IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
|
출원번호 |
US-0207122
(2005-08-17)
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등록번호 |
US-7473969
(2009-01-06)
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발명자
/ 주소 |
- Aitken,Bruce Gardiner
- Dejneka,Matthew John
- Gadkaree,Kishor Purushottam
- Pinckney,Linda Ruth
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
3 인용 특허 :
20 |
초록
▼
The present invention relates to semiconductor-on-insulator structures having strained semiconductor layers. According to one embodiment of the invention, a semiconductor-on-insulator structure has a first layer including a semiconductor material, attached to a second layer including a glass or glas
The present invention relates to semiconductor-on-insulator structures having strained semiconductor layers. According to one embodiment of the invention, a semiconductor-on-insulator structure has a first layer including a semiconductor material, attached to a second layer including a glass or glass-ceramic, with the strain point of the glass or glass-ceramic equal to or greater than about 800° C.
대표청구항
▼
What is claimed is: 1. A semiconductor-on-insulator structure, comprising: a first layer comprising a substantially single crystal semiconductor material; and a second layer comprising a glass or a glass-ceramic, wherein: the strain point of the glass or glass-ceramic is equal to or greater than 85
What is claimed is: 1. A semiconductor-on-insulator structure, comprising: a first layer comprising a substantially single crystal semiconductor material; and a second layer comprising a glass or a glass-ceramic, wherein: the strain point of the glass or glass-ceramic is equal to or greater than 850° C., the first and second layers are attached to one another either directly or through one or more intermediate layers, the glass or glass-ceramic includes: (i) a first substrate layer adjacent the first layer of substantially single-crystal semiconductor material, the first substrate layer having a reduced positive ion concentration in which substantially no modifier positive ions are present, and (ii) a second substrate layer adjacent the first substrate layer and having an enhanced positive ion concentration of modifier positive ions, including at least one alkaline earth modifier ion. 2. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic has a strain point of equal to or greater than 900° C. 3. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic has a strain point of less than 1050° C. 4. The semiconductor-on-insulator structure of claim 1, wherein the semiconductor material is a silicon-based semiconductor material. 5. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic is selected from the group consisting of an aluminosilicate glass; a borosilicate glass; an aluminoborosilicate glass; and a rare earth aluminosilicate glass. 6. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic is an aluminum phosphorus silicate glass. 7. The semiconductor-on-insulator structure of claim 6, wherein the glass or glass-ceramic is an aluminum phosphorus silicate glass having a composition comprising, calculated in mol percent and calculated from the batch on an oxide basis, of: 55-80 SiO2, 12-30 Al2O3, and 2-15 P2O5. 8. The semiconductor-on-insulator structure of claim 6, wherein the glass or glass-ceramic is an aluminum phosphorus silicate glass having a composition comprising, calculated in mol percent and calculated from the batch on an oxide basis, of: 50-70 SiO2, 15-25 Al2O3, and 5-10 P2O5. 9. The semiconductor-on-insulator structure of claim 6, wherein the glass or glass-ceramic is an lanthanum aluminum silicate glass having a composition comprising, calculated in mol percent and calculated from the batch on an oxide basis, of: 60-88 SiO2, 5-25 Al2O3, and 2-15 RE2O3, RE being selected from the rare earth element group consisting Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and mixtures thereof. 10. The semiconductor-on-insulator structure of claim 6, wherein the glass or glass-ceramic is an lanthanum aluminum silicate glass having a composition comprising, calculated in mol percent and calculated from the batch on an oxide basis, of: 60-75 SiO2, 15-20 Al2O3, and 4-15 RE2O3. 11. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic includes alkali ions or alkali earth ions. 12. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic is a glass-ceramic having a spinel, β-quartz, or β-spodumene crystal phase. 13. The semiconductor-on-insulator structure of claim 1, wherein the glass or glass-ceramic is a transparent silicate based glass-ceramic having a spinel crystal phase and having a composition comprising, in terms of weight percent on the oxide basis,: 45-70 SiO2, 14-28 Al2O3 , 4-13 ZnO, 0-8 MgO, 0-10 TiO2 , 0-10 ZrO2 , 0-15 Cs2O, 0-5 BaO, ZnO+MgO in combination being greater than or equal to about 8, and TiO2+ZrO2 in combination being greater than about 4. 14. The semiconductor-on-insulator structure of claim 1, wherein the bond strength between the first and second layers is at least 8 J/m2. 15. The semiconductor-on-insulator structure of claim 1, wherein the second layer (i) has first and second substantially parallel faces separated by a distance D2, the first face being closer to the first layer than the second face; (ii) has a reference surface which 1) is within the second layer, 2) is substantially parallel to the first face, and 3) is separated from that face by a distance D2/2; (iii) comprises positive ions of one or more types, each type of positive ion having a reference concentration Ci/Ref at the reference surface; and (iv) has a region (the positive ion depletion region) which begins at the first face and extends toward the reference surface in which the concentration of at least one type of positive ion is depleted relative to the reference concentration Ci/Ref for that ion. 16. The semiconductor-on-insulator structure of claim 15, wherein the region which begins at the first face and extends toward the reference surface has a distal edge, and wherein the second layer further has (i) a region (the pile-up region) in the vicinity of the distal edge in which the concentration of at least one type of positive ion is enhanced relative to Ci/Ref for that ion. 17. The semiconductor-on-insulator structure of claim 15, wherein the glass or the glass-ceramic comprises, and the positive ion depletion region is depleted of one or more of the alkali ions and the alkaline earth ions. 18. The semiconductor-on-insulator structure of claim 1, wherein the glass or the glass-ceramic comprises positive ions of one or more types, wherein the sum of lithium, sodium and potassium ions in the glass or glass-ceramic on an oxide basis is less than about 2 weight percent. 19. The semiconductor-on-insulator structure of claim 1, wherein the first layer has a maximum dimension greater than 10 cm. 20. The semiconductor-on-insulator structure of claim 1, wherein at least part of the structure comprises, in order: the semiconductor material; the semiconductor material with an enhanced oxygen content; the glass or glass ceramic material with a reduced positive ion concentration for at least one type of positive ion; the glass or glass ceramic material with an enhanced positive ion concentration for at least one type of positive ion; and the glass or glass ceramic. 21. The semiconductor-on-insulator structure of claim 1, wherein the first layer has a thickness of no greater than about 10 μm.
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