IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0302849
(2005-12-14)
|
등록번호 |
US-7417863
(2008-08-26)
|
우선권정보 |
KR-10-2004-0105663(2004-12-14) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Samsung Electronics Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
11 |
초록
▼
Disclosed is a cooling device for a folder type portable wireless terminal including a main body and an openable folder coupled with the main body. In the cooling device, a cooling plate is installed in the folder with a predetermined size, and a heat transfer element has one end connected to the co
Disclosed is a cooling device for a folder type portable wireless terminal including a main body and an openable folder coupled with the main body. In the cooling device, a cooling plate is installed in the folder with a predetermined size, and a heat transfer element has one end connected to the cooling plate and the other end connected to a predetermined portion of a mainboard of the main body to transfer heat generated from the mainboard to the cooling plate.
대표청구항
▼
What is claimed is: 1. A cooling device for a portable wireless terminal including a main body and an openable folder coupled with the main body, the cooling device comprising: a cooling plate installed in the folder; and a heat transfer element having one end connected to the cooling plate and an
What is claimed is: 1. A cooling device for a portable wireless terminal including a main body and an openable folder coupled with the main body, the cooling device comprising: a cooling plate installed in the folder; and a heat transfer element having one end connected to the cooling plate and an other end connected to a mainboard of the main body to transfer heat from the mainboard to the cooling plate, wherein the folder includes a printed circuit board (PCB) on which at least one liquid crystal display (LCD) module is mounted, and the cooling plate is installed on a portion of the PCB where the LCD module is not installed. 2. The cooling device of claim 1, wherein the other end of the heat transfer element is connected in the proximity of at least one heat-generating component of the mainboard. 3. The cooling device of claim 2, wherein the heat transfer element is made of an electrically non-conductive material with a high thermal conductivity. 4. The cooling device of claim 3, wherein the heat transfer element is made of a material selected from the group consisting of silicon rubber and graphite. 5. The cooling device of claim 4, wherein the heat transfer element is coated with an electrically non-conductive film to protect the heat transfer element during opening and closing motions of the folder. 6. The cooling device of claim 1, wherein the cooling plate is larger than the PCB of the folder. 7. The cooling device of claim 6, wherein if the PCB of the folder is mounted with a main LCD module at a front surface and a slave LCD module at a back surface, the cooling plate is attached to the back surface, the cooling plate defining an opening through which the slave LCD module is inserted. 8. The cooling device of claim 7, wherein the cooling plate includes convex portions and concave portions that are alternately arranged on a top surface thereof. 9. The cooling device of claim 1, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 10. The cooling device of claim 2, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 11. The cooling device of claim 3, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 12. The cooling device of claim 4, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 13. The cooling device of claim 5, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 14. The cooling device of claim 1, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 15. The cooling device of claim 6, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 16. The cooling device of claim 7, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 17. The cooling device of claim 8, wherein the cooling plate is made of a material selected from the group consisting of magnesium, silver, gold, copper, aluminum, tungsten, combinations and alloys thereof. 18. A folder type portable wireless terminal provided with a cooling device, comprising: a main body in which a mainboard is installed; an openable folder coupled with the main body; a cooling plate installed in the folder; and a heat transfer element having one end connected to the cooling plate and an other end connected to the mainboard to transfer heat from the mainboard to the cooling plate, wherein the folder includes a printed circuit board (PCB) on which at least one liquid crystal display (LCD) module is mounted, and the cooling plate is installed on a portion of the PCB where the LCD module is not installed. 19. A folder type portable wireless terminal comprising: a main body having a compartment in which a mainboard is installed; an openable folder coupled with the main body; a cooling plate installed in the folder; and a heat transfer element having one end connected to the cooling plate and another end connected to the mainboard to transfer heat from the compartment of the main body to the cooling plate, wherein the folder includes a printed circuit board (PCB) on which at least one liquid crystal display (LCD) module is mounted, and the cooling plate is installed on a portion of the PCB where the LCD module is not installed.
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