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In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance with the present invention includes a substrate, preferably flexible, having first and second oppositely

In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance with the present invention includes a substrate, preferably flexible, having first and second oppositely facing surfaces. Such interposers also include an array of links traversing from the first surface of the substrate to the second surface of the substrate. In accordance with the present invention, each link preferably comprises a buried portion positioned between the first and second surfaces of the substrate. In other aspects of the present invention, microelectronic assemblies having first and second microelectronic components interconnected by an interposer and methods of interconnecting such components are provided.

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What is claimed is: 1. An interposer comprising: a dielectric substrate having first and second oppositely facing surfaces, the dielectric substrate having a unitary structure of a flexible material; and a plurality of distinct links arranged as an array, each link comprising: a conductive portion

What is claimed is: 1. An interposer comprising: a dielectric substrate having first and second oppositely facing surfaces, the dielectric substrate having a unitary structure of a flexible material; and a plurality of distinct links arranged as an array, each link comprising: a conductive portion buried in the dielectric substrate and located at a predetermined position between the first and second surfaces of the dielectric substrate; a first via formed in the dielectric substrate, the first via extending from the first surface of the dielectric substrate to the conductive portion; and a second via formed in the dielectric substrate, the second via extending from the second surface of the dielectric substrate to the conductive portion and having a predetermined alignment with the first via; wherein the conductive portion has a substantially rectangular boundary that is larger than the first and second vias; wherein the interposer is configured to connect to at least one electronic device comprising an integrated circuit with at least one attach pad for interfacial coupling to the interposer to produce a z-axis mechanical compliance for interfacial flexure between the electronic device interfacial attach pad and a host substrate interfacial attach pad. 2. The interposer of claim 1, wherein the conductive portion of at least one link comprises a metal layer buried in the dielectric substrate. 3. The interposer of claim 1, wherein at least one of the first and second vias of at least one link decreases in size as the at least one of the first and second vias extends from the first surface of the dielectric substrate to the conductive portion. 4. The interposer of claim 1, wherein a central axis of the first via of at least one link overlaps with a central axis of the second via of the at least one link. 5. The interposer of claim 1, wherein a central axis of the first via of at least one link is spaced from a central axis of the second via of the at least one link. 6. The interposer of claim 1, wherein at least one of the first and second vias of at least one link comprises an attach pad, the attach pad comprising a first portion provided on a surface of the dielectric substrate and a second portion electrically connected to the conductive portion of the at least one link. 7. The interposer claim 1, wherein at least one of the first and second vias of at least one link comprises an attach pad, the attach pad comprising an exposed portion of the conductive portion of the at least one link. 8. The interposer of claim 1, wherein the interposer is in combination with and electrically connected to a microelectronic component. 9. The combination of claim 8, wherein the interposer is electrically connected to the microelectronic component with an area array. 10. The combination of claim 9, wherein the area array comprises a regularly arranged grid. 11. The combination of claim 9, wherein the area array comprises an irregularly arranged array. 12. The combination of claim 9, wherein the area array comprises one of a land grid array, a ball grid array, a bump grid array, and a column grid array. 13. The combination of claim 8, further comprising a printed circuit board electrically connected to the interposer. 14. The combination of claim 13, wherein the printed circuit board is electrically connected to the interposer with an area array. 15. The combination of claim 14, wherein the area array comprises a regularly arranged grid. 16. The combination of claim 14, wherein the area array comprises an irregularly arranged array. 17. The combination of claim 14, wherein the area array comprises one of a land grid array, a ball grid array, a bump grid array, and a column grid array. 18. An electronic device assembly, comprising: a first electronic device having a plurality of attach pads; a second electronic device having a plurality of attach pads; an interposer positioned between the first and second electronic devices, the interposer comprising a dielectric substrate having a plurality of distinct links between first and second oppositely facing surfaces of the dielectric substrate, each link of the plurality of links comprising first and second vias electrically connected by an electrically conductive trace buried in the dielectric substrate and positioned between the first and second oppositely facing surfaces of the dielectric substrate, the dielectric substrate having a unitary structure of a flexible material, the electrically conductive trace having a substantially rectangular boundary that is larger than the first and second vias; at least one first interfacial bond electrically connecting at least one attach pad of the first electronic device to at least one via attach pad at the first surface of the dielectric substrate; and at least one second interfacial bond electrically connecting at least one attach pad of the second electronic device to at least one via attach pad at the second surface of the dielectric substrate; wherein the at least one attach pad of the first electronic device and the at least one attach pad of the second electronic device are interfacially electrically coupled to the interposer through at least one link of the interposer to produce a z-axis mechanical compliance for interfacial flexure between each of the first and second electronic devices. 19. The electronic device assembly of claim 18, wherein the first electronic device comprises a bare integrated circuit chip and the second electronic device comprises an electronic package. 20. The electronic device assembly of claim 18, wherein the first electronic device comprises a bare integrated circuit chip and the second electronic device comprises a printed circuit board. 21. The electronic device assembly of claim 18, wherein the first electronic device comprises a packaged integrated circuit chip and the second electronic device comprises a printed circuit board. 22. The electronic device assembly of claim 18, wherein the first and second interfacial bonds comprise a regularly arranged grid. 23. The electronic device assembly of claim 18, wherein the first and second interfacial bonds comprise an irregularly arranged array. 24. The electronic device assembly of claim 18, wherein the first and second interfacial bonds comprise one of a land grid array, a ball grid array, a bump grid array, and a column grid array. 25. An electronic device assembly, comprising: an interposer compnsing: a dielectric substrate having first and second oppositely facing surfaces, the dielectric substrate having a unitary structure of a flexible material; and a plurality of distinct links arranged as an array, each link comprising: a conductive portion buried in the dielectric substrate and located at a predetermined position between the first and second surfaces of the dielectric substrate; a first via formed in the dielectric substrate, the first via extending from the first surface of the dielectric substrate to the conductive portion; and a second via formed in the dielectric substrate, the second via extending from the second surface of the dielectric substrate to the conductive portion and having a predetermined alignment with the first via; and a plurality of connector members coupled to the links, the connector members located at the first and second surfaces of the dielectric substrate and comprising a land grid array or a column grid array; and at least one electronic device comprising a bare or packaged integrated circuit with a plurality of attach pads interfacially coupled the connector members at the first surface of the dielectric substrate to produce a mechanically compliant connection path between the electronic device attach pads and the connector members at the second surface of the dielectric substrate.