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특허 상세정보

Low dust wall repair compound

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C08K-003/00    C04B-024/02    C04B-024/00    C04B-024/08    C04B-024/14   
미국특허분류(USC) 106/658; 106/660; 106/788; 106/780
출원번호 US-0277853 (2006-03-29)
등록번호 US-7449060 (2008-11-11)
발명자 / 주소
  • Langford,Nathaniel P.
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Patchett,David B.
인용정보 피인용 횟수 : 2  인용 특허 : 85

A wall repair compound useful for filling and repairing cracks, holes, and other imperfections in a wall surface includes a conventional filler material, a conventional binder material, and a dust reducing additive which reduces the quantity of airborne dust particles generated when sanding the hardened joint compound. Airborne dust reducing additives include oils, surfactants, solvents, waxes, and other petroleum derivatives. The additive can be added to conventional ready-mixed joint compounds and to setting type joint compounds. A method of reducing t...


What is claimed is: 1. A joint compound comprising: from 2% by weight to 45% by weight water; from 25% by weight to 95% by weight filler; binder comprising at least one of polyvinyl acetate, ethylene vinyl acetate co-polymer and polyacrylamide; and from 0.1% by weight to about 10% by weight dust reducing additive comprising at least one of pitch, a terpene, and a petroleum derivative, said joint compound having a mud-like consistency and, when hardened, is smoothable by sanding. 2. The joint compound of claim 1, wherein the dust reducing additive com...

인용문헌 (85)

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