Method and apparatus for insulative film for capacitor components
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01G-009/00
H01G-002/10
H01G-002/00
출원번호
US-0124792
(2005-05-09)
등록번호
US-7426104
(2008-09-16)
발명자
/ 주소
Dombro,Ron
Dinh,John Longsy
Sherwood,Gregory J.
Lamberty,Mark A.
Goldstein,Leonard
Schenk,Brian D.
출원인 / 주소
Cardiac Pacemakers, Inc.
대리인 / 주소
Schwegman, Lundberg & Woessner, P.A.
인용정보
피인용 횟수 :
2인용 특허 :
35
초록▼
The present subject matter includes an apparatus including a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween. In this embodiment, t
The present subject matter includes an apparatus including a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween. In this embodiment, the present subject matter includes at least one conformed film at least partially enveloping the capacitor stack in a bound state and adapted to electrically isolate the capacitor stack.
대표청구항▼
We claim: 1. An apparatus, comprising: a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; a heat shrink film conformed in a contin
We claim: 1. An apparatus, comprising: a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; a heat shrink film conformed in a continuous band around the capacitor stack; a case with a first opening sized for receiving a capacitor stack, the case having at least one feedthrough opening; and a lid mateable to the first opening; wherein the capacitor stack is disposed in the case, the lid is sealably connected to the first opening, and electrolyte is disposed in the case. 2. The apparatus of claim 1, wherein the conformed heat shrink film includes a seam. 3. The apparatus of claim 1, wherein the conformed heat shrink film includes at least a first piercing, the first piercing adapted for passage of a terminal connected to the capacitor stack. 4. The apparatus of claim 1, wherein the conformed heat shrink film includes at least a first excised opening, the first excised opening for passage of a terminal connected to the capacitor stack. 5. The apparatus of claim 1, wherein the conformed heat shrink film includes a polymeric material. 6. The apparatus of claim 5, wherein the polymeric material includes polyethylene terephthalate. 7. The apparatus of claim 1, wherein the capacitor stack exterior comprises an edge surface extending between a top layer and a bottom layer, the top layer and the bottom layer in substantially parallel alignment, with a perimeter film substantially enveloping the edge surface. 8. An apparatus, comprising: a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; banding means for banding the capacitor stack, the banding means including means that are thermally conformable; case means for sealably housing the capacitor stack; and electrolyte disposed in the case. 9. The apparatus of claim 8, wherein the capacitor stack defines an exterior having an edge surface extending between a first major planar surface and a second major planar surface, the first major planar surface and the second major planar surface being substantially parallel, wherein the thermally conformed heat shrink means are for substantially enveloping the edge surface. 10. The apparatus of claim 9, wherein the means thermally conformed for enveloping the capacitor stack in a bound state include a perimeter film substantially enveloping the edge surface. 11. The apparatus of claim 8, further comprising a thermoformed means for at least partially enveloping the capacitor stack. 12. The apparatus of claim 8, further comprising a plurality of thermally conformed heat shrink means, each of the plurality of thermally conformed heat shrink for at least partially enveloping the capacitor stack. 13. The apparatus of claim 8, wherein the thermally conformed heat shrink means include a polymeric material. 14. The apparatus of claim 13, wherein the polymeric material includes polyethylene terephthalate. 15. The apparatus of claim 8, wherein the thermally conformed heat shrink means includes a perimeter film. 16. An apparatus, comprising: a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; a heat shrink film conformed in a continuous band around the capacitor stack; a case, with the capacitor stack sealably disposed in the case such that an anode terminal extending through the case is electrically coupled with the at least one substantially planar anode layer, and a cathode terminal is electrically coupled with at least one substantially planar cathode layer; electrolyte disposed in the case; pulse generation electronics electrically coupled to the anode terminal and the cathode terminal; at least one battery coupled to the pulse generation electronics and the capacitor stack; an implantable can, in which the case, the pulse generation electronics, and the battery are disposed; and a feedthrough coupled to the can and including at least one terminal electrically coupled to the pulse generation electronics. 17. The apparatus of claim 16, wherein the pulse generation electronics include defibrillation electronics. 18. The apparatus of claim 16, wherein the conformed heat shrink film including polyethylene terephthalate. 19. The apparatus of claim 16, wherein the conformed heat shrink film is electrically insulative and is disposed between the at least one substantially planar anode layer and the case. 20. The apparatus of claim 16, wherein the conformed heat shrink film is seamless.
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