초록 ▼

Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy

Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

대표청구항 ▼

The invention claimed is: 1. The method for dissipating thermal energy from an assemblage of conduction-cooled circuit card assemblies each having oppositely disposed edge regions at least one of which is configured for the conductive transfer of thermal energy, comprising the steps: providing a ch

The invention claimed is: 1. The method for dissipating thermal energy from an assemblage of conduction-cooled circuit card assemblies each having oppositely disposed edge regions at least one of which is configured for the conductive transfer of thermal energy, comprising the steps: providing a chassis configured having a backplane assembly with connectors for operative connection with said assemblage of conduction cooled circuit card assemblies; providing an assemblage of oppositely disposed conduction rail assemblies located with respect to said backplane assembly having card guide slots to receive the oppositely disposed edge regions of said conduction-cooled circuit card assemblies and retain them in a card pitch defined sequence; locating said assemblage of conduction-cooled circuit card assemblies by positioning the oppositely disposed edge regions of each within a card slot and operatively connecting it with a corresponding backplane assembly connector; compressibly engaging at least one edge region of each conduction-cooled circuit card assembly in conductive thermal transfer relationship with an operationally associated conduction rail assembly, said assemblage of conduction-cooled circuit card assemblies defining a given thermal load conductively transferable to said assemblage of conduction rail assemblies; providing one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and supported by said chassis at a location remote from said thermal load; providing an assemblage of heat pipes mounted with said chassis in thermal transfer relationship between said assemblage of conduction rail assemblies and said one or more remote heat sink assemblies, said assemblage of heat pipes and said one or more remote heat sink assemblies being configured to transfer at least a portion of said thermal load to said one or more remote heat sink assemblies; providing one or more proximate heat sink assemblies configured for the transfer of thermal energy to a flow of air, supported by said chassis at a location or locations establishing a conductive thermal transfer relationship with all or a portion of said assemblage of conduction rail assemblies, said one or more proximate heat sink assemblies and said one or more remote heat sink assemblies being configured in concert to effect the transfer of said thermal load to flowing air; flowing air in thermal transfer relationship with the one or more proximate heat sink assemblies to disperse thermal energy therefrom; and flowing air in thermal transfer relationship with the one or more remote heat sink assemblies to disperse thermal energy therefrom. 2. The method of claim 1 in which: said steps of flowing air in heat transfer relationship are carried out using a common fan assemblage mounted with said chassis. 3. The method of claim 1 in which: said step providing a chassis locates the backplane in a lower region of it; and said step providing one or more remote heat sink assemblies supported by said chassis locating one or more remote heat sinks beneath the backplane. 4. The method of claim 1 further comprising the steps: determining geometric limiting dimensions for providing said chassis; based upon the parameters comprising said pitch, a practical available air velocity, an air pressure of the flowing air, an air-to-rail differential temperature, an optimal fin length, height and density, determining an optimized proximate heat sink structure and its capability for optimally dissipating all or a portion of said given thermal load; and altering one or more said optimized proximate heat sink structures to conform to the requirements of said geometric limiting dimensions. 5. The method of claim 4 further comprising the steps: determining the thermal energy dissipating capability of the altered proximate heat sink structures and the remaining thermal load portion not dissipated thereby; and said one or more remote heat sink assemblies are configured to dissipate at least said remaining thermal load. 6. The method of claim 4 in which: said assemblage of heat pipes are provided in thermal transfer relationship only with those conduction rail assemblies exhibiting a thermal energy condition not dissipated by said proximate heat sink assemblies. 7. The method of claim 1 in which: the thermal energy receiving portions of heat pipes of said assemblage are mounted in thermal transfer relationship internally within said conduction rail assemblies where said pitch provides adequate space. 8. The method of claim 1 in which: the thermal energy receiving portions of the heat pipes of said assemblage are mounted in thermal transfer relationship externally upon said conduction rail assemblies where said pitch exhibits a spacing between card guide slots inadequate to receive the thermal energy receiving portions. 9. The method of claim 1 in which: said chassis is provided having front and rear portions with sides extending between them each provided as an external surface of said assemblage of conduction rail assemblies; said one or more remote heat sink assemblies are supported by said chassis adjacent said rear portion; and the thermal energy receiving portions of the heat pipes of said assemblage are mounted in thermal transfer relationship with said chassis sides. 10. The method of claim 1 in which: said chassis is provided with top and bottom portions and oppositely disposed side portions extending between front and rear portions, said backplane being disposed centrally adjacent said rear portion and spaced from said side portions; said assemblage of oppositely disposed conduction rail assemblies are provided at said top and bottom portions in general alignment with said backplane; said one or more proximate heat sink assemblies are located centrally in general alignment with said conduction rail assemblies; and said one or more remote heat sink assemblies are located at said chassis top and bottom portions in general adjacency with said proximate heat sinks. 11. A system for operatively supporting an assemblage of conduction-cooled circuit card assemblies each having oppositely disposed edge regions configured for the conductive transfer of thermal energy, comprising: a chassis having oppositely disposed sides extending between end portions; a backplane within said chassis having a pitch defining sequence of backplane connectors; an assemblage of oppositely disposed conduction rail assemblies located with respect to said backplane, having card slots in pitch-defining relationship with said backplane connectors configured to receive a thermal load defining sequence of said conduction-cooled card assemblies by heat conducting contact with said edge regions; one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and supported at said chassis at a location generally without the influence of heat at the conduction rail assemblies; an assemblage of heat pipes mounted with said chassis in heat transfer relationship between said assemblage of conduction rail assemblies and said one or more remote heat sink assemblies configured to transfer at least a portion of said thermal load to the one or more remote heat sink assemblies; and one or more proximate heat sink assemblies configured for the transfer of thermal energy to a flow of air, supported by said chassis at a location or locations establishing a conductive heat transfer relationship with said assemblage of conduction rail assemblies, said one or more proximate heat sink assemblies and said one or more remote heat sink assemblies being configured in concert to effect the transfer of said thermal load to flowing air. 12. The system of claim 11 further comprising: a source of fan derived flowing air mounted with the chassis at a location effecting thermal transfer to said flowing air from said one or more remote heat sink assemblies. 13. The system of claim 11 in which: said chassis is configured having a bottom region and a top region; said backplane is supported at said bottom region; said one or more remote heat sink assemblies are mounted within said chassis generally below said backplane; said chassis is configured defining an air flow path extending between said top region across the one or more proximate heat sink assemblies, across the one or more remote heat sink assemblies and a chassis end portion; and further comprising: a fan assemblage supported at a said end portion in air flow communication with said air flow path and configured to establish an air flow along said path exhibiting a velocity effective to disperse said thermal load. 14. The system of claim 13 in which: said pitch is of a length adequate to locate each heat pipe within the chassis between adjacent card slots; and each heat pipe is mounted between adjacent card slots. 15. The system of claim 14 in which: each heat pipe of the assemblage of heat pipes is configured having a thermal energy receiving portion extending internally within a conduction rail assembly and is bent to extend an opposite thermal transfer portion internally within the chassis below the backplane into thermal transfer engagement with a remote heat sink assembly. 16. The system of claim 13 in which: said pitch is of a length inadequate to locate each heat pipe within the chassis between adjacent card slots; and each heat pipe is mounted in thermal transfer relationship at an outwardly disposed surface of said assemblage of conduction rail assemblies. 17. The system of claim 14 in which: said one or more proximate heat sink assemblies are located over the assemblage of heat pipes. 18. The system of claim 16 in which: each heat pipe of the assemblage of heat pipes is configured having a thermal energy receiving portion mounted with said outwardly disposed surface of a conduction rail assembly and is bent to extend an opposite thermal transfer portion into the chassis below the backplane into thermal transfer engagement with a remote heat sink assembly. 19. The system of claim 11 in which: said one or more remote heat sink assemblies are supported by the chassis at one end portion outwardly from the assemblage of conduction rail assemblies; and said assemblage of heat pipes extend along the oppositely disposed sides of the chassis from conductive thermal engagement with the assemblage of oppositely disposed conduction rail assemblies to the one or more remote heat sink assemblies. 20. The system of claim 19 further comprising: a source of fan derived moving air supported by the chassis at a location adjacent said one or more remote heat sink assemblies and defining an air flow path extending generally vertically across the one or more remote heat sink assemblies. 21. The system of claim 11 in which: said chassis is configured having top and bottom portions and oppositely disposed side portions extending between front and rear portions; said backplane is disposed centrally adjacent said rear portion and spaced from said side portions; said assemblage of oppositely disposed conduction rail assemblies is located at said top and bottom portions in general alignment with said backplane; said one or more proximate heat sink assemblies are located centrally in general alignment with said conduction rail assemblies; and said one or more remote heat sink assemblies are located at said chassis top and bottom portions in general adjacency with said proximate heat sinks. 22. The system of claim 21 in which: each heat pipe is mounted in thermal transfer relationship at an outwardly disposed surface of the assemblage of conduction rail assemblies. 23. The system of claim 21 in which: said chassis is configured to define an air flow path extending between said front portion, across said proximate and remote heat sink assemblies and said rear portion; and further comprising: a fan assemblage supported at said front or rear portion in air flow communication with said air flow path and configured to establish an air flow along said path exhibiting a velocity effective to disburse said thermal load.