Botts L.L.P.
인용정보 피인용 횟수 : 37  인용 특허 : 44

초록

A cooling apparatus (10) includes a housing defined by two aluminum parts (12, 13) which are brazed to each other. A plurality of sector-shaped recesses (21-28) are provided within the housing, and collectively define a chamber having a plurality of ribs (41-48) extending therethrough. Each recess c

대표청구항

What is claimed is: 1. An apparatus, comprising: a housing having a chamber therein, and having thereon an exterior surface through which heat can enter and leave said housing; a heat absorbing material disposed within said chamber in said housing; a heat pipe disposed completely within the chamber

이 특허에 인용된 특허 (44)

  1. Hamadah Talal T. (Littleton MA) Ryder Douglas N. (Amherst NH) Friedman Harvey S. (Sudbury MA), Apparatus for controlled air-impingement module cooling.
  2. Osterman Karl F. (Sundbyberg SEX), Arrangement in cooling circuit boards.
  3. Lebailly Michel (Bollene FRX) Taverdet Jean-Claude (Issirac FRX), Carrier for a card carrying electronic components and of low heat resistance.
  4. Haws James L. (McKinney TX) Fletcher Timothy C. (Garland TX) Yeh Lian-Tuu (Dallas TX) Darrouzet John L. (Dallas TX), Coldplate for cooling electronic equipment.
  5. Hamburgen William R. (Menlo Park CA), Composite graphite heat pipe apparatus and method.
  6. Wasserman Kurt J. (P.O. Box 77 Port Jervis NY 12771), Double tubular thermal energy storage element.
  7. Wong Harry (Monterey Park CA) Chang Stanley S. (Palos Verdes Estates CA) Chang Donald C. (Thousand Oaks CA) Kelly Kenneth C. (Sherman Oaks CA), EHF array antenna backplate including radiating modules, cavities, and distributor supported thereon.
  8. Alspaugh Thomas R. (4707 Otomi Ave. San Diego CA 92117), Energy storage system and method.
  9. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards and electronic components thereof.
  10. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  11. Forman Donald B. (San Diego CA) Holma Gary M. (San Diego CA), Grinding and polishing tool.
  12. Scanlon John F. (Roscoe IL) Warner Shawn A. (Rockford IL) Bengtson Alan D. (Rockford IL), Heat exchanger.
  13. Chen Shi-Li,TWX ; Hsiao Ming-Jer,TWX, Heat pipe circuit type thermal battery.
  14. Hermanns Bernd (Reichshof DEX) Michalak Stanislaw (Reichshof DEX), Heat storage mass for regenerative heat exchange.
  15. Hayes Claude Q. C. (7980 Linda Vista Rd. #49 San Diego CA 92111), Heat-absorbing heat sink.
  16. Claar Terry D. (Lisle IL) Petri Randy J. (Chicago IL), High-temperature direct-contact thermal energy storage using phase-change media.
  17. Cao Yiding (10900 SW. 104th St. #118 Miami FL 33176), Human body cooling suit with heat pipe transfer.
  18. Knoell Albert C. (La Crescenta CA) Loftin Timothy A. (Semi Valley CA), Hybrid metal matrix composite chassis structure for electronic circuits.
  19. Leo Bruno S. (Santa Monica CA) Liu Chang P. (Rancho Palos Verdes CA), Impingement cooled deformable laser mirror.
  20. Bland Timothy J. (Rockford IL) Niggemann Richard E. (Rockford IL), Impingement cooling apparatus for heat liberating device.
  21. Nemes Les E. (Buena Park CA), Integrated lightweight card rack.
  22. Glickler ; Sheldon L. ; DeBaryshe ; Paul G., Low distortion mirror for high power laser beams including a rear reflective surface.
  23. Hirvonen James K. (Rockport MA) Wittkower Andrew B. (Rockport MA) Denholm A. Stuart (Sherman CT), Method and apparatus for controlling article temperature during treatment in vacuum.
  24. Missele Carl (Elgin IL), Method for heatsinking a controlled collapse chip connection device.
  25. Sengupta Subrata (Coral Gables FL), Microencapsulated phase change material slurry heat sinks.
  26. Hulburd William G. (San Diego CA) Picoraro Theodore A. (El Cajon CA), Miniature heat exchanger.
  27. Altoz Frank E. (Baltimore MD), Module cooling system.
  28. Giammaruti Robert J. (North Canton OH), Passive cooling of enclosures using heat pipes.
  29. Christopher Nicholas S. (56 Page Farm Rd. Sherborn MA 01748), Passive cooling system.
  30. Hormansdorfer Gerd (Kastanieneck 6A D-3167 Bergdorf-Beinhorn DEX), Phase change materials and use thereof.
  31. Cherrette Alan R. (36-03 Ravens Crest Dr. Plainsboro NJ 08536), Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power.
  32. Sachar, Kenneth S.; Silvestri, Victor J., Porous film heat transfer.
  33. Kuzay Tuncer M. (Naperville IL), Process of making cryogenically cooled high thermal performance crystal optics.
  34. Basiulis Algerd (Redondo Beach CA), Rechargeable thermal control system.
  35. Rosenfeld John H. (Lancaster PA), Single phase porous layer heat exchanger.
  36. Abhat ; Ashok ; Neuer ; Gunther, Storage arrangement for thermal energy.
  37. Friefeld Jerome M. (Agoura CA) Silverman Jacob (Woodland Hills CA), Storing and extracting latent heat.
  38. Nakajima Tadakatsu (Ibaraki JPX) Nakayama Wataru (Kashiwa JPX) Oohashi Shigeo (Ibaraki JPX) Kuwabara Heikichi (Ibaraki JPX) Daikoku Takahiro (Usiku JPX), Thermal conduction device.
  39. Faghri Amir (Dayton OH), Thermal energy storage heat exchanger.
  40. Faghri Amir (Dayton OH), Thermal energy storage system.
  41. Asakawa Stuart D. (San Diego CA) Mohr John A. (Lincoln NE) Stoffel John L. (San Diego CA) Kappele William D. (Loveland CO) Mueller Bruce E. (Escondido CA) Firl Gerold G. (Poway CA), Thermal ink jet print device having phase change cooling.
  42. Boardman Bryan J. (Chadds Ford PA), Thermal storage material and process for making.
  43. Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz ; Jr. John E. (Anaheim CA), Transistor cooling by heat pipes having a wick of dielectric powder.
  44. Akachi Hisateru (No. 6-5-603 ; Kamitsuruma 5-chome Sagamihara City ; Kanagawa Perfecture JPX), Tunnel-plate type heat pipe.

이 특허를 인용한 특허 (37)

  1. Vranjes, Miron; Jones, Oliver R.; Sundelin, Nils Anders; Sareen, Chaitanya Dev; Frederickson, Steven J., Adaptive sizing and positioning of application windows.
  2. Robbins, Steven John; Westerinen, William J.; Hanson, Lisa M.; Son, Sung Ho; Wattles, Richard J., Augmented reality and physical games.
  3. Robbins, Steven John, Auto-stereoscopic augmented reality display.
  4. Leimkuehler, Thomas Orville; Morin, Thomas William; Anderson, Grant A., Cooling systems.
  5. Leimkuehler, Thomas Orville; Morin, Thomas William; Anderson, Grant A., Cooling systems.
  6. Kostamo, Pasi, Display system.
  7. Levola, Tapani, Display system.
  8. Levola, Tapani; Saarikko, Pasi, Display system.
  9. Levola, Tapani; Vallius, Tuomas; Saarikko, Pasi, Display system.
  10. Wood, Adam C., Encapsulated phase change material heat sink and method.
  11. Rubenstein, Brandon A., Heat transfer device.
  12. Rubenstein, Brandon A.; Stellman, Jeffrey Taylor, Heat transfer device with phase change material.
  13. Fleck, Rod G.; Bohn, David D.; Nowatzyk, Andreas G., Imaging structure color conversion.
  14. Fleck, Rod G.; Bohn, David D., Imaging structure emitter calibration.
  15. Fleck, Rod G.; Bohn, David D., Imaging structure emitter calibration.
  16. Bohn, David D.; Fleck, Rod G., Imaging structure emitter configurations.
  17. Bohn, David D.; Fleck, Rod G., Laser illumination scanning.
  18. Sagneri, Anthony; Green, Vanessa, Method and apparatus for controlling heat in power conversion systems.
  19. Sainiemi, Lauri; Levola, Tapani; Saarikko, Pasi, Microfabrication.
  20. Westerinen, William J.; Robbins, Steven John; Badyal, Rajeev; Fleck, Rod G., Mobile device light guide display.
  21. Robbins, Steven John, Multiple waveguide imaging structure.
  22. Kostamo, Pasi; Tervonen, Ari J., Optical components.
  23. Saarikko, Pasi; Kostamo, Pasi, Optical components.
  24. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  25. Evans, Jeremy T.; Wood, Adam C.; Boyack, Chad E.; Piekarski, Richard, Phase change material heat sink using additive manufacturing and method.
  26. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  27. Bohn, David D., Pixel opacity for augmented reality.
  28. Giaimo, III, Edward C.; He, Yi; Evans, Duane Martin; Delano, Andrew D., Sensed sound level based fan speed adjustment.
  29. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  30. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  31. Chen, Kevin W.; Harokopus, William P.; Cunningham, Patrick W., Thermal dissipation mechanism for an antenna.
  32. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  33. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  34. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  35. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  36. Saarikko, Pasi; Kostamo, Pasi, Waveguide.
  37. Levola, Tapani; Saarikko, Pasi; Robbins, Steven John; Poon, Yarn Chee; Wolfe, Lena Adele; Towle, Erica Lee, Wearable image display system.
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