A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generat
A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generated by the fan, so as to quickly dissipate the heat energy of the electronic component.
대표청구항▼
What is claimed is: 1. A heatsink apparatus, for dissipating heat generated by an electronic component of an electronic apparatus, comprising: a fan, for generating an air flow; and a heatsink fin, having two ends, one end of the heatsink fin formed of a curl portion overlappingly bent with an inte
What is claimed is: 1. A heatsink apparatus, for dissipating heat generated by an electronic component of an electronic apparatus, comprising: a fan, for generating an air flow; and a heatsink fin, having two ends, one end of the heatsink fin formed of a curl portion overlappingly bent with an interval so as to form a plurality of continuous curl inner surfaces, each continuous curl inner surface spaced apart from each other with an interval, the other end extending from the curl portion and adhered to the electronic component by an end surface, so as to conduct the heat generated from the electronic component to the curl portion, wherein the curl inner surface of the curl portion receives the air flow of the fan, so as to dissipate the heat. 2. The heatsink apparatus as claimed in claim 1, wherein a winding axial direction of the curl portion is parallel to a flowing direction of the air flow of the fan. 3. The heatsink apparatus as claimed in claim 2, wherein the winding axial direction of the curl portion forms an angle with the flowing direction of the air flow of the fan. 4. The heatsink apparatus as claimed in claim 3, wherein the winding axial direction forms an angle less than 70° with respect to the flowing direction of the air flow of the fan. 5. The heatsink apparatus as claimed in claim 1, wherein the curl portion is a spiral structure. 6. The heatsink apparatus as claimed in claim 5, wherein the curl portion is a round spiral structure. 7. The heatsink apparatus as claimed in claim 5, wherein the curl portion is a square spiral structure. 8. The heatsink apparatus as claimed in claim 5, wherein the curl portion is a corrugated spiral structure. 9. The heatsink apparatus as claimed in claim 1, wherein the curl portion is a turn back structure. 10. The heatsink apparatus as claimed in claim 9, wherein the curl portion is a straight turn back structure. 11. The heatsink apparatus as claimed in claim 9, wherein the curl portion is a corrugated turn back structure. 12. The heatsink apparatus as claimed in claim 1, wherein the fan is an axial flow fan, the curl portion is disposed at an axial vent of the axial flow fan, so as to receive the air flow of the fan. 13. The heatsink apparatus as claimed in claim 1, wherein the fan is a side flow fan, the curl portion is disposed at a side vent of the side flow fan, so as to receive the air flow of the fan.
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이 특허에 인용된 특허 (11)
Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards.
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