Determining layer thickness using photoelectron spectroscopy
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01N-023/227
G01N-023/22
출원번호
US-0118035
(2005-04-29)
등록번호
US-7420163
(2008-09-02)
발명자
/ 주소
Schueler,Bruno
출원인 / 주소
ReVera Incorporated
대리인 / 주소
Blakely, Sokoloff, Taylor & Zafman LLP
인용정보
피인용 횟수 :
12인용 특허 :
12
초록▼
According to one embodiment of the invention, photoelectron spectroscopy is used to determine the thickness of one or more layers in a single or multi-layer structure on a substrate. The thickness may be determined by measuring the intensities of two photoelectron species or other atom-specific char
According to one embodiment of the invention, photoelectron spectroscopy is used to determine the thickness of one or more layers in a single or multi-layer structure on a substrate. The thickness may be determined by measuring the intensities of two photoelectron species or other atom-specific characteristic electron species emitted by the structure when bombarded with photons. A predictive intensity function that is dependent on the thickness of a layer is determined for each photoelectron species. A ratio of two predictive intensity functions is formulated, and the ratio is iterated to determine the thickness of a layer of the structure. According to one embodiment, two photoelectron species may be measured from a single layer to determine a thickness of that layer. According to another embodiment, two photoelectron species from different layers or from a substrate may be measured to determine a thickness of a layer.
대표청구항▼
What is claimed is: 1. A method for determining a thickness of a layer using electron spectroscopy comprising: determining a first predictive intensity function for a first electron species of the layer dependent on the thickness of the layer; determining a second predictive intensity function for
What is claimed is: 1. A method for determining a thickness of a layer using electron spectroscopy comprising: determining a first predictive intensity function for a first electron species of the layer dependent on the thickness of the layer; determining a second predictive intensity function for a second electron species of the layer dependent on the thickness of the layer; determining a ratio of the first and second predictive intensity functions; and iterating the ratio to determine the thickness of the layer, wherein a first measured intensity of the first electron species and a second measured intensity of the second electron species are also used to determine the thickness of the layer. 2. The method of claim 1, wherein the first predictive intensity function and the second predictive intensity function are also dependent on an electron attenuation length (EAL) of the layer and a measured intensity of an electron species emitted by a layer having infinite thickness. 3. The method of claim 2, wherein the first predictive intensity function and the second predictive intensity function are dependent on an intensity of an electron emitted by a layer thicker than ten nanometers (nm). 4. The method of claim 3, wherein the first predictive intensity function and the second predictive intensity function are of the form: 5. The method of claim 1, wherein the first measured intensity and the second measured intensity are fitted and wherein the first measured intensity and the second measured intensity are subject to background subtraction. 6. The method of claim 1, further comprising: measuring the first measured intensity of the first electron species and the second measured intensity of the second electron species using x-ray photoelectron spectroscopy (XPS). 7. The method of claim 1, further comprising: measuring the first measured intensity of the first electron species and the second measured intensity of the second electron species using Auger electron spectroscopy (AES). 8. A method for determining a thickness of a layer in a multi-layer structure comprising: determining a first predictive intensity function for a first characteristic electron species of the layer dependent on the thickness of the layer; determining a second predictive intensity function for a second characteristic electron species of the multi-layer structure; measuring a first intensity of the first characteristic electron species and a second intensity of the second characteristic electron species using x-ray photoelectron spectroscopy (XPS) or other electron spectroscopy; determining a ratio of the first and second predictive intensity functions; and iterating the ratio to determine the thickness of the layer, wherein the first intensity of the first characteristic electron species and the second intensity of the second characteristic electron species are also used to determine the thickness of the layer, wherein if the layer is beneath a second layer of the multi-layer structure, determining the first predictive intensity function including an attenuation factor dependent on a thickness of the second layer, wherein the second layer comprises an oxide of silicon, wherein the thickness of the second layer is given by: description="In-line Formulae" end="lead"tSiO2=sin(α) ln[(I(Si0)/I(Si4+)*k+1].description="In-line Formulae" end="tail" 9. The method of claim 8, wherein the second characteristic electron species is of a substrate of the multi-layer structure. 10. The method of claim 8, wherein the first predictive intensity function is given by: 11. The method of claim 8, wherein the second characteristic electron species is of a third layer beneath the layer, and wherein the second predictive intensity function includes an attenuation factor dependent on the thickness of the layer. 12. The method of claim 9, wherein the second predictive intensity function includes an attenuation factor dependent on the thickness of the layer. 13. The method of claim 12, wherein the second predictive intensity function includes a second attenuation factor dependent on a thickness of a third layer between the substrate and the layer. 14. A method for determining a thickness of a layer in a multi-layer structure comprising: bombarding the structure with radiation; analyzing electrons ejected by the structure including a first electron species ejected by the layer and a second electron species ejected by the structure, wherein the multi-layer structure includes the layer over a second layer comprising a silicon oxide; determining a first predictive intensity function for the first electron species dependent on a thickness of the layer and a second predictive intensity function for the second electron species; formulating a ratio of the first and second predictive intensity functions; iterating the ratio to determine the thickness of the layer; determining a thickness of the second layer using tSiO2=sin(α) ln[(I(Si0) /I(Si4+)* k+1]; and determining a thickness of the layer using the ratio, wherein the first electron species is emitted by the layer and the first predictive intensity function is given by wherein the second predictive intensity function is given by: 15. The method of claim 14, wherein bombarding the structure comprises: bombarding the structure with x-rays using XPS; wherein the first electron species and the second electron species are photoelectrons. 16. The method of claim 14, wherein bombarding the structure comprises: bombarding the structure with electrons using Auger electron spectroscopy; wherein the first electron species and the second electron species are Auger electrons. 17. The method of claim 14, wherein the multi-layer structure includes a third layer over the layer. 18. The method of claim 14, wherein the second electron species is emitted by a substrate of the structure. 19. A method for determining a thickness of a layer in a multi-layer structure comprising: bombarding the structure with radiation; analyzing electrons ejected by the structure including a first electron species and a second electron species, wherein the first electron species and the second electron species are both emitted by the layer; determining a first predictive intensity function for the first electron species dependent on a thickness of the layer and a second predictive intensity function for the second electron species dependent on the thickness of the layer; formulating a ratio of the first and second predictive intensity functions; and iterating the ratio to determine the thickness of the layer. 20. The method of claim 19, further comprising: analyzing a third electron species emitted by a second layer beneath the layer; determining a third predictive intensity function dependent on the thickness of the layer; formulating a ratio including the third predictive intensity function and one of the first and second predictive intensity functions; iterating the ratio to determine a thickness of the second layer. 21. The method of claim 20, wherein the third predictive intensity function is given by: 22. A machine readable medium having stored thereon executable program code which, when executed, causes a machine to perform a method for determining a thickness of a layer using electron spectroscopy, the method comprising: determining a first predictive intensity function for a first electron species of the layer dependent on the thickness of the layer; determining a second predictive intensity function for a second electron species of the layer dependent on the thickness of the layer; determining a ratio of the first and second predictive intensity functions; and iterating the ratio to determine the thickness of the layer, wherein a first measured intensity of the first electron species and a second measured intensity of the second electron species are also used to determine the thickness of the layer. 23. The machine readable medium of claim 22, wherein the first predictive intensity function and the second predictive intensity function are also dependent on an electron attenuation length (EAL) of the layer and a measured intensity of an electron species emitted by a layer having infinite thickness. 24. The machine readable medium of claim 23, wherein the first predictive intensity function and the second predictive intensity function are dependent on an intensity of an electron emitted by a layer thicker than ten nanometers (nm). 25. The machine readable medium of claim 24, wherein the first predictive intensity function and the second predictive intensity function are of the form: 26. The machine readable medium of claim 22, wherein the first measured intensity and the second measured intensity are fitted and wherein the first measured intensity and the second measured intensity are subject to background subtraction. 27. The machine readable medium of claim 22, the method further comprising: measuring the first measured intensity of the first electron species and the second measured intensity of the second electron species using x-ray photoelectron spectroscopy (XPS). 28. The machine readable medium of claim 22, the method further comprising: measuring the first measured intensity of the first electron species and the second measured intensity of the second electron species using Auger electron spectroscopy (AES).
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (12)
Patterson Joseph M. (Mission Viejo CA), Apparatus including a focused UV light source for non-contact measurement and alteration of electrical properties of con.
Leonid A. Vasilyev ; Charles E. Bryson, III ; Robert Linder ; Sergey Borodyansky ; Dmitri Klyachko, Measurement of film thickness by inelastic electron scattering.
Nixon Mark ; Jundt Larry O. ; Havekost Robert B. ; Ottenbacher Ron, Process control system for monitoring and displaying diagnostic information of multiple distributed devices.
Alam, Mohammed Aftab; Nachman, Ramez; Peters, David Eric; Sanchez, Jr., John Espinoza, Determining a thickness of individual layers of a plurality of metal layers.
Jansman, Andreas Bernardus Maria; Widdershoven, Franciscus Petrus; Dinh, Viet Thanh, Device and method for detecting semiconductor substrate thickness.
deCecco, Paola; Schueler, Bruno; Reed, David; Kwan, Michael; Ballance, David Stephen, Method and system for non-destructive distribution profiling of an element in a film.
deCecco, Paola; Schueler, Bruno; Reed, David; Kwan, Michael; Ballance, David Stephen, Method and system for non-destructive distribution profiling of an element in a film.
deCecco, Paola; Schueler, Bruno; Reed, David; Kwan, Michael; Ballance, David Stephen, Method and system for non-destructive distribution profiling of an element in a film.
deCecco, Paola; Schueler, Bruno; Reed, David; Kwan, Michael; Ballance, David Stephen, Method and system for non-destructive distribution profiling of an element in a film.
deCecco, Paolo; Schueler, Bruno; Reed, David; Kwan, Michael; Ballance, David Stephen, Method and system for non-destructive distribution profiling of an element in a film.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.