Transpiration cooling for passive cooled ultra mobile personal computer
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
F28F-007/00
출원번호
US-0762913
(2007-06-14)
등록번호
US-7463486
(2008-12-09)
발명자
/ 주소
Hu,Xuejiao
출원인 / 주소
Intel Corporation
대리인 / 주소
Guglielmi,David L.
인용정보
피인용 횟수 :
2인용 특허 :
3
초록▼
In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circui
In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.
대표청구항▼
What is claimed is: 1. An apparatus configured to be held in a person's hand comprising: a plurality of integrated circuit device(s); a power source to power the integrated circuit device(s); a chassis to house the integrated circuit device(s) and the power supply; and a skin to cover the chassis,
What is claimed is: 1. An apparatus configured to be held in a person's hand comprising: a plurality of integrated circuit device(s); a power source to power the integrated circuit device(s); a chassis to house the integrated circuit device(s) and the power supply; and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. 2. The apparatus of claim 1, wherein the water absorbent layer comprises a temperature sensitive hydro gel. 3. The apparatus of claim 2, wherein the temperature sensitive hydro gel comprises an acrylic acid-grafted carboxymethyl cellulose. 4. The apparatus of claim 1, further comprising an outer layer including micro-pores configured to allow water to move into and out of the water absorbent layer, the outer layer substantially covering an outer surface of the water absorbent layer. 5. The apparatus of claim 4, further comprising a funnel-shaped opening in the outer layer for adding water to the water absorbent layer. 6. The apparatus of claim 4, further comprising an input port in the outer layer for coupling a water source to the water absorbent layer. 7. The apparatus of claim 4, further comprising an extending surface configured to rest on the lip of a water container to allow the water absorbent layer to be substantially submerged and to prevent the entire apparatus from falling into the water container. 8. An electronic appliance comprising: a network controller; a system memory; a processor; and a skin, the skin comprising a waterproof inner layer, a water absorbent middle layer, and an outer layer containing micro-pores. 9. The electronic appliance of claim 8, wherein the water absorbent middle layer comprises material with a water absorbency that is substantially temperature sensitive. 10. The electronic appliance of claim 8, wherein the water absorbent middle layer comprises a temperature sensitive hydro gel. 11. The electronic appliance of claim 10, wherein the temperature sensitive hydro gel comprises an acrylic acid-grafted carboxymethyl cellulose. 12. The electronic appliance of claim 10, wherein the hydro gel has a water absorbency that substantially changes at about 30 degrees Celsius. 13. The electronic appliance of claim 10, wherein the micro-pores in the outer layer comprise openings sufficiently large enough for water to pass through and sufficiently small enough to prevent the hydro gel from passing through. 14. An apparatus comprising: a plurality of integrated circuit device(s); a power source to power the integrated circuit device(s); a chassis to house the integrated circuit device(s) and the power supply; and a skin to cover the chassis, the skin comprising means for preventing water from contacting the integrated circuit device(s) and means for absorbing water. 15. The apparatus of claim 14, further comprising: means for covering the means for absorbing water; and means for allowing water transport to and from the means for absorbing water. 16. The apparatus of claim 14, wherein the means for absorbing water comprises means for absorbing water from ambient air. 17. The apparatus of claim 14, wherein the means for absorbing water comprises means for absorbing water at a temperature sensitive maximum absorbency. 18. The apparatus of claim 14, wherein the means for absorbing water comprises means for releasing absorbed water at a temperature of greater than about 30 degrees Celsius. 19. The apparatus of claim 14, further comprising means for coupling the apparatus with a water source. 20. An electronic appliance comprising: a network controller; a system memory; a processor; and a skin substantially covering the network controller, system memory and processor, the skin comprising a waterproof inner layer, a temperature sensitive hydro gel middle layer, and an outer layer containing micro-pores. 21. The electronic appliance of claim 20, wherein the temperature sensitive hydro gel is capable of absorbing more water at temperatures below about 30 degrees Celsius than at temperatures above about 30 degrees Celsius. 22. The electronic appliance of claim 20, further comprising a funnel-shaped opening in the outer layer for adding water to the temperature sensitive hydro gel. 23. The electronic appliance of claim 20, wherein the temperature sensitive hydro gel is capable of absorbing water from ambient air. 24. The electronic appliance of claim 20, further comprising an input port in the outer layer for coupling a water source to the temperature sensitive hydro gel.
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이 특허에 인용된 특허 (3)
Xiong,Wei, Conductive cooling pad for use with a laptop computer.
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