초록

A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.

대표청구항 ▼

What is claimed is: 1. A heat sink comprising: a) a base heat spreader; b) at least one fin including: b1) a housing which encloses an inner area, b2) a liquid transfer medium within the inner area of the housing; b3) a working fluid within the inner area of the housing and at least partially conta

What is claimed is: 1. A heat sink comprising: a) a base heat spreader; b) at least one fin including: b1) a housing which encloses an inner area, b2) a liquid transfer medium within the inner area of the housing; b3) a working fluid within the inner area of the housing and at least partially contained in the liquid transfer medium; and b4) at least one support structure within the housing, for separating the liquid transfer medium into two portions; and c) a contact point between the base heat spreader and the at least one fin; wherein the heat spreader can transfer thermal energy into the housing of the at least one fin such that liquid working fluid in the liquid transfer medium is evaporated to vapor working fluid and mobilized to a relatively low temperature region of inner housing of the fin causing the vapor working fluid to condense back into liquid working fluid and flow to the liquid transfer medium. 2. The heat sink of claim 1 further comprising thermal adhesive between the base heat spreader and at least one fin. 3. The heat sink of claim 1 further comprising solder between the base heat spreader and at least one fin. 4. The heat sink of claim 1 further comprising a mechanic crimp between the base heat spreader and at least one fin. 5. The heat sink of claim 1 further comprising an L-shape fitting between the base heat spreader and at least one fin. 6. The heat sink of claim 1 wherein the base heat spreader is selected from the group consisting of graphite, metal, alloy, polymer, ceramic, silicon and combinations thereof. 7. The heat sink of claim 1 wherein the base heat spreader is copper. 8. The heat sink of claim 1 wherein the base heat spreader is aluminum. 9. The heat sink of claim 1 wherein the base heat spreader is a vapor chamber. 10. The heat sink of claim 1 wherein the base heat spreader is a graphite article. 11. The heat sink of claim 1 wherein the housing is selected from the group consisting of a metal, metal alloy, ceramic material, semiconductor material, polymer, and combinations thereof. 12. The heat sink of claim 1 wherein the housing is copper. 13. The heat sink of claim 1 wherein the working fluid is water. 14. The heat sink of claim 1 wherein the working fluid is selected from the group consisting of water, alcohol, ketones, CFC-type coolant, and combinations thereof. 15. The heat sink of claim 1 wherein the liquid transfer medium has an affinity for liquids. 16. The heat sink of claim 15 wherein the liquid transfer medium comprises compounds selected from the group consisting of--OH,--COOH, ═O,--NH2,--NH--, ═N--and combinations thereof. 17. The heat sink of claim 15 wherein the liquid transfer medium is comprised of carbon nanotubes. 18. The heat sink of claim 15 wherein the liquid transfer medium has a physical surface design to increase the liquid transfer medium's capacity to absorb liquids. 19. The heat sink of claim 15 wherein the liquid transfer medium has an internal structural design to increase the liquid transfer medium's capacity to absorb liquids. 20. The heat sink of claim 1 wherein the support structure provides physical support to the liquid transfer medium. 21. The heat sink of claim 1 wherein the support structure is comprised of a material selected from the group consisting of metal, alloy, polymer, ceramic, and combinations thereof. 22. The heat sink of claim 1 wherein the support structure is copper. 23. The heat sink of claim 1 wherein the support structure extends at least partially on two surfaces of the liquid transfer medium. 24. The heat sink of claim 1 wherein the support structure extends at least partially between two portions of the liquid transfer medium. 25. The heat sink of claim 1 further comprising solid fins. 26. The heat sink of claim 25 wherein the solid fins are copper. 27. The heat sink of claim 25 wherein the solid fins are aluminum. 28. The heat sink of claim 1 further comprising a black layer on at least one surface of the fins and base heat spreader. 29. The heat sink of claim 28 wherein the black layer is black paint. 30. The heat sink of claim 1 wherein the liquid working fluid flows by capillary force.