초록 ▼

Apparatus and methods of using lasers are provided for spalling and drilling holes into rocks. A rock removal process is provided that utilizes a combination of laser-induced thermal stress and laser induced superheated steam explosions just below the surface of the laser/rock interaction to spall t

Apparatus and methods of using lasers are provided for spalling and drilling holes into rocks. A rock removal process is provided that utilizes a combination of laser-induced thermal stress and laser induced superheated steam explosions just below the surface of the laser/rock interaction to spall the rock into small fragments that can then be easily removed by a purging flow. Single laser beams of given irradiance spall rock and create holes having diameter and depth approximately equal to the beam spot size. A group of the single laser beams are steered in a controllable manner by an electro-optic laser beam switch to locations on the surface of the rock, creating multiple overlapping spalled holes thereby removing a layer of rock of a desired diameter. Drilling of a deep hole is achieved by spalling consecutive layers with an intermittent feed motion of the laser head perpendicular to the rock surface.

대표청구항 ▼

What is claimed is: 1. A method for spalling and drilling holes into rock formations comprising the steps of: providing a short illumination of a unitary laser beam for spalling the rock formation to create a hole about as large as the beam spot size and about as deep as the hole diameter; steering

What is claimed is: 1. A method for spalling and drilling holes into rock formations comprising the steps of: providing a short illumination of a unitary laser beam for spalling the rock formation to create a hole about as large as the beam spot size and about as deep as the hole diameter; steering the unitary laser beam in a controllable pattern using an electro-optic high power laser beam switch to a plurality of locations on a target surface of the rock formation to create multiple spalled holes on the target surface illuminated by the unitary laser beam; and removing spalled rock fragments using a purging and flushing system, and creating a clear beam path for the unitary laser beam with said purging and flushing system. 2. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein steering the unitary laser beam includes creating multiple overlapping spalled holes on the target surface to remove a layer of rock of a desired diameter. 3. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein steering the unitary laser beam further includes providing an intermittent feed motion of a laser head perpendicular to spalled holes on the target surface to spall consecutive layers of rock for deep hole drilling. 4. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein the unitary laser beam has an irradiance in the range between 1000 W/cm2 and 5000 W/cm2. 5. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein the step of steering the unitary laser beam in said controllable pattern by said electro-optic high power laser beam switch to said plurality of locations on said target surface of the rock formation to create multiple spalled holes on the target surface illuminated by the unitary laser beam includes the steps of sequentially overlapping multiple laser spalled holes to remove a large diameter layer of rock that is as deep as the diameter of a single spalled hole. 6. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein the step of steering the unitary laser beam in said controllable pattern by said electro-optic high power laser beam switch to said plurality of locations on said target surface of the rock formation to create multiple spalled holes on the target surface illuminated by the unitary laser beam includes the steps of sequentially overlapping multiple laser spalled holes at an overlapping rate in the range between 2 and 10%. 7. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein the step of steering the unitary laser beam in a said controllable pattern by said electro-optic high power laser beam switch to said plurality of locations on said target surface of the rock formation to create multiple spalled holes on the target surface illuminated by the unitary laser beam includes the step of sequentially removing multiple rock layers by repeating the steering of the laser beam to create multiple spalled holes on the target surface illuminated by the unitary laser beam of each sequential layer. 8. A method for spalling and drilling holes into rock formations as recited in claim 1 wherein the step of providing said short illumination of said unitary laser beam includes the steps of providing a kilowatt level laser beam delivered by a single fiber optic cable. 9. Apparatus for spalling and drilling holes into rock formations comprising: a laser for generating a kilowatt level power unitary laser beam for spalling the rock formation to create a hole about as large as the beam spot size and about as deep as the hole diameter; a single fiber optic cable for delivering the kilowatt level power unitary laser beam to a target surface of a rock within a borehole; a beam shaping optics package for focusing and orienting the unitary laser beam; a purging flow to remove spalled rock fragments and to create a clear laser beam path while lasing through liquid and dust to the target surface; and an electro-optical laser beam switch for steering the unitary laser beam in a predefined pattern to create multiple spalled holes on the target surface illuminated by the unitary laser beam. 10. Apparatus for spalling and drilling holes into rock formations as recited in claim 9 wherein said electro-optical laser beam switch steers the unitary laser beam in the predefined pattern, eliminating mechanical motions. 11. Apparatus for spalling and drilling holes into rock formations as recited in claim 9 includes an enclosure for containing said electro-optical laser beam switch, and said beam shaping optics package.