Apparatuses and methods for cleaning a substrate
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B08B-011/02
B08B-011/00
출원번호
US-0816337
(2004-03-31)
등록번호
US-7441299
(2008-10-28)
발명자
/ 주소
de Larios,John M.
Owczarz,Aleksander
Schoepp,Alan
Redeker,Fritz
출원인 / 주소
Lam Research Corporation
대리인 / 주소
Martine Penilla & Gencarella, LLP
인용정보
피인용 횟수 :
1인용 특허 :
99
초록▼
An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the
An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.
대표청구항▼
What is claimed is: 1. An apparatus for use in processing a substrate, comprising: a brush enclosure extending over a length, the brush enclosure configured to be disposed vertically over a horizontal surface of the substrate, the brush enclosure having an open region that is configured to be dispo
What is claimed is: 1. An apparatus for use in processing a substrate, comprising: a brush enclosure extending over a length, the brush enclosure configured to be disposed vertically over a horizontal surface of the substrate, the brush enclosure having an open region that is configured to be disposed in proximity to the horizontal surface of the substrate, the open region enabling foam from within the brush enclosure to contact the surface of the substrate when the substrate is present, the open region extending over the length of the brush enclosure; a first flange extending outward from the brush enclosure along the length and along a first side of the open region; a second flange extending from the brush enclosure along the length and along a second side of the open region, wherein a flat bottom surface of the first and second flange is substantially parallel to the horizontal surface of the substrate, wherein the first and the second flanges each have an opening extending therethrough, the opening connected to a vacuum source for removing fluid through the opening, the fluid present between the flat bottom surface and the horizontal surface of the substrate; and a brush disposed within the brush enclosure, the brush configured to deliver a fluid to the horizontal surface of the substrate through a conduit defined around an axis of the brush. 2. The apparatus of claim 1, wherein the flat bottom surface of the first and second flange is opposed to the substrate to form a gap through which the foam contacts both the substrate and the flat bottom surface. 3. The apparatus of claim 1, wherein the brush enclosure has a tubular shape. 4. The apparatus of claim 1, wherein the brush enclosure is defined from a chemically inert material. 5. The apparatus of claim 4, wherein the chemically inert material is defined by one or more of plastic, polyoxymethylene, polyvinylidene fluoride (PVDF), and polyethylene terepthalate (PET). 6. The apparatus of claim 1, wherein the length of the brush enclosure is configured to extend a length of a brush. 7. A brush enclosure for use in processing a substrate, comprising: an elongated enclosure configured to enclose a brush, the elongated enclosure being configured to be disposed above a horizontal surface of the substrate, the elongated enclosure having opposite ends defining a length and having an open region along the length of the elongated enclosure, the open region configured to be disposed above the surface of the substrate enabling a surface of the brush when the brush is present to make contact with the surface of the substrate when the substrate is present; a flange along the length of the elongated enclosure extending radially outward from an outer surface of the elongated enclosure, the flange defining a flat bottom surface being substantially parallel to the horizontal surface of the substrate when the substrate is present, wherein the flange has a conduit connected to a vacuum source to remove liquid resulting from a gap defined between the surface of the flange and the surface of the substrate; and a brush disposed within the elongated enclosure, the brush configured to deliver a fluid to the horizontal surface of the substrate through a conduit defined around an axis of the brush. 8. The brush enclosure of claim 7, wherein the flat bottom surface of the first and second flange is opposed to the substrate to form a gap through which the foam contacts both the substrate and the flat bottom surface. 9. The brush enclosure of claim 8, wherein a space between the flat bottom surface of the flange and the surface of the substrate when the substrate is present defines a gap. 10. The brush enclosure of claim 9, wherein the gap has a dimension from about 0.1 mm to about 5 mm. 11. The brush enclosure of claim 7, wherein the elongated enclosure has a tubular shape. 12. The brush enclosure of claim 7, wherein the elongated enclosure is defined from a chemically inert material. 13. The brush enclosure of claim 12, wherein the chemically inert material is defined by one or more of plastic, polyoxymethylene, polyvinylidene fluoride (PVDF), and polyethylene terepthalate (PET). 14. The brush enclosure of claim 7, wherein the length of the brush enclosure is configured to extend a length of a brush. 15. The brush enclosure of claim 7, wherein the open region extends over the length of the elongated enclosure. 16. A substrate cleaning system, comprising: a first brush enclosure; a first brush having a majority of an outer diameter of the first brush enclosed within the first brush enclosure, the first brush being configured to be disposed vertically above a top surface of a substrate so that the first brush contacts the substrate through an open region at a bottom of the first brush enclosure; a first drive roller; a second drive roller, the first and second drive rollers being configured to receive an edge of the substrate to support and rotate the substrate when placed below the first partially enclosed brush; a second brush enclosure; a second brush having a majority of an outer diameter of the second brush enclosed within the second brush enclosure, the second brush and second brush enclosure disposed vertically below a bottom surface of the substrate so that the second brush contacts the substrate through an open region at a top of the first brush enclosure, wherein each of the brush enclosures include a corresponding flange along a length of each enclosure, the flange extending radially outward from an outer surface of each enclosure, the flange defining a flat bottom surface being substantially parallel to an opposing surface of the substrate when the substrate is present. 17. The substrate cleaning system of claim 16, further comprising: a housing, the housing being configured to enclose the substrate cleaning system. 18. The substrate cleaning system of claim 16, wherein the first and second brushes are configured to deliver a fluid to the opposing surface of the substrate through a conduit defined around an axis of the respective brushes. 19. The substrate cleaning system of claim 16, wherein each flange has an opening extending therethrough, the opening connected to a vacuum source for removing fluid through the opening, the fluid present between the flat bottom surface and the opposing surface of the substrate.
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