초록 ▼

Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to

Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.

대표청구항 ▼

The invention claimed is: 1. A method of processing substrates, comprising: (a) providing a first substrate into a vacuum conveyor system having a first vacuum sleeve having a port for sealably coupling the first vacuum sleeve to a first process chamber, a plurality of substrate supports that suppo

The invention claimed is: 1. A method of processing substrates, comprising: (a) providing a first substrate into a vacuum conveyor system having a first vacuum sleeve having a port for sealably coupling the first vacuum sleeve to a first process chamber, a plurality of substrate supports that support and move substrates through the first vacuum sleeve, and a first substrate handler disposed within the first vacuum sleeve proximate the port; (b) conveying the first substrate through the first vacuum sleeve to a position above the first substrate handler; (c) vertically actuating the first substrate handler to lift the first substrate from the plurality of substrate supports; and (d) horizontally actuating the first substrate handler to move the first substrate through the port and into the first process chamber. 2. The method of claim 1, further comprising: (e) placing the first substrate on a substrate support disposed in the first process chamber coupled to the first vacuum sleeve. 3. The method of claim 1, further comprising: (e) picking up a second substrate disposed on a substrate support in the first process chamber coupled to the first vacuum sleeve with a second substrate handler; (f) retracting the second substrate handler to place the second substrate on the plurality of substrate supports; and (g) placing the first substrate on the substrate support and retracting the first substrate handler. 4. A method of processing substrates, comprising: (a) providing a first substrate into a vacuum conveyor system having a first vacuum conveyor sleeve having a port for sealably coupling the first vacuum sleeve to a process chamber, a plurality of substrate supports that support and move substrates through the first vacuum sleeve, and a first substrate handler disposed within the first vacuum sleeve proximate the port, wherein the vacuum conveyor system has a second vacuum sleeve having a port for sealably coupling the second vacuum sleeve to the process chamber, a plurality of substrate supports that support and move substrates through the second vacuum sleeve, and a second substrate handler disposed within the second vacuum sleeve proximate the port, wherein the first and second vacuum sleeves are disposed in parallel and are coupled to opposing access ports of the process chamber; (b) conveying the first substrate through the first vacuum sleeve to a position above the first substrate handler; (c) vertically actuating the first substrate handler to lift the first substrate from the plurality of substrate supports disposed in the first vacuum sleeve; (d) picking up a second substrate disposed on a substrate support in the process chamber with the second substrate handler; (e) retracting the second substrate handler to place the second substrate on the plurality of rollers disposed in the second vacuum sleeve; and (f) placing the first substrate on the substrate support and retracting the first substrate handler. 5. A method of processing substrates, comprising: (a) providing a substrate into a vacuum conveyor system having a vacuum conveyor sleeve having a port for sealably coupling the vacuum sleeve to a process chamber, a plurality of substrate supports that support and move substrates through the vacuum sleeve, and a substrate handler disposed within the vacuum sleeve proximate the port; (b) conveying the substrate through the vacuum sleeve to a position above the substrate handler; (c) vertically actuating the substrate handler to lift the substrate from the plurality of substrate supports; and (d) horizontally actuating the substrate handler to move the substrate over a plurality of lift pins disposed in a connector sleeve coupled to the vacuum sleeve. 6. The method of claim 1, further comprising: (e) transferring the first substrate from the first process chamber through a load lock chamber into a second vacuum conveyor sleeve, wherein the second vacuum conveyor sleeve is at a vacuum level different than that of the first conveyor sleeve. 7. The method of claim 6 further comprising: (f) transferring the first substrate disposed in the second vacuum conveyor sleeve to a second deposition chamber coupled to the second vacuum conveyor sleeve.