Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-065/40
출원번호
US-0656378
(2007-01-23)
등록번호
US-7452197
(2008-11-18)
우선권정보
JP-2002-377632(2002-12-26)
발명자
/ 주소
Wada,Kenya
Onoshiro,Jun
Hiraseko,Kouji
출원인 / 주소
Hitachi High Technologies Corporation
대리인 / 주소
Antonelli, Terry, Stout & Kraus, LLP.
인용정보
피인용 횟수 :
0인용 특허 :
35
초록▼
On an application stage of resin are provided two (2) sets of dispensers 20 and 40. The one dispenser 20 supplies the resin directing to an upper side corner on a liquid crystal cell 1, while the other dispenser 40 directing to a lower side corner thereon. The dispenser 40 has a syringe 41 and a nee
On an application stage of resin are provided two (2) sets of dispensers 20 and 40. The one dispenser 20 supplies the resin directing to an upper side corner on a liquid crystal cell 1, while the other dispenser 40 directing to a lower side corner thereon. The dispenser 40 has a syringe 41 and a needle-like nozzle 42, and the needle-like nozzle 42 emits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.
대표청구항▼
What is claimed is: 1. A resin applying apparatus on a panel, for applying resin onto an upper side corner defined between a projection portion of a lower substrate and an upper substrate, and a lower side corner of a drawing portion of the lower substrate from a flexible board, on a panel being ma
What is claimed is: 1. A resin applying apparatus on a panel, for applying resin onto an upper side corner defined between a projection portion of a lower substrate and an upper substrate, and a lower side corner of a drawing portion of the lower substrate from a flexible board, on a panel being made up with two pieces of substrates, in which at least two sides of the lower substrate are projected from the upper substrate and are attached with a plural number of flexible boards at the projection portions of the lower substrate at a predetermined pitch distance therebetween, comprising: a first and a second dispensers, being disposed on opposite sides of a plane passing between an upper surface of said lower substrate and a lower surface of said upper substrate for applying the resin, at said upper side corner and said lower side corner, under non-contacting condition therewith, wherein each of those first and second dispensers is constructed with a syringe and a needle-like nozzle, respectively; the second dispenser for supplying the resin onto said lower side corner is provided with a flow passage for changing the resin supplied from a lower side of said syringe in direction thereof, directing upward obliquely, by means of the needle-like nozzle; either one of said panel or said dispensers in made to move, relatively, with respect to the other, by means of a transfer means; said first dispenser for applying the resin onto the upper side corner is so controlled that the resin is applied almost uniformly over a total length of said panel, by means of a first control means; and said second dispenser for applying the resin onto the lower side corner is so controlled that the resin is applied onto each attaching portion of each of the flexible boards, by means of a second control means. 2. A The resin applying apparatus according to claim 1, wherein said needle-like nozzle of said second dispenser is attached onto a swing arm, and a flow passage between said needle-like nozzle and said syringe of said second dispenser is made of a flexible tube, so that said needle-like nozzle of said second dispenser can be changed in position, between a condition where the emission opening thereof is directed to the lower side corner, and a condition where the emission opening is dipped into a solvent tank, by swinging said swing arm. 3. The resin applying apparatus according to claim 1, wherein the needle-like nozzle of the first dispenser is directed obliquely downward. 4. The resin applying apparatus according to claim 1, wherein each of the first and second dispensers include a suppressing means for sending the resin to said needle-like nozzle with pressure, by applying pressure onto liquid surface within said syringe, and a control means for controlling the emission of the resin from said needle-like nozzle, as well as, stoppage thereof.
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