$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Process and assembly for non-destructive surface inspections 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0464766 (2006-08-15)
등록번호 US-7477371 (2009-01-13)
발명자 / 주소
  • Marxer,Norbert
  • Gross,Kenneth P.
  • Altendorfer,Hubert
  • Kren,George
출원인 / 주소
  • KLA Tencor Corporation
대리인 / 주소
    Davis Wright Tremaine LLP
인용정보 피인용 횟수 : 3  인용 특허 : 81

초록

A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies

대표청구항

What is claimed is: 1. An optical system for detecting contaminants and defects of a test surface comprising: a device providing a polarized light beam along a path at an oblique angle to the test surface, producing an illuminated spot thereon; a first and a second detector; a first collector havin

이 특허에 인용된 특허 (81)

  1. Steigmeier Edgar F. (Hedingen CHX) Auderset Heinrich (Horgen CHX), Apparatus and method for detecting defects and dust on a patterned surface.
  2. Smith Tennyson (Orem UT), Apparatus and process for performing ellipsometric measurements of surfaces.
  3. Satake, Toshihiko; Hosaka, Yukio, Apparatus for continuously measuring the degree of milling of grains.
  4. Kato Noboru (Hadano JPX) Horai Izuo (Odawara JPX) Kimura Toshihiro (Fujisawa JPX) Koizumi Mitsuyoshi (Yokohama JPX), Apparatus for detecting extraneous substances on a glass plate.
  5. Kramer Donald L. (Indian Harbor Springs FL), Apparatus for reflectance measurement of fluorescent radiation and composite useful therein.
  6. West Robert N. (Chislehurst GBX), Apparatus for separating specular from diffuse radiation.
  7. Malin Cosmas (Furstentum LIX) Steigmeier Edgar F. (Schweiz DEX) Nesensohn Thomas (Oesterreich DEX) Sawatzki Harry L. (Furstentum LIX) Auderset Heinrich (Schweiz DEX), Apparatus for surface inspection.
  8. Malin Comas (Mauren LIX) Steigmeier Edgar F. (Hedingen CHX) Nesensohn Thomas (Batschuns ATX) Sawatzki Harry L. (Schaan LIX) Auderset Heinrich (Aeugst CHX) Schmid Gert (Thringen CHX), Apparatus for surface inspections.
  9. Steigmeier Edgar F. (Hedingen CHX) Knop Karl (Zurich CHX), Defect detection system.
  10. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  11. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  12. Almogy, Gilad; Goldberg, Boris; Naftali, Ron, Defect detection with enhanced dynamic range.
  13. Sopori Bhushan L. (Denver CO), Defect mapping system.
  14. Louderback Anthony W. (Ojai CA), Device for measurement of optical scattering.
  15. Tsuji Toshihiko (Atsugi JPX) Saito Kenji (Yokohama JPX), Fine structure evaluation apparatus and method.
  16. Piwonka-Corle Timothy R. (Portland OR) Scoffone Karen F. (Redwood City CA) Chen Xing (San Jose CA) Lacomb ; Jr. Lloyd J. (Santa Clara CA) Stehle Jean-Louis (Colombes FRX) Zahorski Dorian (Vanves FRX), Focused beam spectroscopic ellipsometry method and system.
  17. Shiba Masataka (Yokohama JPX) Uto Sachio (Yokohama JPX) Koizumi Mitsuyoshi (Yokohama JPX), Foreign particle detecting method and apparatus.
  18. Uehara, Makoto; Sudo, Takeshi; Kanatani, Fujio, Horizontal position detecting device.
  19. Katzir Yigal (Holon ILX), Illumination system and inspection apparatus including same.
  20. Hayano Fuminori (Kamakura JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX), Inspecting apparatus for determining presence and location of foreign particles on reticles or pellicles.
  21. Tsuji Toshihiko (Ayase JPX) Takeuchi Seiji (Kawasaki JPX) Miyazaki Kyoichi (Mitaka JPX) Yoshii Minoru (Tokyo JPX) Nose Noriyuki (Atsugi JPX) Mori Tetsuzo (Atsugi JPX), Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern.
  22. Yatsugake Yasuo,JPX ; Okawa Takashi,JPX ; Mizutani Norihiko,JPX ; Iizuka Shigeharu,JPX, Inspection method and device of wafer surface.
  23. Lin Lawrence H. (Alamo CA) Cavan Daniel L. (Woodside CA) Howe Robert B. (San Jose CA), Inspection system for array of microcircuit dies having redundant circuit patterns.
  24. Morioka Hiroshi (Ebina JPX) Noguchi Minori (Yokohama JPX) Ohshima Yoshimasa (Yokohama JPX) Kembo Yukio (Yokohama JPX) Nishiyama Hidetoshi (Fujisawa JPX) Matsuoka Kazuhiko (Gunma JPX) Shigyo Yoshiharu, Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process.
  25. Tycko Daniel H. (Stony Brook NY), Method and apparatus for determining the volume & index of refraction of particles.
  26. Eremin Yuri A.,RUX ; Stover John C. ; Scheer Craig A., Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light.
  27. Koizumi Mitsuyoshi (Yokohama JPX) Akiyama Nobuyuki (Yokohama JPX) Oshima Yoshimasa (Yokohama JPX), Method and apparatus for inspecting specimen surface.
  28. Okada Saburo (Kure JPX) Sumimoto Tetsuhiro (Kure JPX) Imade Masaaki (Kure JPX) Miyauchi Hidekazu (Kure JPX), Method and apparatus for inspecting surface conditions.
  29. Amir Israel (Ewing NJ) Higgins Frank P. (Ewing NJ), Method and apparatus for inspection of substrates.
  30. Sun James J., Method and apparatus for surface inspection in a chamber.
  31. Steigmeier Edgar F. (Hedingen CHX) Auderset Heinrich (Horgen CHX), Method for determining the phase of phase transformable light scattering material.
  32. Steigmeier Edgar F. (Hedingen CHX) Auderset Heinrich (Horgen CHX), Method for determining the quality of light scattering material.
  33. Koizumi Mitsuyoshi (Yokohama JPX) Ohshima Yoshimasa (Yokohama JPX) Tanaka Minoru (Yokohama JPX), Method of and apparatus for detecting foreign substances.
  34. Matsumoto Shunichi,JPX ; Shishido Hiroaki,JPX, Method of and apparatus for inspecting reticle for defects.
  35. Malin Cosmas (Mauren LIX) Hoyle Philip (Vaduz LIX), Method of calibrating scanners and arrangement for producing defined scattered light amplitudes.
  36. Yamaguchi Kazuo (Sagamihara JPX) Kuni Asahiro (Nakamachi JPX) Akiyama Nobuyuki (Yokohama JPX) Endo Juro (Kumagaya JPX), Method of inspecting microscopic surface defects.
  37. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), Microelectronics inspection system.
  38. Braden James J. (Endicott NY), Non-saturating temperature independent voltage output driver with adjustable down level.
  39. Lu Huizong, Optical apparatus for determining the height and tilt of a sample surface.
  40. Bowen Arlen J. (Rochester MN) Erickson David L. (Rochester MN) Jewell Daniel W. (Pine Island MN) Koka Venkat R. (Rochester MN), Optical inspection system utilizing wedge shaped spatial filter.
  41. Leslie Brian C. ; Nikoonahad Mehrdad ; Wells Keith B., Optical scanning system for surface inspection.
  42. Yasutake Masatoshi (Chiba JPX) Fujino Naohiko (Hyogo JPX), Optical scanning system utilizing an atomic force microscope and an optical microscope.
  43. Nikoonahad Mehrdad (Menlo Park CA) Rigg Philip R. (Saratoga CA) Wells Keith B. (Santa Cruz CA) Calhoun David S. (Mountain View CA), Optical wafer positioning system.
  44. Neukermans Armand P. (Palo Alto CA) Jann Peter C. (Santa Clara CA) Wolf Ralph (Palo Alto CA) Wolze David (San Jose CA) Stokowski Stanley (Danville CA), Particle detection on a patterned or bare wafer surface.
  45. Vaught John L. (Palo Alto CA) Neukermans Armand P. (Palo Alto CA) Keldermann Herman F. (Berkeley CA) Koenig Franklin R. (Palo Alto CA), Particle detection on patterned wafers and the like.
  46. Jann Peter C. (Santa Clara CA) Gross Kenneth P. (San Carlos CA) Neukermans Armand P. (Palo Alto CA), Particle detector for rough surfaces.
  47. Hamashima Muneki (Tokyo JPX) Kato Kinya (Tokyo JPX), Pattern position detection apparatus using laser beam.
  48. Ido Satoshi (Tokorozawa JPX) Fujinami Minpei (Iruma JPX) Kato Yasuo (Zama JPX) Sakitani Yoshio (Iruma JPX) Ozasa Susumu (Kashiwa JPX), Position detecting system.
  49. Marxer Norbert,LIX ; Gross Kenneth P. ; Altendorfer Hubert ; Kren George, Process and assembly for non-destructive surface inspections.
  50. Marxer, Norbert; Gross, Kenneth P.; Altendorfer, Hubert; Kren, George, Process and assembly for non-destructive surface inspections.
  51. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  52. Brunsting Albert (Miramar FL) Hogg Walter R. (South Miami FL), Radiant energy reradiating flow cell system and method.
  53. Lehrer Leo K. (1004 Berlin Rd. Cherry Hill NJ 08034), Reflection densitometer with ellipsoid reflection surface.
  54. Mehdi Vaez-Iravani ; Stanley Stokowski ; Guoheng Zhao, Sample inspection system.
  55. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  56. Vaez-Iravani Mehdi ; Stokowski Stanley ; Zhao Guoheng, Sample inspection system.
  57. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  58. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  59. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  60. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  61. Galbraith, Lee K., Scanning contaminant and defect detector.
  62. Tanaka Tsuyoshi (Yokohama JPX) Aoki Satoshi (Chigasaki JPX) Fukuda Kazuyuki (Ibaraki JPX), Semiconductor laser module with lens holder compensating for thermal stress.
  63. Nakashige Yukiko (Hyogo JPX) Nishioka Tadashi (Hyogo JPX), Semiconductor wafer inspection apparatus.
  64. Adachi Hitoshi,JPX ; Kurachi Yasuo,JPX ; Ueda Eiichi,JPX ; Sasaki Takayuki,JPX, Silver halide photographic light sensitive material.
  65. Vaez-Iravani Mehdi, Single laser bright field and dark field system for detecting anomalies of a sample.
  66. Alumot David,ILX ; Neumann Gad,ILX ; Sherman Rivka,ILX ; Tirosh Ehud,ILX, Substrate inspection method and apparatus.
  67. Knollenberg Robert G. (Boulder CO), Surface analysis system and method.
  68. Quackenbos George S. (Newburyport MA) Ormsby Jay L. (Salem NH) Chase Eric T. (Andover MA) Broude Sergey V. (Acton MA) Nishine Koichi (Westford MA), Surface defect detection and confirmation system and method.
  69. Allen Nicholas (Bedford MA) Broudour Abdu (West Newton MA) Broude Sergey (Newton Centre MA) Chase Eric (Carlisle MA) Johnson Carl (Tewksbury MA) Miller Pascal (North Chelmsford MA) Ormsby Jay (Salem , Surface displacement detection and adjustment system.
  70. Miura Seiya (Utsunomiya JPX) Kohno Michio (Utsunomiya JPX), Surface inspecting device.
  71. Sekine Akihiko,JPX ; Iwa Yoichiro,JPX ; Soma Hiroaki,JPX ; Miki Naoto,JPX ; Isozaki Hisashi,JPX ; Yoshino Hisakazu,JPX, Surface inspection apparatus.
  72. Clementi Lee D. ; Fossey Michael E., Surface inspection system and method of inspecting surface of workpiece.
  73. Allen Nicholas C. (Bedford MA) Broude Sergey V. (Newton Centre MA) Chase Eric T. (Nashua NH) Miller Pascal (North Chelmsford MA) Ormsby Jay L. (Salem NH) Rostaing Bruno (Medford MA) Quackenbos Lloyd , Surface pit and mound detection and discrimination system and method.
  74. Quackenbos George S. (Newburyport MA) Ormsby Jay L. (Salem NH) Chase Eric T. (Andover MA) Broude Sergey V. (Acton MA) Nishine Koichi (Westford MA), Surface pit detection system and method.
  75. Gross Kenneth P. (San Carlos CA) Kren George J. (Los Altos Hills CA) Bevis Christopher F. (San Francisco CA), Surface scanner with thin film gauge.
  76. Ohshima Ken (Tokyo JPX) Sakamoto Masaharu (Tokyo JPX), System for checking defects on a flat surface of an object.
  77. Biellak, Steve; Stokowski, Stanley E.; Vaez-Iravani, Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  78. Vaez-Iravani, Mehdi; Stokowski, Stan; Biellak, Steven; Sullivan, Jamie; Wells, Keith; Nikoonahad, Mehrdad, Systems and methods for simultaneous or sequential multi-perspective specimen defect inspection.
  79. Aiyer, Arun Ananth, Wafer inspection apparatus with unique illumination methodology and method of operation.
  80. Fossey Michael E. ; Stover John C., Wafer inspection system for distinguishing pits and particles.
  81. Fossey Michael E. ; Stover John C. ; Clementi Lee D., Wafer inspection system for distinguishing pits and particles.

이 특허를 인용한 특허 (3)

  1. Zhang, Wenwei, Dynamic range measurement and calculation of optical keyless entry sensor.
  2. Feiler, David; Haller, Kurt, Film thickness, refractive index, and extinction coefficient determination for film curve creation and defect sizing in real time.
  3. Toriumi, Yoichi, Light condensing unit, light condensing method, and optical detection system.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로