IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0261144
(2005-10-27)
|
등록번호 |
US-7434412
(2008-10-14)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
Martine Penilla & Gencarella, LLP
|
인용정보 |
피인용 횟수 :
29 인용 특허 :
18 |
초록
▼
A system and method for controlling temperature in an equipment enclosure are disclosed. The system includes an enclosure having a top side, side walls, a front side, and a back side. The enclosure is configured to receive computer equipment. Further included is an air mover to draw air into the enc
A system and method for controlling temperature in an equipment enclosure are disclosed. The system includes an enclosure having a top side, side walls, a front side, and a back side. The enclosure is configured to receive computer equipment. Further included is an air mover to draw air into the enclosure at the top side. Cooling panels are coupled to the front side of the sidewalls. The cooling panels are configured to receive the air from the air mover, and the received air is cooled as it travels within the cooling panels. The cooling panels include outlet ports for allowing the air that has been cooled to travel from the front side of the enclosure to the backside of the enclosure.
대표청구항
▼
What is claimed is: 1. A system for controlling temperature in an equipment enclosure, comprising: an enclosure having a top side, side walls, a front side, and a back side, the enclosure being configured to receive multiple units of computer equipment; an air mover configured to draw air into the
What is claimed is: 1. A system for controlling temperature in an equipment enclosure, comprising: an enclosure having a top side, side walls, a front side, and a back side, the enclosure being configured to receive multiple units of computer equipment; an air mover configured to draw air into the enclosure at the top side; and cooling panels having a width and coupled to the front side of the sidewalls of the enclosure, the width of the cooling panels extending in a direction of the sidewalls, the cooling panels being configured to receive the air from the air mover, the received air being cooled as it travels within the cooling panels in the direction of the sidewalls and toward the enclosure, the cooling panels including outlet ports oriented so that air that has been cooled is directed from the front side of the enclosure to the backside of the enclosure. 2. A system for controlling temperature in an equipment enclosure as recited in claim 1, further comprising: a manifold coupled to the top side of the enclosure, the manifold being configured to direct air received from the air mover to the cooling panels. 3. A system for controlling temperature in an equipment enclosure as recited in claim 1, wherein the cooling panels are defined by a first cooling panel and a second cooling panel, and each of the first and second cooling panels being coupled to the front side of the enclosure at the sidewalls. 4. A system for controlling temperature in an equipment enclosure as recited in claim 1, wherein the cooling panels that are coupled to the front side of the sidewalls are mechanically connected to the enclosure. 5. A system for controlling temperature in an equipment enclosure as recited in claim 1, wherein the cooling panels have walls defining a path. 6. A system for controlling temperature in an equipment enclosure as recited in claim 5, wherein the path in the cooling panels hold coolant tubes, the coolant tubes are configured to carry a cooling fluid, the cooling fluid being adjusted to set a cooling temperature within the path of the cooling panels. 7. A system for controlling temperature in an equipment enclosure as recited in claim 1, wherein the cooling panels have an outer wall and an inner wall, the inner wall including fins for enhancing cooling of the air. 8. A system for controlling temperature in an equipment enclosure as recited in claim 1, wherein the outlet ports in the cooling panels can be directionally adjusted to direct the air toward the computer equipment. 9. A system for controlling temperature in an equipment enclosure as recited in claim 1, further comprising: an air mover coupled to the backside of the enclosure, the air mover being configured to pull air from the front side of the enclosure toward the back side of the enclosure. 10. A system for controlling temperature in an equipment enclosure as recited in claim 9, further comprising: an exhaust duct coupled to the air mover that is coupled to the back side of the enclosure. 11. A system for controlling temperature in an equipment enclosure as recited in claim 1, further comprising: an air flow monitoring component for determining flow of the air within the cooling panels and the enclosure. 12. A system for controlling temperature in an equipment enclosure as recited in claim 1, further comprising a cooling system controller for regulating the flow of air through the cooling panels and the enclosure. 13. A method for controlling temperature in an equipment enclosure, comprising: providing an enclosure that is configured to hold multiple units of computer equipment; conditioning air to a desired cooled temperature, the air being conditioned in sidewall panels coupled to a front side of the enclosure; flowing the conditioned air from the sidewall panels and through the enclosure, the conditioned air experiencing an elevation in temperature upon passing through the enclosure when holding computer equipment in operation; and flowing air out of the enclosure from a backside of the enclosure that is opposite the front side having the sidewall panels, the air flowing out of the enclosure being less heated due to the conditioning of the air before flowing the air into the enclosure from the sidewall panels. 14. A method for controlling temperature in an equipment enclosure as recited in claim 13, further comprising: monitoring the air flowing out of the enclosure; if the air flowing out of the enclosure exceeds a level, then adjusting the desired cooled temperature before continuing to flow the conditioned air through the enclosure. 15. A method for controlling temperature in an equipment enclosure as recited in claim 13, wherein conditioning air to the desired cooled temperature includes flowing a coolant to the sidewall panels that couple to the front side of the enclosure. 16. A method for controlling temperature in an equipment enclosure as recited in claim 13, wherein the flowing of the air out of the enclosure includes fan pulling the air out of the enclosure from the backside of the enclosure.
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