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Video graphics array (VGA) card assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-007/00
출원번호 US-0309818 (2006-10-03)
등록번호 US-7443672 (2008-10-28)
발명자 / 주소
  • Peng,Xue Wen
  • Chen,Rui Hua
출원인 / 주소
  • Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
  • Foxconn Technology Co., Ltd.
대리인 / 주소
    Niranjan,Frank R.
인용정보 피인용 횟수 : 30  인용 특허 : 11

초록

A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) i

대표청구항

What is claimed is: 1. A VGA card assembly comprising: a VGA card having a heat-generating electronic component mounted thereon; a heat dissipating device mounted on the VGA card, comprising: a flow director defining a receiving room therein, the flow director comprising a fan carrier having a fan

이 특허에 인용된 특허 (11)

  1. Lee, Sang Cheol, Chipset cooling device of video graphic adapter card.
  2. Wu, Titan; Teng, Ted; Chen, Daniel M. R., Cooling system.
  3. Han,Tai Sheng (Andrew), Graphics card apparatus with improved heat dissipating mechanisms.
  4. Han, Tai Sheng, Graphics card apparatus with improved heat dissipation.
  5. Lo, Chih-Ching; Chen, Ching-Hung; Chen, Cheng-Cheng, Heat dissipating apparatus for interface cards.
  6. Lopatinsky,Edward; Fedoseyev,Lev, Multi-heatsink integrated cooling device.
  7. Wittig,Michael B., Noise-reducing blower structure.
  8. Wang, Jui-Tung, Protective shield for against damaging circuit board and for safeguarding chip.
  9. Kitahara, Takashi; Shuto, Naoki, Semiconductor module apparatus and cooling apparatus.
  10. Kim, David J.; Struve, Dimitry; Ruckman, William W., Side-accessible computer system enclosure and method.
  11. Refai Ahmed,Gamal; Sun,Xiaohua H.; Osqueizadeh,Nima; Lakhani,Salim; Loro,Jim E.; Shepherd Murray,A. Mei Lan; Lau,Ross, Thermal management apparatus.

이 특허를 인용한 특허 (30)

  1. Buffington, Charles E., Adaptor for graphics module.
  2. Han, Tai-Sheng, Circuit board apparatus with induced air flow for heat dissipation.
  3. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  4. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  5. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  6. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  7. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  9. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  10. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Cooled electronic system with thermal spreaders coupling electronics cards to cold rails.
  11. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  12. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  13. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  14. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  15. Kanamaru, Masahiro; Nakayama, Makoto; Inoue, Tarou, Electrical junction box.
  16. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  17. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  18. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  19. Kinstle, III, Robert Michael, Graphics card cooler.
  20. Chou, Ming Der; Chang, Yao Tin, Heat dissipation assembly for graphics card and blade server using the same.
  21. Peng, Xue-Wen; Chen, Rui-Hua, Heat dissipation device for computer add-on cards.
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Rizzolo, Michael R.; Simons, Robert E., Liquid-cooled electronics apparatus and methods of fabrication.
  23. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
  24. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Vandeventer, Allan C.; Zoodsma, Randy J., Modular pumping unit(s) facilitating cooling of electronic system(s).
  25. Memon, Anwar Noor, Modular thermal management system for graphics processing units.
  26. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; VanDeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling method for continuous cooling of an electronic system(s).
  27. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; Vandeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling system for continuous cooling of an electronic system(s).
  28. David, Milnes P.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Parida, Pritish R.; Schmidt, Roger R.; Steinke, Mark E., Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s).
  29. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  30. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
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