초록 ▼

A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment,

A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

대표청구항 ▼

We claim: 1. A stencil comprising: a stencil pattern having at least one stencilling opening formed therein: a first coating applied to one surface of the stencil pattern and one or more side surfaces of the stencilling openings and having a surface tension greater than the surface tension of the s

We claim: 1. A stencil comprising: a stencil pattern having at least one stencilling opening formed therein: a first coating applied to one surface of the stencil pattern and one or more side surfaces of the stencilling openings and having a surface tension greater than the surface tension of the stencil pattern; and a second coating applied to the opposite surface of the stencil pattern and having a surface tension less than the surface tension of the stencil pattern. 2. The stencil of claim 1, wherein the stencil pattern is stainless steel. 3. The stencil of claim 1, wherein the first coating is selected from the group comprising tungsten, tungsten carbide, tungsten nitride, nickel and nickel alloys. 4. The stencil of claim 1, wherein the second coating is a polymeric material. 5. The stencil of claim 1, wherein the stencilling opening corresponds to an adhesive pattern for an integrated circuit die. 6. The stencil of claim 1, wherein the second coating includes polytetrafloroethylene. 7. The stencil of claim 1, wherein the second coating includes a surface tension at least one order of magnitude less than surface tension of a metal. 8. The stencil of claim 1, wherein the second coating is to control a running property of an adhesive applied to the coated stencil. 9. The stencil of claim 8, wherein the stencilling opening receives the adhesive. 10. The stencil of claim 1, wherein the first coating includes tungsten. 11. The stencil of claim 10, wherein the first coating includes a nitride of tungsten. 12. The stencil of claim 1, wherein the surface tension of the stencil pattern includes a surface tension of 1384 dyne/cm at melting point. 13. The stencil of claim 1, wherein the first coating and the second coating are configured to control a running property of an adhesive applied onto the coated stencil. 14. A process for manufacturing a stencil for assisting in the application of a printable material comprising: forming a stencil pattern from a sheet of material impervious to the printable material and forming at least one stencilling opening therein; coating a top surface of the stencil pattern with a first coating having a surface tension greater than the surface tension of the stencil pattern; coating one or more side surfaces of the stencilling openings with the first coating having a surface tension greater than the surface tension of the stencil pattern; and coating the bottom surface of the stencil pattern with a second coating having a surface tension less than the surface tension of the stencil pattern. 15. The process of claim 14, wherein application of the printable material includes using a dockering tool to assist in spreading the printable material across the coated top surface of the stencil pattern and through the coated stencilling openings. 16. A stencil comprising: a metal stencil pattern including at least one stencilling opening formed therein, the stencil pattern includes a surface tension; a first coating applied to one surface of the stencil pattern and one or more side surfaces of the stencilling openings, the first coating is selected from the group comprising tungsten, tungsten carbide, tungsten nitride, nickel and nickel alloys, the first coating includes a surface tension greater than the surface tension of the stencil pattern; and a polymeric second coating applied to the opposite surface of the stencil pattern and having a surface tension less than the surface tension of the stencil pattern. 17. The stencil of claim 16, wherein the second coating includes polytetrafloroethylene. 18. The stencil of claim 16, wherein the second coating includes a surface tension at least one order of magnitude less than surface tension of a metal. 19. The stencil of claim 16, wherein the first coating includes tungsten. 20. The stencil of claim 16, wherein the stencil pattern includes stainless steel.