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Process and apparatus for treating a workpiece with gases 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/00
출원번호 US-0870173 (2004-06-18)
등록번호 US-7416611 (2008-08-26)
발명자 / 주소
  • Bergman,Eric J.
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Perkins Coie
인용정보 피인용 횟수 : 5  인용 특허 : 102

초록

In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. T

대표청구항

The invention claimed is: 1. A method for cleaning a workpiece comprising: heating a liquid to a temperature ranging from 50�� C. to about 200�� C.; placing the workpiece into a chamber; moving the liquid in a fluid flow line to the chamber; entraining ozone gas into the liquid by injecting ozone g

이 특허에 인용된 특허 (102)

  1. Schwartzkopf George (Franklin Township ; Warren County NJ), Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened r.
  2. Tomita, Hiroshi; Nadahara, Soichi; Shirakashi, Mitsuhiko; Ito, Kenya; Inoue, Yuki, Apparatus and method for cleaning semiconductor substrate.
  3. Toshima Masato, Apparatus and method for cleaning semiconductor wafers.
  4. Satoh Kiyoshi,JPX, Apparatus and method for forming thin film.
  5. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  6. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  7. Hiroki Taniyama JP, Apparatus and method for washing substrate.
  8. Lyon Richard K. (Pittstown NJ), Apparatus and methods for incineration of toxic organic compounds.
  9. Yoshitani Mitsuaki,JPX ; Kinose Kazuo,JPX ; Tanaka Satoru,JPX ; Morinishi Kenya,JPX ; Miyagi Masahiro,JPX ; Itami Naoshige,JPX ; Watanabe Kazuhiro,JPX, Apparatus for and method of cleaning substrate.
  10. Dussault Jean G. M. (Naugatuck CT) Geckle Robert A. (Newtown CT) Puskas William L. (Trumbull CT), Apparatus for cleaning workpieces by ultrasonic energy.
  11. Nakajima Takahito (Yokohama JPX) Fukazawa Yuji (Yokohama JPX), Apparatus for subjecting a semiconductor substrate to a washing process.
  12. Matthews Robert Roger, Apparatus for the treatment of semiconductor wafers in a fluid.
  13. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Apparatus for treating wafers with process fluids.
  14. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Arrangement for cleaning semiconductor wafers using mixer.
  15. Kaiser Robert (Winchester MA), Automatic precision cleaning apparatus with continuous on-line monitoring and feedback.
  16. Slinn David S. L. (Bristol GB3), Cleaning and drying of electronic assemblies.
  17. Netsu Shigeyoshi,MYX ; Harada Yasuyuki,JPX ; Shiba Kazuhiko,JPX, Cleaning apparatus and a cleaning method.
  18. Kobayashi Kanji,JPX ; Yamaguchi Masao,JPX ; Yoshihara Shinya,JPX ; Kubota Toshio,JPX ; Kudo Jun,JPX, Cleaning apparatus and method.
  19. Leon Vincent G. ; Honda Kenji ; Rothgery Eugene F., Cleaning composition and method for removing residues.
  20. Ohmi Tadahiro,JPX ITX 980, Cleaning device and method.
  21. Sugihara Yasuo,JPX ; Tanaka Kazushige,JPX ; Sakuma Ikue,JPX, Cleaning fluid for semiconductor substrate.
  22. Ohmi Tadahiro,JPX ; Omae Shunkichi,JPX ; Jizaimaru Takayuki,JPX ; Nitta Takahisa,JPX, Cleaning liquid and cleaning method.
  23. Mori Shinichi (27-52 ; Kinugawa 1-chome Otsu-shi ; Shiga JPX) Nomura Tomohiro (1-1-10 ; Tsukamoto Yodogawa-ku ; Osaka-shi ; Osaka JPX), Cleaning process.
  24. Torek, Kevin J.; Morgan, Jonathan C.; Morgan, Paul A., Delivery of dissolved ozone.
  25. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  26. Sumnitsch Franz,ATX, Device for treatment of wafer-shaped articles, especially silicon wafers.
  27. Matsukawa Hiroyuki (Kumamoto JPX) Yonemizu Akira (Kumamoto JPX) Matsushita Michiaki (Yatsushiro JPX) Fujimoto Akihiro (Kumamoto JPX) Takekuma Takashi (Yamaga JPX) Yaegashi Hidetami (Kokubunji JPX) Fu, Double-sided substrate cleaning apparatus.
  28. Matsukawa Hiroyuki,JPX ; Yonemizu Akira,JPX ; Matsushita Michiaki,JPX ; Fujimoto Akihiro,JPX ; Takekuma Takashi,JPX ; Yaegashi Hidetami,JPX ; Fukuda Takahide,JPX, Double-sided substrate cleaning apparatus and cleaning method using the same.
  29. Bergman Eric J. (Kalispell MT), Dynamic semiconductor wafer processing using homogeneous mixed acid vapors.
  30. Yoneda Kenji,JPX, Equipment for cleaning, etching and drying semiconductor wafer and its using method.
  31. Ohno, Reiko; Matsuoka, Terumi, Film removing method and film removing agent.
  32. Caimi Raoul E. B. ; Lin Feng-Nan ; Thaxton Eric A., Gas-liquid supersonic cleaning and cleaning verification spray system.
  33. Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX), Gaseous process and apparatus for removing films from substrates.
  34. Lin Burn J. (Austin TX), In situ resist control during spray and spin in vapor.
  35. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W., Liquid carbon dioxide cleaning using jet edge sonic whistles at low temperature.
  36. Brian A. Vaartstra, Metal complexes with chelating O-and/or N-donor ligands.
  37. Schoeppel John F. (San Rafael CA), Method and apparatus for cleaning surfaces to absolute or near-absolute cleanliness.
  38. Fishkin Boris ; Tang Jianshe ; Brown Brian J., Method and apparatus for cleaning the edge of a thin disc.
  39. Kanno Itaru,JPX ; Aoyama Tetsuo,JPX ; Hada Mayumi,JPX, Method and apparatus for manufacturing semiconductor device.
  40. Omi Tadahiro (Miyagi JPX) Shimada Makoto (Tokyo JPX) Sawamoto Isao (Kanagawa JPX), Method and apparatus for sterilization of and treatment with ozonized water.
  41. Boyers,David G.; Cremer, Jr.,Jay Theodore, Method and apparatus for treating a substrate with an ozone-solvent solution.
  42. Schild Robin (Villingen-Schwenningen DEX) Kozak Milan (Hufingen DEX) Durst Johann (Donaueschingen DEX), Method and device for chemically treating substrates.
  43. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Method and system for fluid treatment of semiconductor wafers.
  44. Stanford Thomas B. (San Pedro CA) George ; Jr. Richard C. (Topanga CA) Shinno Jennifer I. (Canoga Park CA) Mehta Dhiren C. (Cypress CA) Rodine Gifford W. (El Segundo CA), Method and system for removing contaminants.
  45. Yuji Fukazawa JP, Method for cleaning a semiconductor substrate.
  46. Kodama Hiroyuki (Yokohama JPX), Method for cleaning a substrate.
  47. Ham William E. (Mercerville NJ), Method for cleaning and drying semiconductors.
  48. Fukazawa Yuji,JPX ; Nakajima Takahito,JPX ; Takase Kazuhiko,JPX, Method for cleaning semiconductor wafers.
  49. Shinagawa Keisuke,JPX ; Fujimura Shuzo,JPX ; Matoba Yuuji,JPX ; Nakano Yoshimasa,JPX ; Takeuchi Tatsuya,JPX ; Miyanaga Takeshi,JPX, Method for controlling apparatus for supplying steam for ashing process.
  50. Matthews John C. (Gaithersburg MD) Wooten Robert D. (Rockville MD) Ferris David S. (Washington DC) Rounds Stuart N. (Germantown MD), Method for photoresist stripping using reverse flow.
  51. Bergman, Eric J.; Hess, Mignon P., Method for processing the surface of a workpiece.
  52. Ito Tatsuo (Niigata JPX) Nakazato Yasuaki (Nagano JPX), Method for production of bonded wafer.
  53. DeGendt, Stefan; Knotter, Dirk; Heyns, Marc; Meuris, Marc; Mertens, Paul, Method for removing organic contaminants from a semiconductor surface.
  54. Kashiwase Masaharu (Okayama JPX) Matsuoka Terumi (Okayama JPX), Method for removing organic film.
  55. Verhaverbeke Steven ; Heyns Mark,BEX ; Hendriks Menso,NLX ; de Blank Rene,BEX, Method for semiconductor processing using mixtures of HF and carboxylic acid.
  56. Steven L. Nelson ; Kurt K. Christenson, Method for treating a substrate with heat sensitive agents.
  57. Bergman, Eric J.; Hess, Mignon P., Method for treating the surface of a workpiece.
  58. Wong Man (Dallas TX), Method for vapor phase etching of silicon.
  59. Maekawa Toshiro,JPX ; Ono Koji,JPX ; Tsujimura Manabu,JPX, Method of and apparatus for cleaning workpiece.
  60. Koizumi Kootaroo (Kodaira JPX) Tsunekawa Sukeyoshi (Tokorozawa JPX) Kawasumi Kenichi (Oume JPX) Kimura Takeshi (Higashimurayama JPX) Funatsu Keisuke (Hamura JPX), Method of and apparatus for removing an organic film.
  61. Kaneko Yoshio (Chiba JPX) Koda Munetaka (Chiba JPX) Shiraishi Tadayoshi (Chiba JPX) Murakami Takehiro (Chiba JPX), Method of cleaning semiconductor substrate and apparatus for carrying out the same.
  62. Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
  63. Hasebe Keizo (Kofu JPX) Fujimoto Akihiro (Kumamoto-ken JPX) Inada Hiroichi (Kumamoto JPX) Iino Hiroyuki (Nirasaki JPX) Kitamura Shinzi (Kumamoto-ken JPX) Deguchi Masatoshi (Kumamoto JPX) Nambu Mitsuh, Method of forming coating film and apparatus therefor.
  64. Kashkoush, Ismail; Novak, Richard; Nemeth, Dennis; Chen, Gim-Syang, Method of processing substrates using pressurized mist generation.
  65. Hada Mayumi,JPX ; Hasemi Ryuji,JPX ; Ikeda Hidetoshi,JPX ; Aoyama Tetsuo,JPX, Method of producing semiconductor device and rinse for cleaning semiconductor device.
  66. Tanaka Masato (Shiga JPX), Method of treating surface of rotating wafer using surface treating gas.
  67. Bergman Eric J., Methods for cleaning semiconductor surfaces.
  68. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  69. Bergman, Eric J., Methods for processing a workpiece using steam and ozone.
  70. McNeilly Michael A. ; deLarios John M. ; Nobinger Glenn L. ; Krusell Wilbur C. ; Kao Dah-Bin ; Manriquez Ralph K. ; Fan Chiko, Organic preclean for improving vapor phase wafer etch uniformity.
  71. Sawamoto Isao (Kanagawa JPX), Ozone water treatment method and apparatus.
  72. Kosofsky Howard B. ; Shrieber Lawrence A. ; Rhodes Richard O. ; Damron Michael D. ; Garcia Eduardo M., Pressure washing apparatus with ozone generator.
  73. Schellenberger Wilhelm,DEX ; Herrmannsdorfer Dieter,DEX, Procedure for the drying of silicon.
  74. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  75. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
  76. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Process and apparatus for treating wafers with process fluids.
  77. Li Li ; Hawthorne Richard C., Process for dry cleaning wafer surfaces using a surface diffusion layer.
  78. Grant Robert W. (Excelsior MN) Torek Kevin (State College PA) Novak Richard E. (Plymouth MN) Ruzyllo Jerzy (State College PA), Process for etching oxide films in a sealed photochemical reactor.
  79. Szwejkowski Chester (Palisades NY) Latchford Ian S. (Cupertino CA) Namose Isamu (Nagano JPX) Tsuchida Kazumi (Narita JPX), Process for removal of residues remaining after etching polysilicon layer in formation of integrated circuit structure.
  80. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
  81. Eric J. Bergman, Process for treating a workpiece with hydrofluoric acid and ozone.
  82. Matthews Robert Roger, Process for treatment of semiconductor wafers in a fluid.
  83. Bergman Eric J. ; Berner Robert W. ; Oberlitner David, Semiconductor processing using vapor mixtures.
  84. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
  85. Manako Kazuyoshi,JPX, Semiconductor wafer cleaning liquid.
  86. Arii Katsuyuki (Tama JPX), Spinner and method for processing a substrate.
  87. Lorimer D\Arcy (Santa Clara CA), Steam generator.
  88. Jang, Won-Ick; Choi, Chang-Auck; Jun, Chi-Hoon; Kim, Youn-Tae; Lee, Myung-Lae, Stiction-free microstructure releasing method for fabricating MEMS device.
  89. Kamikawa Yuji,JPX ; Kitahara Shigenori,JPX ; Ueno Kinya,JPX, Substrate processing apparatus and substrate processing method.
  90. Ueyama Tsutomu,JPX ; Izumi Akira,JPX ; Adachi Hideki,JPX, Substrate spin treating apparatus.
  91. Matsuno, Kousaku; Iga, Masao, Substrate treatment process and apparatus.
  92. Dobson Jesse C. (Oakland CA), Sulfuric acid reprocessor.
  93. Yamaguchi Sumio (Tokyo JPX) Inada Akio (Tokyo JPX) Kawasumi Kenichi (Ome JPX), Surface treatment apparatus.
  94. Grebinski Thomas J. (Sunnyvale CA), Surface treatment to remove impurities in microrecesses.
  95. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  96. Nelson Steven L. ; Christenson Kurt K., System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in.
  97. Izumi Akira,JPX ; Kawakatsu Tetsuo,JPX, Ultrasonic vibrator, ultrasonic cleaning nozzle, ultrasonic cleaning device, substrate cleaning device, substrate cleani.
  98. Kurokawa Hideaki (Hitachi JPX) Ebara Katsuya (Mito JPX) Takahashi Sankichi (Hitachi JPX) Matsuzaki Harumi (Hitachi JPX) Yoda Hiroaki (Tsuchiura JPX) Nitta Takahisa (Fuchu JPX) kouchi Isao (Hitachi JP, Vapor washing process and apparatus.
  99. Bran Mario E., Wafer cleaning method.
  100. Miyazaki Takeshiro,JPX ; Tsubata Yoshikazu,JPX ; Kawakita Akio,JPX ; Katsumata Noboru,JPX ; Nakayama Akihiro,JPX ; Harada Toyokazu,JPX ; Takaku Mitsuo,JPX ; Yoshida Syunso,JPX, Wafer processing system.
  101. Miki Nobuhiro,JPX ; Nitta Takahisa,JPX ; Harada Yasuyuki,JPX ; Ohmi Tadahiro,JPX, Washing apparatus and washing method.
  102. Tuunanen Jukka (Helsinki FIX) Narvanen Ale (Helsinki FIX) Geysen Mario (Clayton AUX), Washing device.

이 특허를 인용한 특허 (5)

  1. Ikuta, Yoshiaki, Apparatus and method for cleaning substrate.
  2. Glinsner, Thomas; Holzleitner, Ronald; Wieser, Thomas; Schmid, Florian, Device and method for treating substrate surfaces.
  3. Lee, Keum Joo; Bae, Jin Hye; Kang, Dae Keun, Methods of cleaning a semiconductor device and methods of manufacturing a semiconductor device using the same.
  4. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  5. Hotzel, Arthur, Vapor clean for haze and particle removal from lithographic photomasks.
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