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Cleaning method and solution for cleaning a wafer in a single wafer process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01F-003/04
출원번호 US-0497025 (2006-07-31)
등록번호 US-7469883 (2008-12-30)
발명자 / 주소
  • Verhaverbeke,Steven
  • Truman,Kelly
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Blakely Sokoloff Taylor & Zafman, LLP
인용정보 피인용 횟수 : 5  인용 특허 : 46

초록

The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present inve

대표청구항

We claim: 1. A method of preparing a rinse solution comprising: using a stacked membrane consisting essentially of a solid membrane on top of a porous membrane; passing H2O along said porous membrane; and passing CO2 gas along said solid membrane; and diffusing said CO2 gas through said solid membr

이 특허에 인용된 특허 (46)

  1. Katou Hitoshi,JPX ; Sakai Kazunari,JPX ; Kambe Toshio,JPX ; Oi Kazumi,JPX, Apparatus and method for adding carbon dioxide gas to ultra pure water.
  2. Ryu Do H. (Kyungsangnam-Do KRX), Apparatus for mixing liquids in a certain ratio.
  3. Ban Cozy (Itami JPX) Yanagi Motonori (Itami JPX) Fukumoto Takaaki (Itami JPX) Manabe Toshiki (Toda JPX) Yanome Hiroshi (Toda JPX) Kawada Kazuhiko (Toda JPX), Apparatus for producing pure water.
  4. Hirooka, Taisuke; Sakumichi, Hidetaka, Cleaning and handling methods of electronic component and cleaning apparatus thereof.
  5. Verhaverbeke, Steven; Truman, J. Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  6. Ohmi Tadahiro,JPX ; Ojima Senri,JPX ; Nitta Takahisa,JPX, Cleaning method for peeling and removing photoresist.
  7. Sugihara Yasuo (Tokyo JPX) Tanaka Kazushige (Tokyo JPX) Kawakami Michiya (Tokyo JPX), Cleaning solution of semiconductor substrate.
  8. Cazer Frederick D. (Earlville NY) Scott Barry L. (Norwich NY) Strobel Garth E. (Smyrna NY), Column chromatographic column apparatus with switching capability.
  9. Anazawa Takanori (Sakura JPX) Watanabe Hideki (Chiba JPX), Diaphragm for gas-liquid contact, gas-liquid contact apparatus and process for producing liquid containing gas dissolved.
  10. Page John K. R.,GBX, Dispense of beverage containing controlled levels of dissolved gas.
  11. Inoue Manabu (Tokyo JPX) Kaneta Mitsutada (Ichikawa JPX) Ozawa Junko (Chiba JPX), Electroless plating solution and plating method with it.
  12. Minford, William J.; Murphy, Edmond J.; Rice, Trudie C., Etching of titanium.
  13. Akimoto Masami,JPX ; Yoshioka Kazutoshi,JPX ; Sakamoto Kazuo,JPX ; Semba Norio,JPX, Method and apparatus for coating a film on an object being processed.
  14. Sugimoto Kenji (Kyoto JPX) Sugimoto Hiroaki (Kyoto JPX) Kitagawa Masaru (Kyoto JPX), Method and apparatus for drying a substrate having a resist film with a miniaturized pattern.
  15. Verhaverbeke,Steven; Truman,J Kelly; Lane,Christopher T; Somekh,Sasson R, Method and apparatus for processing a wafer.
  16. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Method and system for fluid treatment of semiconductor wafers.
  17. Okamura Ryuji,JPX ; Shirasuna Toshiyasu,JPX ; Takada Kazuhiko,JPX ; Akiyama Kazuyoshi,JPX ; Murayama Hitoshi,JPX ; Hosoi Kazuto,JPX, Method for cleaning a substrate.
  18. Cooper Emanuel I. ; Estes Scott A. ; Gale Glenn W. ; Jagannathan Rangarajan ; Okorn-Schmidt Harald F. ; Rath David L., Method for cleaning semiconductor devices.
  19. George Anna M. ; Towery Daniel L., Method for cleaning semiconductor wafers containing dielectric films.
  20. Fu, Chiang; Harn, Yu-Chyi, Method for cleaning wafers with ionized water.
  21. Schulz Peter (Wappingers Falls NY), Method for reducing metal contamination of silicon wafers during semiconductor manufacturing.
  22. Schulz Peter,DEX, Method for reducing metal contamination of silicon wafers during semiconductor manufacturing.
  23. Uchida Makoto,JPX ; Kobuke Masanao,JPX ; Watari Kenji,JPX ; Nagasaka Yoshinori,JPX, Method for the preparation of a carbonate spring.
  24. Morinaga Hitoshi,JPX ; Fujisue Masaya,JPX, Method for treating surface of substrate.
  25. Mohamed Emam Labib ; Ching-Yue Lai ; Peter A. Materna ; Geoffrey Lawrence Mahon, Method of cleaning passageways using a mixed phase flow of gas and a liquid.
  26. Saito Yoshimitsu (Saitama JPX), Method of fabricating semiconductor device.
  27. Pyke Stephen C. (Willowick OH), Method of forming suspended gate, chemically sensitive field-effect transistor.
  28. Ramachandran Ravikumar, Method of reducing the formation of watermarks on semiconductor wafers.
  29. Andreas Michael T., Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods.
  30. Verhaverbeke Steven, Methods for treating semiconductor wafers.
  31. Ilardi Joseph M. (Sparta NJ) Schwartzkopf George (Franklin Township NJ) Dailey Gary G. (Easton PA), PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates.
  32. Huang Ying-Shih,TWX, Post-CMP cleaner apparatus and method.
  33. Bernosky Eugene W. (Hollister CA) Geatz J. Tobin (Durham NC) Ferrie ; Jr. Edward T. (Gilroy CA) Roberson ; Jr. Glenn A. (Hollister CA), Process for precise volumetrio diluting/mixing of chemicals.
  34. Lebowitz Joseph ; Faulk Laura E., Residue removal by CO2 water rinse in conjunction with post metal etch plasma strip.
  35. Shackelford Carl L. (San Pablo CA), Sample injection valve.
  36. Toge Yoshiyuki (Yokohama JPX), Sample inspecting method and apparatus.
  37. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.
  38. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.
  39. Lin Chung-Te,TWX ; Ho Chin-Hsiung ; Chiu Hsueh-Liang,TWX ; Kuo So-Wein,TWX, Simplified process for the fabrication of deep clear laser marks using a photoresist mask.
  40. Suzuki, Tetsuo; Takada, Satoru, Specifying method for Cu contamination processes and detecting method for Cu contamination during reclamation of silicon wafers, and reclamation method of silicon wafers.
  41. Ueno Kinya,JPX, Spin cleaning method.
  42. Hayashida Ichiro,JPX ; Kakizawa Masahiko,JPX, Surface treating agents and treating process for semiconductors.
  43. Morinaga Hitoshi,JPX, Surface treatment composition and method for treating surface of substrate by using the same.
  44. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  45. Verhaverbeke Steven ; McConnell Christopher F. ; Trissel Charles F., Wet processing methods for the manufacture of electronic components using sequential chemical processing.
  46. Peng Chun-Hong,TWX ; Chao Weisheng,TWX, Wet-dry-wet process in wet station.

이 특허를 인용한 특허 (5)

  1. {hacek over (S)}ik, Jan; Kostelník, Petr; Válek, Luká{hacek over (s)}; Lorenc, Michal; Pospí{hacek over (s)}il, Milo{hacek over (s)}; Lysá{hacek over (c)}ek, David; Parsey, Jr., John Michael, Methods of laser marking semiconductor substrates.
  2. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  3. {hacek over (S)}ik, Jan; Kostelnik, Petr; Válek, Luká{hacek over (s)}; Lorenc, Michal; Pospí{hacek over (s)}il, Milo{hacek over (s)}; Lysá{hacek over (c)}ek, David; Parsey, Jr., John Michael, Semiconductor devices and methods of making the same.
  4. Patel, Dhansukhbhai V., Systems and methods for sequestering CO2.
  5. Arndt, Russell H.; Hilscher, David F., Tool for manufacturing semiconductor structures and method of use.
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