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A process for curing a natural or synthetic rubber compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a non-bridged impedance sensing circuit and a capacitor having the rubber compound being cured as a dialectric; (2)

A process for curing a natural or synthetic rubber compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a non-bridged impedance sensing circuit and a capacitor having the rubber compound being cured as a dialectric; (2) determining impedance related measurements from the obtained data streams; (3) determining a predictive curing equation by performing a multiple regression between: (a) reheometric data obtained from a plurality of different rubber compound samples cured in a rheometer at various environmental curing conditions, and (b) corresponding samples cured in a production mold at the same environmental conditions; (4) adjusting the curing equation to obtain cured parts having one or more desired properties; and (5) controlling the mass producing cured parts with a controller that uses the curing equation for predicting a cure time for each part, wherein the predictions are effective over variations in the rubber compound, and in the mold temperature.

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What is claimed is: 1. A process for curing a plurality of curable parts composed of a compound that is curable using heat, comprising: a) curing, at each of a plurality of predetermined specifications for a corresponding curing environment, a corresponding sample of the compound for obtaining a co

What is claimed is: 1. A process for curing a plurality of curable parts composed of a compound that is curable using heat, comprising: a) curing, at each of a plurality of predetermined specifications for a corresponding curing environment, a corresponding sample of the compound for obtaining a corresponding curing time indicative of the cured sample having one or more predetermined desired or specified mechanical properties; b) for each specification (S) of the plurality of predetermined curing environment specifications, curing a corresponding amount of the compound while obtaining measurements of curing conditions indicative of dielectric or impedance signals transmitted through the corresponding amount, wherein the corresponding amount is cured for obtaining a corresponding part, or cured in a witness cavity for a corresponding curing part, wherein the measurements are used to produce a corresponding process curve for the compound and the specification S of the corresponding curing environment; c) obtaining data for predicting a curing end time, the data for predicting dependent upon a result of a correlation performed between; (i) the curing times of the cured samples, and (ii) a collection of evaluations, each evaluation for representing at least one characteristic of one of the process curves, the at least one characteristic being different from a curing time; and d) for a plurality of additional amounts of the compound, curing each additional amount corresponding to an additional part while obtaining curing condition measurements by dielectric or impedance signals transmitted through the additional amount being cured, wherein the data for predicting is combined with the curing condition measurements of the addition amount for thereby determining when to terminate the curing of the additional amount so that the additional part has the one or more predetermined desired or specified mechanical properties. 2. The process of claim 1, wherein the dielectric or impedance measurements are obtained using a circuit that is non-bridged. 3. The process of claim 1, further including determining the correlation by statistically correlating the curing times of the samples with the one or more characteristics of the process curves. 4. The process of claim 1, wherein the correlation is accomplished using a rheometric instrument for identifying the one or more predetermined desired or specified mechanical properties when curing the samples. 5. The process of claim 1, wherein for at least one of the corresponding amounts, further including determining a Maximum Value, and/or a Time of Maximum Value in a predetermined time segment when curing the at least one corresponding amount. 6. The process of claim 1, wherein for at least one of the corresponding amounts, further including determining a Minimum Value, and/or a Time of Minimum Value in a predetermined time segment when curing the at least one corresponding amount. 7. The process of claim 1, wherein for at least one of the additional parts, the data for predicting includes a rate of a cure that is determined using a linear least-squares best fit extending over a predetermined time segment of the curing condition measurements of a process curve (PC) for the at least one additional part, wherein the linear least squares best fit is used to obtain a slope (in) of a line equation: y =mx +b that is a linear approximation of the process curve PC in the predetermined time segment, wherein the variable x in the line equation represents a time in the predetermined time segment, the variable y in the line equation represents an impedance value that approximates the process curve PC at the time for the variable x, and the constant b in the line equation represents an impedance value that approximates the process curve PC when x is zero. 8. The process of claim 1, wherein for at least one of the additional parts, the data for predicting includes a rate of a cure that is determined using an exponential best fit over a predetermined time segment of the curing condition measurements of a process curve (PC) for the at least one additional part, wherein the exponential best fit is used to obtain a damping coefficient, x, from an equation: y =Aeαx, that is an approximation of the process curve PC in the predetermined time segment, wherein the variable x in the equation represents a time in the predetermined time segment, the variable y in the equation represents an impedance value that approximates the process curve PC at the time for the variable x, and the constant A in the equation represents an amplitude coefficient. 9. The process of claim 1, wherein for at least one of the additional parts, the data for predicting includes a rate of a cure that is determined using an exponential best fit over a predetermined time segment of the curing condition measurements of a process curve (PC) for the at least one additional part, wherein the exponential best fit is used to obtain an amplitude coefficient, A, from an equation: y =Aeαx, that is an approximation of the process curve PC in the predetermined time segment, wherein the variable x in the equation represents a time in the predetermined time segment, the variable y in the equation represents an impedance value that approximates the process curve PC at the time for the variable x, and the constant a in the equation represents a damping coefficient. 10. The process of claim 1, wherein an integrated area under one of the corresponding process curves or a portion of the one process curve is used to determine the data for predicting. 11. The process of claim 1, in which the dielectric or impedance measurements include impedance (Z), phase angle (Φ), resistance (R), reactance (X), conductance (G) or capacitance (C) values as the dependent variable of the process curve as plotted against time as the independent variable. 12. The process of claim 1, wherein the correlation is made between: (a) mathematical measurements of the corresponding process curves, and (b) rheometric property measurements of the samples, wherein the desired or specified part mechanical properties of the samples include one or more of: tensile strength, compression set, dynamic stiffness, and elastic torque. 13. The process of claim 12, wherein data for predicting includes a modifier which provides a linear adjustment to a T90 or rheometric correlation equation. 14. The process of claim 1, wherein the curing condition measurements are made from the dielectric or impedance signals being transmitted at a frequency in a range of about 10 Hz to 100 kHz. 15. The process of claim 1, in which said compound is selected from the group consisting of: styrene-butadiene, polybutadiene, polyisoprene, ethylene-propylene, butyl, halobutyl, nitrile , polyacrylic, neoprene, hypalon, silicone, fluorocarbon elastomers, polyurethane elastomers, and mixtures thereof. 16. The process of claim 15, in which fillers for the compound include carbon black, clays, oils, and silicas. 17. The process of claim 1, in which the said process is controlled using a computer. 18. The process of claim 17, in which said computer controls the process by receiving a start cure signal from vulcanization equipment and based on a predefined software algorithm sends an end cure signal back to the vulcanization equipment. 19. The process of claim 1, wherein each of the corresponding amounts, and the additional amounts are cured using vulcanization equipment and associated tooling, wherein an impedance measuring means, for measuring impedance related signals indicative of a curing state of each of the corresponding amounts and the additional amounts, is included in one of the vulcanization equipment and the associated tooling. 20. The process of claim 19, wherein the impedance measuring means includes a primary sensor electrode coupled with an opposing grounded surface electrode, which is part of the vulcanization equipment or the associated tooling. 21. The process of claim 20, wherein the impedance measuring means includes an impedance sensor in contact with each of the corresponding amounts, and the additional amounts being cured. 22. The process of claim 21, in which the impedance sensor includes an additional guard electrode to help preclude the primary electrode from fringing or becoming non-linear. 23. The process of claim 22, wherein the primary and guard electrodes are separated from each of the corresponding amounts, and the additional amounts being cured by alumina ceramic or other stable and abrasion resistant dielectric material. 24. The process of claim 20, wherein the primary sensor electrode, a guard electrode, and a housing are separated electrically from each other by a dielectrically stable polymer, and alumina ceramic. 25. The process of claim 20, wherein the primary sensor electrode, a guard electrode, and a housing are fused together and separated electrically from each other by glass or glass doped with alumina ceramic. 26. The process of claim 20, in which the primary sensor electrode and a guard electrode are embedded in a metallized and layered ceramic circuit. 27. The process of claim 20, wherein the primary sensor electrode, a guard electrode, and a housing are: (a) press fit together, and (b) separated electrically from each other and each of the corresponding amounts, and the additional amounts being cured by a diamond coating. 28. The process of claim 18, in which said vulcanization equipment includes one of: injection molding machines, compression and transfer molding presses, belt making presses, autoclaves, and tire molding machines. 29. The process of claim 19, wherein said associated tooling includes: injection molds, compression and transfer molds, mandrels, platens, and tire molds. 30. The process of claim 18, wherein the dielectric or impedance signals are transmitted using an dielectric or impedance means that includes more than one sensor to monitor the process, wherein one of the sensors that lags from cycle-to-cycle is used to control the termination of the curing of one or more of the additional amounts. 31. The process of claim 4, wherein the rheometric instrument includes one of an oscillating disk rheometer and a moving die rheometer. 32. The process of claim 24, wherein the dielectrically stable polymer includes cyanate ester. 33. The process of claim 1, wherein the correlation determines how well a distribution of the curing times corresponds to a distribution of the evaluations. 34. The process of claim 1, wherein for each of the plurality of predetermined curing environment specifications, the corresponding sample is different from the corresponding amount. 35. A process for curing a plurality of curable parts composed of a compound that is curable using heat, comprising: curing, at each of a plurality of predetermined specifications for a corresponding curing environment, a corresponding sample of the compound for obtaining a corresponding curing time indicative of the cured sample having one or more predetermined desired or specified mechanical properties; for each specification (S) of the plurality of predetermined curing environment specifications, curing a corresponding amount (AMTs) of the compound at the specification S while obtaining corresponding measurements of curing conditions indicative of dielectric or impedance signals transmitted through the corresponding amount AMTs; wherein each corresponding amount AMTs is cured using first heat curing equipment that is different from the heat curing equipment for curing the samples, wherein the corresponding measurements are used to produce a corresponding process curve for the compound and the specification S of the corresponding curing environment; obtaining data for predicting a curing end time, the data for predicting dependent upon a result of a correlation performed between: (i) the curing times of the cured samples, and (ii) a collection of evaluations, each evaluation for representing at least one characteristic of one of the process curves, the at least one characteristic being different from a curing time; and for a plurality of additional amounts of the compound, curing each additional amount corresponding to an additional part, using first heat curing equipment, while obtaining curing condition measurements by dielectric or impedance signals transmitted through the additional amount being cured, wherein the data for predicting is combined with the curing condition measurements of the additional amount for thereby determining when to terminate the curing of the additional amount so that the additional part has the one or more predetermined desired or specified mechanical properties.