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An RF device has a support structure. An RF electrode, coupled to the support structure, includes conductive and dielectric portions. A cooling member, coupled to the support structure, is configured to cool a back surface of the RF electrode. The cooling member is distanced from the back surface of

An RF device has a support structure. An RF electrode, coupled to the support structure, includes conductive and dielectric portions. A cooling member, coupled to the support structure, is configured to cool a back surface of the RF electrode. The cooling member is distanced from the back surface of the RF electrode.

대표청구항 ▼

What is claimed is: 1. An RF device for non-invasively treating tissue using RF energy, comprising: a support structure; and an RF electrode coupled to the support structure, the RF electrode including a conductive portion and a dielectric portion, the dielectric portion adapted to be disposed betw

What is claimed is: 1. An RF device for non-invasively treating tissue using RF energy, comprising: a support structure; and an RF electrode coupled to the support structure, the RF electrode including a conductive portion and a dielectric portion, the dielectric portion adapted to be disposed between the conductive portion and the tissue when the RF device is non-invasively treating the tissue, the conductive portion including a plurality of voids and solid conductive material surrounding the voids, and the conductive portion and the dielectric portion being arranged such that the RF energy is capacitively coupled from the conductive portion through the dielectric portion to the tissue. 2. The RF device of claim 1, wherein an interior of the RF electrode has a larger amount of capacitive coupling to a skin surface of the tissue than an outer edge of the RF electrode has to the skin surface. 3. The RF device of claim 1, wherein the outer edge has a geometry that is selected to reduce an amount of the conductive portion at the outer edge so as to reduce an amount of capacitively coupled area at the outer edge. 4. The RF device of claim 1, further comprising: a flex circuit coupled to the RF electrode. 5. The RF device of claim 1, further comprising: a back plate coupled to the support structure; and a plurality of electrical contact pads coupled to the back plate. 6. The RF device of claim 1, wherein the support structure includes first and second engagement members that provide engagement and disengagement with a handpiece. 7. The RF device of claim 1, further comprising: at least a first sensor coupled to the RF electrode. 8. The RF device of claim 7, wherein the RF electrode has a front surface adapted to be positioned near a skin surface of the tissue and an opposing back surface, and the at least first sensor is positioned at the back surface. 9. The RF device of claim 8, wherein the at least first sensor detects a temperature of the back surface. 10. The RF device of claim 1, further comprising: a non-volatile memory coupled to the RF electrode. 11. An RF device for non-invasively treating tissue using RF energy, comprising: a support structure; and an RF electrode coupled to the support structure, the RF electrode including a flex circuit with a conductive portion and a dielectric portion adapted to be disposed between the conductive portion and the tissue when the RF electrode is positioned at a skin surface of the tissue to provide for passage of RF energy by capacitive coupling through the dielectric portion to the tissue. 12. An RF device for non-invasively treating tissue using RF energy, comprising: an RF electrode including a conductive portion and a dielectric portion disposed between the conductive portion and the tissue when the RF device is non-invasively treating the tissue, the conductive portion and the dielectric portion being arranged such that the RF energy is capacitively coupled from the conductive portion through the dielectric portion to the tissue, the RF electrode having a front surface and an opposing back surface; a support structure coupled to the RF electrode, the support structure and the RF electrode forming a seal where the support structure is coupled to the RF electrode that is sufficient to minimize flow of a cooling fluidic medium between the front and back surfaces of the RF electrode; and a cooling member coupled to the support structure and configured to cool the back surface of the RF electrode. 13. The RF device of claim 12, wherein the seal is a fluid tight seal. 14. The RF device of claim 12, wherein the back surface is positioned to be cooled and the front surface is positioned to deliver energy to the tissue. 15. The RF device of claim 12, wherein the back surface is positioned to be cooled by a fluid. 16. The RF device of claim 14, wherein the fluid is a gas. 17. The RF device of claim 14, wherein the fluid is a liquid. 18. The RF device of claim 14, further comprising: a sensor coupled to the RF electrode. 19. The RF device of claim 18, wherein the sensor is positioned at the back surface of the RF electrode. 20. The RF device of claim 19, wherein the sensor detects a temperature of the back surface of the RF electrode. 21. The RF device of claim 18, wherein the sensor is positioned at the front surface of the RF electrode. 22. The RF device of claim 18, wherein the sensor detects a temperature of the front surface of the RF electrode. 23. The RF device of claim 12, wherein the cooling member is distanced from the back surface of the RF electrode. 24. The RF device of claim 12, wherein the cooling member comprises a thermo-electric cooler. 25. An RF device for non-invasively treating tissue using RF energy, comprising: a support structure; and an RF electrode coupled to the support structure, the RF electrode including a flex circuit with a conductive portion and a dielectric portion, the dielectric portion adapted to be positioned between the conductive portion and the tissue when the RF electrode is positioned at a skin surface to provide for passage of energy through the dielectric portion to the tissue, the conductive portion having a back surface, the flex circuit configured to create a reservoir for a cooling fluidic medium that gathers at the back surface of the conductive portion.