A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) i
A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.
대표청구항▼
What is claimed is: 1. A VGA card assembly comprising: a VGA card having a heat-generating electronic component mounted thereon; a heat dissipating device mounted on the VGA card, comprising: a flow director defining a receiving room therein, the flow director comprising a fan carrier having a fan
What is claimed is: 1. A VGA card assembly comprising: a VGA card having a heat-generating electronic component mounted thereon; a heat dissipating device mounted on the VGA card, comprising: a flow director defining a receiving room therein, the flow director comprising a fan carrier having a fan therein; a thermal module received in the receiving room of the flow director and in thermal connection with the heat-generating electronic component; a mounting bracket mounted on the VGA card and received in the receiving room of the flow director, the thermal module being mounted on the mounting bracket; and a cover movably mounted on the flow director to selectively open and cover the thermal module in the flow director, wherein the cover can be moved between an opened position and a closed position, in the opened position, the thermal module being exposed, in the closed position, the thermal module being enclosed. 2. The VGA card assembly as described in claim 1, wherein a back plate is mounted to a bottom portion of the VGA card. 3. The VGA card assembly as described in claim 2, wherein the back plate forms studs extending upwardly, a plurality of fasteners having upper threaded portions and lower threaded portions, the lower threaded portions extending downwardly through the VGA card to threadedly engage with the studs to thereby securely attach the back plate to the bottom portion of the VGA card. 4. The VGA card assembly as described in claim 3, wherein a plurality of screws extend through the thermal module to threadedly engage with the upper threaded portions of the fasteners, thereby threadedly connecting the thermal module and the VGA card together. 5. The VGA card assembly as described in claim 1, wherein the fan carrier of the flow director comprises a top wall having an intake therein aligned with the fan, a bottom wall spaced from the top wall and an arced sidewall extending downwardly from an edge of the top wall and connecting with the bottom wall. 6. The VGA card assembly as described in claim 5, wherein an outlet is defined at a lateral side of the fan carrier and enclosed by the top wall, the sidewall and the bottom wall of the fan carrier, the outlet being adjacent to and communicating with the receiving room of the flow director. 7. The VGA card assembly as described in claim 1, wherein the thermal module comprises a heat spreader contacting with the heat-generating electronic component, a plurality of fins mounted on the heat spreader and a heat pipe thermally connecting the heat spreader and the fins. 8. The VGA card assembly as described in claim 1, wherein the mounting bracket consists of three elongated bodies and an opening enclosed by three bodies, the thermal module contacting a plurality of second heat-generating electronic components around the heat-generating electronic component, the bodies being provided with a plurality of vanes thereon. 9. The VGA card assembly as described in claim 1, wherein the flow director comprises first and second opposite sidewalls and a mounting plate connecting the first and second sidewalls, the first and second sidewalls extending from two opposite ends of a sidewall of the fan carrier. 10. The VGA card assembly as described in claim 9, wherein a pair of opposite tabs inclinedly, downwardly extend from two opposite sides of the receiving room of the flow director, the tabs abutting against the mounting bracket. 11. The VGA card assembly as described in claim 9, wherein a shaft is formed on a top edge of the first sidewall of the flow director, a sleeve formed on an edge of the cover for pivotably receiving the shaft therein, whereby the cover is capable of rotating around the shaft of the flow director between the opened and closed position. 12. The VGA card assembly as described in claim 11, wherein a clasp is formed on the second sidewall of the flow director, and a protrusion is formed on the cover for engaging with the clasp of the flow director when the cover is located at the closed position. 13. The VGA card assembly as described in claim 9, wherein the flow director comprises a top wall connecting with the first and second sidewalls and a rectangular opening defined in the top wall of the flow director. 14. The VGA card assembly as described in claim 13, wherein one of sides of the opening defines a cutout and the cover forms a resilient hook on an edge thereof, the resilient hook being engaged in the cutout when the cover is located at the closed position. 15. The VGA card assembly as described in claim 14, wherein another one of the sides of the opening opposite to the cutout forms a pair of pivot pins thereon and the cover forms a protrusion defining mounting holes at opposite ends thereof, the pivot pins being pivotably received in the mounting holes of the protrusion of the cover for providing a pivotable connection between the cover and the flow director. 16. The VGA card assembly as described in claim 14, wherein two opposite sides of the opening which are beside the side of the opening defining the cutout form rails thereon and the cover defines a pair of grooves at opposite sides thereof, the cover being slidably received in the opening of the flow director by engaging the rails in the grooves whereby the cover is supported by the flow director. 17. A VGA card assembly comprising: a VGA card having a graphics processing unit (GPU) thereon; a heat dissipation device mounted on the VGA card and thermally connecting with the GPU; a housing mounted to the VGA card and enclosing the GPU and the heat dissipation device therein, wherein the housing has a top wall defining an opening above the heat dissipation device and a cover which is mounted on the housing, and wherein after the cover being mounted on the housing, the cover is movable between an opened position and a closed position, in the closed position, the opening being closed, and in the opened position, the opening being opened. 18. The VGA card assembly as described in claim 17, wherein the VGA card further has a plurality of heat-generating electronic components thereon and around the GPU, the heat dissipation device also thermally connecting with the heat-generating electronic components. 19. The VGA card assembly as claimed in claim 18, wherein the cover is pivotably mounted on the housing. 20. The VGA card assembly as claimed in claim 18, wherein the cover is slidably mounted on the housing.
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이 특허에 인용된 특허 (11)
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Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
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Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Vandeventer, Allan C.; Zoodsma, Randy J., Modular pumping unit(s) facilitating cooling of electronic system(s).
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Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
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