초록 ▼

A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-t

A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.

대표청구항 ▼

What is claimed is: 1. A thermosiphon cooling assembly for cooling an electronic device comprising; a housing having a lower portion and an upper portion, a refrigerant disposed in said lower portion of said housing for undergoing a liquid-to-vapor-to-condensate cycle within said housing, and a mix

What is claimed is: 1. A thermosiphon cooling assembly for cooling an electronic device comprising; a housing having a lower portion and an upper portion, a refrigerant disposed in said lower portion of said housing for undergoing a liquid-to-vapor-to-condensate cycle within said housing, and a mixing device disposed within said housing for increasing the transfer of heat from the electronic device during the cycle, wherein said mixing device includes a vapor stirrer disposed in the vapor of said refrigerant for moving the vapor away from the liquid of said refrigerant. 2. An assembly as set forth in claim 1 wherein said mixing device includes a liquid stirrer disposed in the liquid of said refrigerant for moving the liquid of said refrigerant. 3. An assembly as set forth in claim 1 wherein said mixing device includes a liquid stirrer vertically spaced from said vapor stirrer and disposed in the liquid of said refrigerant for moving the liquid of said refrigerant. 4. A thermosiphon cooling assembly for cooling an electronic device comprising: a housing having a lower portion and an upper portion, a refrigerant disposed in said lower portion of said housing for undergoing a liquid-to-vapor-to-condensate cycle within said housing, and a mixing device disposed within said housing for increasing the transfer of heat from the electronic device during the cycle; wherein said mixing device includes a vapor stirrer disposed above the liquid of said refrigerant for moving the vapor away from the liquid of said refrigerant, and a liquid stirrer vertically spaced from said vapor stirrer and disposed in the liquid of said refrigerant for moving the liquid of said refrigerant; wherein said vapor stirrer has a first diameter and said liquid stirrer has a second diameter, said first diameter being greater than said second diameter. 5. An assembly as set forth in claim 4 wherein said housing defines a generally cylindrical periphery extending about a central axis. 6. An assembly as set forth in claim 5 wherein said lower portion of said housing includes a top wall and said upper portion includes a plurality of condensing tubes spaced radially from and extending parallel to said axis and upwardly from said top wall of said lower portion of said housing to a distal end and spaced equally and circumferentially about said periphery of said housing to define an internal cavity centrally of said condensing tubes. 7. An assembly as set forth in claim 6 including a plurality of cooling fins disposed about said axis and extending circumferentially between adjacent ones of said condensing tubes for dissipating heat from said condensing tubes to ambient air. 8. An assembly as set forth in claim 7 wherein said mixing device includes a motor supported adjacent to said top wall and a first shaft extending from said motor for rotation thereby, said vapor stirrer and said liquid stirrer being disposed on and rotated by said first shaft. 9. An assembly as set forth in claim 8 wherein said motor is supported along said axis and within said internal cavity, said first shaft extending downwardly from said motor and through said top wall of said housing. 10. An assembly as set forth in claim 9 wherein said motor includes a second shaft extending upwardly from said motor and said motor rotates said second shaft. 11. An assembly as set forth in claim 10 including an air moving device disposed on said second shaft for moving air radially between said condensing tubes and over said cooling fins. 12. An assembly as set forth in claim 11 including a seal disposed between said first shaft and said top wall of said housing for keeping vapor from escaping from said housing. 13. An assembly as set forth in claim 12 wherein said housing has a circular boiler plate spaced from said top wall for transferring heat from the electronic device. 14. An assembly as set forth in claim 13 wherein said top wall of said lower portion is conical and extends upwardly and outwardly at an angle from said axis. 15. An assembly as set forth in claim 13 including a plurality of heat transfer fins disposed on said boiler plate in said lower portion of said housing for transferring heat from the electronic device disposed on the exterior of said boiler plate to said refrigerant. 16. A thermosiphon cooling assembly for cooling an electronic device comprising; a housing having a lower portion and an upper portion and defining a generally cylindrical periphery extending about a central axis, said lower portion having a conical top wall extending upwardly and outwardly at an angle from said axis, said upper portion including a plurality of condensing tubes spaced radially from and extending parallel to said axis and upwardly from and about said top wall of said lower portion of said housing to a distal end and spaced equally and circumferentially about said periphery of said housing to define an internal cavity centrally of said condensing tubes, a plurality of cooling fins disposed about said axis and extending circumferentially between adjacent ones of said condensing tubes for dissipating heat from said condensing tubes to ambient air, said housing having a circular boiler plate spaced from said top wall for transferring heat from the electronic device to said lower portion, a liquid refrigerant disposed in said lower portion of said housing over said boiler plate for undergoing a liquid-to-vapor-to-condensate cycle within said housing to transfer heat from the electronic device, a plurality of heat transfer fins disposed on said boiler plate in said lower portion of said housing for transferring heat from the electronic device disposed on the exterior of said boiler plate to said liquid refrigerant, a motor supported along said axis and adjacent to said top wall and within said internal cavity having a first shaft extending downwardly from said motor for rotation thereby and a second shaft extending upwardly from said motor for rotation thereby, an air moving device including a centrifugal fan disposed on said second shaft in said internal cavity for moving ambient air radially between said condensing tubes and over said cooling fins, said first shaft extending through said top wall of said housing on said axis, a seal disposed between said first shaft and said top wall of said housing for keeping the vapor from escaping from said housing, and a mixing device disposed on and rotated by said first shaft and disposed within said lower portion of said housing for increasing the transfer of heat from the electronic device during the cycle, said mixing device including a vapor stirrer having a first diameter and disposed above the liquid of said liquid refrigerant for moving the vapor away from the liquid of said liquid refrigerant, said mixing device including a liquid stirrer vertically spaced from said vapor stirrer and having a second diameter smaller than said first diameter of said vapor stirrer and disposed in the liquid of said liquid refrigerant for moving the liquid of said liquid refrigerant over said boiler plate.