Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group pf process chambers located in fluid communication
Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group pf process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas. The carriers may be used to apply selective compression to the sample processing devices.
대표청구항▼
The invention claimed is: 1. A sample processing system comprising: a sample processing device comprising: a body that comprises a first side attached to a second side, a plurality of process arrays formed between the first and second sides, wherein each process array of the plurality of process ar
The invention claimed is: 1. A sample processing system comprising: a sample processing device comprising: a body that comprises a first side attached to a second side, a plurality of process arrays formed between the first and second sides, wherein each process array of the plurality of process arrays comprises a loading structure, a main conduit comprising a length, and a plurality of process chambers distributed along the main conduit, wherein the main conduit is in fluid communication with the loading structure and the plurality of process chambers; a thermal block on which the sample processing device is located; and means for simultaneously and selectively compressing the first side and second side of the sample processing device together in a discrete area proximate each process chamber of the plurality of process chambers after locating the second side of the sample processing device in contact with the thermal block. 2. A system according to claim 1, wherein each process array of the plurality of process arrays comprises a deformable seal located between the loading structure and the plurality of process chambers. 3. A system according to claim 2, wherein the deformable seal comprises a deformable portion of the second side of the body. 4. A system according to claim 1, further comprising a carrier attached to the sample processing device, the carrier comprising: a first surface facing the sample processing device and a second surface facing away from the sample processing device; a plurality of main conduit support rails proximate the first surface of the carrier, wherein each main conduit of the plurality of process arrays is aligned with one main conduit support rail of the plurality of main conduit support rails; and a plurality of openings formed through the first and second surfaces of the carrier, wherein each opening of the plurality of openings is aligned with one process chamber of the plurality of process chambers. 5. A system according to claim 4, wherein the carrier further comprises a plurality of compression structures proximate the first surface of the carrier, each compression structure of the plurality of compression structures proximate one process chamber of the plurality of process chambers. 6. A system according to claim 5, wherein the means for simultaneously and selectively compressing comprises the compression structures. 7. A system according to claim 4, wherein the carrier further comprises: a plurality of compression structures proximate the first surface of the carrier, each compression structure of the plurality of compression structures proximate one process chamber of the plurality of process chambers; and a plurality of force transmission structures, each force transmission structure of the plurality of force transmission structures comprising a discrete landing area proximate the second surface of the carrier, and each force transmission structure of the plurality of force transmission structures being operatively connected to a plurality of the plurality of compression structures, wherein a force applied to the landing surface of each force transmission structure is transmitted to the plurality of compression structures operatively connected to the force transmission structure. 8. A system according to claim 7, wherein the means for simultaneously and selectively compressing comprises the force transmission structures. 9. An system according to claim 4, wherein the carrier further comprises a plurality of collars proximate the first surface of the carrier, each collar of the plurality of collars aligned with and proximate to one process chamber of the plurality of process chambers. 10. A system according to claim 9, wherein the means for simultaneously and selectively compressing comprises the plurality of collars. 11. An system according to claim 9, wherein each collar in the plurality of collars diffuses or absorbs electromagnetic radiation of selected wavelengths. 12. An system according to claim 4, further comprising a plurality of collars proximate the first surface of the carrier, wherein each opening of the plurality of openings is aligned with one collar of the plurality of collars, and further wherein each collar of the plurality of collars is aligned with one process chamber of the plurality of process chambers.
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