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Lid and method of employing a lid on an integrated circuit

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0242262 (2005-09-30)
등록번호 US-7429501 (2008-09-30)
발명자 / 주소
  • Wu,Paul Ying Fung
  • Chee,Soon Shin
  • Hsieh,Steven H. C.
출원인 / 주소
  • Xilinx, Inc.
대리인 / 주소
    King,John J.
인용정보 피인용 횟수 : 9  인용 특허 : 31

초록

A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts into the originally straight edges of

대표청구항

We claim: 1. A method of forming a lid for an integrated circuit, said method comprising the steps of: forming a recessed portion within a plurality of sides and a top of said lid for receiving a die of said integrated circuit; creating a foot portion of said plurality of sides around said recessed

이 특허에 인용된 특허 (31)

  1. Yamanaka Hideo,JPX, Air-packed CCD images package and a mold for manufacturing thereof.
  2. Steven Lofland, Apparatus and methods for attaching thermal spreader plate to an electronic card.
  3. Tzong-Da Ho TW; Chien-Ping Huang TW; Han-Ping Pu TW, Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same.
  4. Magnuson, Roy H.; Markovich, Voya R.; Miller, Thomas R.; Wozniak, Michael, Copper plated PTH barrels and methods for fabricating.
  5. Donald S. Farquhar ; David E. Houser ; Konstantinos I. Papathomas, Flip chip package with improved cap design and process for making thereof.
  6. Wang Bily,TWX, Folded heat sink for semiconductor device package.
  7. Tosaya, Eric S.; Alcid, Edward S., Heat spreader having holes for rivet-like adhesive connections.
  8. Djekic, Ognjen, Heatsinking and packaging of integrated circuit chips.
  9. Interrante Mario J. ; Economikos Laertis ; Herron Lester Wynn, Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity.
  10. Nakajoh, Yasuo; Yunoki, Yutaka, Image pickup module having integrated lens and semiconductor chip.
  11. Newman Keith G. (Sunnyvale CA), Integrated circuit package lid.
  12. Radu, Sergiu; Will, John E.; Boyle, Steven; Hockanson, David, Integrated circuit package with EMI containment features.
  13. Labanok, Nick; Houle, Sabina J., Integrated heat spreader with downset edge, and method of making same.
  14. Higashi Robert E. ; Ridley Jeffrey A. ; Stratton Thomas G. ; Wood R. Andrew, Integrated silicon vacuum micropackage for infrared devices.
  15. Fujimoto, Hisayoshi; Takakura, Toshihiko; Imamura, Norihiro, Lens array unit, method of manufacturing lens array unit, and optical device using the lens array unit.
  16. Fehr Gerald K. (Cupertino CA) Batinovich Victor (Morgan Hill CA), Metal semiconductor package with an external plastic seal.
  17. Herbert Brunner DE; Heinz Haas DE; Gunter Waitl DE, Method for producing an optoelectronic semiconductor component.
  18. Frank E. Guthrie ; Paul O. Johnson, Method of forming an electronic package with a solder seal.
  19. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  20. Glenn Thomas P., Plastic package for an optical integrated circuit device and method of making.
  21. Dlugokecki Joseph J. (13666 Quiet Hills Dr. Poway CA 92064) Florian Joseph R. (11207 Zapata Ave. San Diego CA 92126), Radiation shielding for integrated circuit devices using reconstructed plastic packages.
  22. Terui Makoto,JPX, Semiconductor device.
  23. Hashimoto Nobuaki,JPX, Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device.
  24. Murayama, Kei; Higashi, Mitsutoshi; Sakaguchi, Hideaki; Koike, Hiroko, Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion.
  25. Okubora, Akihiko, Semiconductor device, methods of production of the same, and method of mounting a component.
  26. Tachibana Hirofumi,JPX, Semiconductor package and method of manufacturing the same.
  27. Lin,Chang Fu; Pu,Han Ping; Huang,Chien Ping, Semiconductor package with heat sink.
  28. Shokrgozar Hamid (Phoenix AZ) Reeves Leonard (Phoenix AZ) Heggli Bjarne (Phoenix AZ), Stacked silicon die carrier assembly.
  29. Chiu Anthony, Stress reduction for flip chip package.
  30. Kolman Frank ; Brownell Michael, Thermal grease insertion and retention.
  31. McShane Michael B. (Austin TX) Casto James J. (Austin TX) Joiner Bennett A. (Austin TX), Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation.

이 특허를 인용한 특허 (9)

  1. Dosdos, S. Gabriel R.; Kim, Dong Wook, Integrated circuit package and method of forming an integrated circuit package.
  2. Zohni, Nael; Nagarajan, Kumar; Boja, Ronilo, Integrated circuit packaging devices and methods.
  3. We, Hong Bok; Kim, Dong Wook; Hwang, Kyu-Pyung; Song, Young Kyu, Low profile reinforced package-on-package semiconductor device.
  4. Yim, Choongbin; Mok, Seungkon; Kim, Donghan; Park, Jin-Woo; Lee, PaLan; Kim, Mi-yeon, Method of forming a semiconductor device package.
  5. Nilsson, Rolf, Module.
  6. Nilsson, Rolf, Module.
  7. Nilsson, Rolf, Module.
  8. Nilsson, Rolf, Module.
  9. Choi, DaeSik; Yang, JoungIn; Park, Sang Mi; Kwon, WonIl; Park, YiSu, Semiconductor device and method of controlling warpage in semiconductor package.
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